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公开(公告)号：US20190102331A1
公开(公告)日：2019-04-04
申请号：US15719742
申请日：2017-09-29
Applicant: Intel Corporation
Inventor： Xiang LI , Yunhui CHU , Jun LIAO , George VERGIS , James A. McCALL , Charles C. PHARES , Konika GANGULY , Qin LI
CPC classification number: G06F13/1694 , G06F1/185 , G11C5/04 , G11C5/06 , G11C5/063 , G11C7/10 , H01R12/73
Abstract: A method is described. The method includes receiving DDR memory channel signals from a motherboard through a larger DIMM motherboard connector. The method includes routing the signals to one of first and second smaller form factor connectors. The method includes sending the DDR memory channel signals to a DIMM that is connected to the one of the first and second smaller form factor connectors.
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公开(公告)号：US20180007788A1
公开(公告)日：2018-01-04
申请号：US15201312
申请日：2016-07-01
Applicant: Intel Corporation
Inventor： Charles C. PHARES , Kevin J. CEURTER
CPC classification number: H05K1/148 , H01R12/7076 , H01R12/737 , H01R13/703 , H05K1/141 , H05K3/366 , H05K5/0004 , H05K5/0017 , H05K5/0069 , H05K5/0217 , H05K2201/10159 , H05K2201/10189
Abstract: Techniques and mechanisms to provide a connector for securing to a first printed circuit board (PCB). In an embodiment, the connector is configured to receive a second PCB, where a first hardware interface of the connector includes conductors to facilitate bilateral decoupling from (and coupling to) respective hardware interfaces of the first PCB and the second PCB. A first conductor of the first hardware interface includes a first portion configured to move, relative to a housing structure of the connector, in response to the connector receiving a portion of a device which comprises the second PCB. A second portion of the first conductor is configured to be brought into contact with a conductive pad of the device. In another embodiment, the connector includes housing structures configured to move relative to one another while the connector is secured to the first PCB.
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