公开(公告)号：US20240347496A1

公开(公告)日：2024-10-17

申请号：US18604452

申请日：2024-03-13

Applicant: InnoLux Corporation

Inventor： Ker-Yih KAO ,  Wen-Hsiang LIAO ,  Ming-Hsien SHIH ,  Cheng-Tse TSAI ,  Yen-Fu LIU

IPC: H01L23/00 ,  H01L21/56 ,  H01L23/29 ,  H01L23/31

CPC classification number: H01L24/20 ,  H01L21/561 ,  H01L23/3128 ,  H01L24/19 ,  H01L24/95 ,  H01L21/568 ,  H01L23/295 ,  H01L2224/19 ,  H01L2224/2105 ,  H01L2224/211 ,  H01L2224/215 ,  H01L2224/95001 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01073 ,  H01L2924/04941

Abstract: An electronic device includes an electronic unit, an encapsulation layer surrounding the electronic unit, a circuit structure electrically connected to the electronic unit and a bonding component. The circuit structure includes a first metal layer electrically connected to the electronic unit, a first dielectric layer disposed on the first metal layer and having an opening and a second metal layer disposed in the opening. The bonding component overlaps the second metal layer, and at least partially disposed in the opening. In cross-sectional view, a first height between a first dielectric layer top surface and a first metal layer top surface is greater than a second height between a second metal layer top surface and the first metal layer top surface. A difference between the first height and the second height is greater than or equal to 1 μm and less than or equal to 15 μm.

公开(公告)号：US20240332158A1

公开(公告)日：2024-10-03

申请号：US18598066

申请日：2024-03-07

Applicant: InnoLux Corporation

Inventor： Ker-Yih KAO ,  Yen-Fu LIU ,  Wen-Hsiang LIAO ,  Te-Hsun LIN ,  Ju-Li WANG ,  Dong-Yan YANG ,  Ming-Hsien SHIH ,  Cheng-Tse TSAI

IPC: H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L21/683 ,  H01L23/00 ,  H01L23/31 ,  H01L25/16 ,  H01L25/18

CPC classification number: H01L23/49838 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/3128 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/16 ,  H01L25/18 ,  H01L2221/68345 ,  H01L2224/13105 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81005 ,  H01L2224/83005 ,  H01L2224/92125

Abstract: An electronic device is provided. The electronic device includes a chip, a redistribution structure, a contact pad, a buffer layer, and a first connection pad. The redistribution structure is electrically connected to the chip. The redistribution structure includes a metal pad, and the metal pad is disposed opposite to the chip. The contact pad is disposed on the metal pad. The buffer layer is disposed on the redistribution structure and includes an opening. The opening exposes at least a portion of the contact pad. The first connection pad is disposed on the contact pad and extends in the opening. Moreover, in a normal direction of the chip, the metal pad, the contact pad and the first connection pad overlap. A method of manufacturing an electronic device is also provided.