公开(公告)号：US11830833B2

公开(公告)日：2023-11-28

申请号：US17363018

申请日：2021-06-30

Applicant: Innolux Corporation

Inventor： Chueh Yuan Nien ,  Chao-Chin Sung ,  Chia-Hung Hsieh ,  Mei Cheng Liu

IPC: H01L23/00 ,  H05K1/11 ,  H01L23/31 ,  H05K1/18 ,  H01L25/16

CPC classification number: H01L24/05 ,  H01L23/3192 ,  H01L25/162 ,  H01L25/167 ,  H05K1/111 ,  H05K1/181 ,  H01L24/32 ,  H01L2224/0502 ,  H01L2224/05013 ,  H01L2224/05073 ,  H01L2224/05553 ,  H01L2224/05564 ,  H01L2224/05573 ,  H01L2224/32145 ,  H01L2224/32227 ,  H01L2924/12041 ,  H01L2924/1426 ,  H01L2924/35121 ,  H05K2201/0989 ,  H05K2201/10106 ,  H05K2201/10522

Abstract: An electronic substrate and an electronic device are provided. The electronic substrate includes a base, a protruding portion, and a bonding pad. The protruding portion and the bonding pad are disposed on the base. The bonding pad is not overlapped with a boundary of the protruding portion.

公开(公告)号：US20240047393A1

公开(公告)日：2024-02-08

申请号：US18489871

申请日：2023-10-19

Applicant: Innolux Corporation

Inventor： Chueh Yuan Nien ,  Chao-Chin Sung ,  Chia-Hung Hsieh ,  Mei Cheng Liu

IPC: H01L23/00 ,  H01L25/16 ,  H05K1/11 ,  H01L23/31 ,  H05K1/18

CPC classification number: H01L24/05 ,  H01L25/162 ,  H05K1/111 ,  H01L23/3192 ,  H05K1/181 ,  H01L25/167 ,  H01L2924/35121 ,  H01L24/32 ,  H01L2224/32145 ,  H01L2224/32227 ,  H01L2224/05073 ,  H01L2224/0502 ,  H01L2224/05573 ,  H01L2224/05564 ,  H01L2224/05553 ,  H01L2224/05013 ,  H01L2924/12041 ,  H01L2924/1426 ,  H05K2201/10522 ,  H05K2201/0989 ,  H05K2201/10106

Abstract: An electronic substrate and an electronic device are provided. The electronic substrate includes a base, a conductive electrode, and a first layer. The conductive electrode and the first layer are disposed on the base, the first layer surrounds the conductive electrode and overlaps an edge portion of the conductive electrode. In a cross-sectional view, the first layer is divided into a first part and a second part, the conductive electrode is located between the first part and the second part, and a width of the first part is different from a width of the second part.

公开(公告)号：US20220028809A1

公开(公告)日：2022-01-27

申请号：US17363018

申请日：2021-06-30

Applicant: Innolux Corporation

Inventor： Chueh Yuan Nien ,  Chao-Chin Sung ,  Chia-Hung Hsieh ,  Mei Cheng Liu

IPC: H01L23/00 ,  H01L25/16 ,  H05K1/11 ,  H01L23/31 ,  H05K1/18

Abstract: An electronic substrate and an electronic device are provided. The electronic substrate includes a base, a protruding portion, and a bonding pad. The protruding portion and the bonding pad are disposed on the base. The bonding pad is not overlapped with a boundary of the protruding portion.