公开(公告)号：US20200245511A1

公开(公告)日：2020-07-30

申请号：US15754957

申请日：2015-09-25

Applicant: Intel Corporation

Inventor： Devdatta P. KULKARNI ,  Richard J. DISCHLER

IPC: H05K7/20 ,  H05K1/02 ,  H05K1/18

Abstract: The present disclosure describes embodiments of apparatuses and methods related to a computing apparatus with a closed cooling loop thermally coupled to one or more processors disposed on a circuit board of the computing apparatus. The closed cooling loop circulates a dielectric fluid to absorb heat from the processor. A portion of the dielectric fluid is evaporated from the processor heat absorbed by the dielectric fluid. A heat exchanger is coupled to the circuit board and thermally coupled to the closed cooling loop. The heat exchanger is to include a coolant flow to remove heat from the dielectric fluid circulated through the portion of the closed cooling loop thermally coupled to the heat exchanger. A vapor portion of the dielectric fluid is condensed from the heat removed by the coolant flow. Other embodiments may be described and/or claimed.

公开(公告)号：US20180316375A1

公开(公告)日：2018-11-01

申请号：US15769723

申请日：2015-12-08

Applicant: Intel Corporation

Inventor： Telesphor KAMGAING ,  Richard J. DISCHLER

IPC: H04B1/18 ,  H01L23/498 ,  H01L25/16 ,  H01P5/08 ,  H01P3/16 ,  H01L23/66 ,  H01P1/24 ,  H01L23/367 ,  H01L25/065 ,  H05K1/18 ,  H05K1/14

CPC classification number: G06F1/16 ,  H05K1/0274 ,  H05K1/147 ,  H05K2201/045 ,  H05K2201/046

Abstract: Wireless interconnects are shown on flexible cables for communication between computing platforms. One example has an integrated circuit chip, a package substrate to carry the integrated circuit chip, the package substrate having conductive connectors to connect the integrated circuit chip to external components, a cable on the package substrate coupled to the integrated circuit chip at one end, a radio chip on the cable coupled to the cable at the other end, the radio chip to modulate data over a carrier and to transmit the modulated data, and a waveguide transition coupled to a dielectric waveguide to receive the transmitted modulated data from the radio and to couple it into the waveguide, the waveguide to carry the modulated data to an external component.

公开(公告)号：US20200066641A1

公开(公告)日：2020-02-27

申请号：US16305012

申请日：2016-07-02

Applicant: Intel Corporation

Inventor： Kemal AYGUN ,  Richard J. DISCHLER ,  Jeff C. MORRISS ,  Zhiguo QIAN ,  Wilfred GOMES ,  Yu Amos ZHANG ,  Ram S. VISWANATH ,  Rajasekaran SWAMINATHAN ,  Sriram SRINIVASAN ,  Yidnekachew S. MEKONNEN ,  Sanka GANESAN ,  Eduard ROYTMAN ,  Mathew J. MANUSHAROW

IPC: H01L23/538 ,  H01L25/065 ,  H01L23/522 ,  H01L23/528 ,  H01L23/00 ,  H01L23/60

Abstract: Integrated circuit (IC) chip die to die channel interconnect configurations (systems and methods for their manufacture) may improve signaling to and through a single ended bus data signal communication channel by including on-die induction structures; on-die interconnect features; on-package first level die bump designs and ground webbing structures; on-package high speed horizontal data signal transmission lines; on-package vertical data signal transmission interconnects; and/or on-package electro-optical (EO) connectors in various die to die interconnect configurations for improved signal connections and transmission through a data signal channel extending through one or more semiconductor device package devices, that may include an electro-optical (EO) connector upon which at least one package device may be mounted, and/or be semiconductor device packages in a package-on-package configuration.