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公开(公告)号:US20240260233A1
公开(公告)日:2024-08-01
申请号:US18565880
申请日:2021-11-11
Applicant: Intel Corporation
Inventor: Ming Zhang , Yuehong Fan , Peng Wei , Chuanlou Wang , Rajiv K. Mongia , Guocheng Zhang , Yingqiong Bu , Berhanu Wondimu , Guixiang Tan , Xiang Que , Qing Jiang , Liu Yu , Wei-Ming Chu , Chen Zhang , Hao Zhou , Feng Qi , Catharina Biber , Devdatta Prakash Kulkarni , Xiang Li , Yechi Zhang
IPC: H05K7/20 , G06F1/20 , H01L23/40 , H01L23/427 , H01L23/473
CPC classification number: H05K7/20336 , G06F1/20 , H01L23/4093 , H01L23/427 , H01L23/473 , G06F2200/201
Abstract: Heat pipes and vapor chambers that are components of a DIMM cooling assembly are described.