公开(公告)号：US20160225707A1

公开(公告)日：2016-08-04

申请号：US14778128

申请日：2014-12-16

Applicant: Intel Corporation

Inventor： Huiyang FEI ,  Prasanna RAGHAVAN

IPC: H01L23/498 ,  H01L23/00 ,  H01L25/00 ,  H01L23/29 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L25/065

CPC classification number: H01L23/49833 ,  H01L21/4853 ,  H01L21/565 ,  H01L23/13 ,  H01L23/16 ,  H01L23/293 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49883 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/1703 ,  H01L2224/17181 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/14 ,  H01L2924/1436 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/3511 ,  H01L2924/37001 ,  H01L2924/384 ,  H01L2924/014 ,  H01L2924/00014

Abstract: The electronic package includes a substrate and an electronic component mounted to a surface of the substrate. An interposer is mounted to the surface of the substrate such that the interposer surrounds the electronic component and is electrically connected to the substrate. An over-mold covers the electronic component. In other forms, the example electronic package may be incorporated into an electronic assembly. The electronic assembly further includes a second electronic component mounted to the interposer. As an example, the second electronic component may be mounted to the interposer using solder bumps. It should be noted that any technique that is known now, or discovered in the future, may be used to mount the second electronic component to the interposer.

Abstract translation: 电子封装包括基板和安装到基板的表面的电子部件。 插入器安装到基板的表面，使得插入件围绕电子部件并且电连接到基板。 一个覆盖模具覆盖电子元件。 在其他形式中，示例性电子封装可以并入到电子组件中。 电子组件还包括安装到插入器的第二电子部件。 作为示例，第二电子部件可以使用焊料凸块安装到插入器。 应当注意，现在已知或将来发现的任何技术可以用于将第二电子部件安装到插入器。