公开(公告)号：US10886153B2

公开(公告)日：2021-01-05

申请号：US16224550

申请日：2018-12-18

Applicant: Intel Corporation

Inventor： Peter L. Chang ,  Chytra Pawashe ,  Michael C. Mayberry ,  Jia-Hung Tseng

IPC: H01L21/67 ,  H01L23/00 ,  H01L33/00 ,  H01L21/683 ,  H01L25/075 ,  H01L33/36 ,  H01L33/44 ,  H01L33/62

Abstract: Micro pick-and-bond heads, assembly methods, and device assemblies. In, embodiments, micro pick-and-bond heads transfer micro device elements, such as (micro) LEDs, en masse from a source substrate to a target substrate, such as a LED display substrate. Anchor and release structures on the source substrate enable device elements to be separated from a source substrate, while pressure sensitive adhesive (PSA) enables device elements to be temporarily affixed to pedestals of a micro pick-and bond head. Once the device elements are permanently affixed to a target substrate, the PSA interface may be defeated through peeling and/or thermal decomposition of an interface layer.

公开(公告)号：US20190148188A1

公开(公告)日：2019-05-16

申请号：US16224550

申请日：2018-12-18

Applicant: Intel Corporation

Inventor： Peter L. Chang ,  Chytra Pawashe ,  Michael C. Mayberry ,  Jia-Hung Tseng

IPC: H01L21/67 ,  H01L23/00 ,  H01L33/36 ,  H01L21/683 ,  H01L25/075 ,  H01L33/00 ,  H01L33/62 ,  H01L33/44

Abstract: Micro pick-and-bond heads, assembly methods, and device assemblies. In, embodiments, micro pick-and-bond heads transfer micro device elements, such as (micro) LEDs, en masse from a source substrate to a target substrate, such as a LED display substrate. Anchor and release structures on the source substrate enable device elements to be separated from a source substrate, while pressure sensitive adhesive (PSA) enables device elements to be temporarily affixed to pedestals of a micro pick-and bond head. Once the device elements are permanently affixed to a target substrate, the PSA interface may be defeated through peeling and/or thermal decomposition of an interface layer.

公开(公告)号：US10242892B2

公开(公告)日：2019-03-26

申请号：US15512342

申请日：2014-10-17

Applicant: Intel Corporation

Inventor： Peter L. Chang ,  Chytra Pawashe ,  Michael C. Mayberry ,  Jia-Hung Tseng

IPC: H01L21/67 ,  H01L23/00 ,  H01L21/683 ,  H01L25/075 ,  H01L33/00 ,  H01L33/36 ,  H01L33/44 ,  H01L33/62

Abstract: Micro pick-and-bond heads, assembly methods, and device assemblies. In, embodiments, micro pick-and-bond heads transfer micro device elements, such as (micro) LEDs, en masse from a source substrate to a target substrate, such as a LED display substrate. Anchor and release structures on the source substrate enable device elements to be separated from a source substrate, while pressure sensitive adhesive (PSA) enables device elements to be temporarily affixed to pedestals of a micro pick-and-bond head. Once the device elements are permanently affixed to a target substrate, the PSA interface may be defeated through peeling and/or thermal decomposition of an interface layer.

公开(公告)号：US10204808B2

公开(公告)日：2019-02-12

申请号：US15512342

申请日：2014-10-17

Applicant: Intel Corporation

Inventor： Peter L. Chang ,  Chytra Pawashe ,  Michael C. Mayberry ,  Jia-Hung Tseng

IPC: H01L21/67 ,  H01L23/00 ,  H01L21/683 ,  H01L25/075 ,  H01L33/00 ,  H01L33/36 ,  H01L33/44 ,  H01L33/62

Abstract: Micro pick-and-bond heads, assembly methods, and device assemblies. In, embodiments, micro pick-and-bond heads transfer micro device elements, such as (micro) LEDs, en masse from a source substrate to a target substrate, such as a LED display substrate. Anchor and release structures on the source substrate enable device elements to be separated from a source substrate, while pressure sensitive adhesive (PSA) enables device elements to be temporarily affixed to pedestals of a micro pick-and-bond head. Once the device elements are permanently affixed to a target substrate, the PSA interface may be defeated through peeling and/or thermal decomposition of an interface layer.

公开(公告)号：US09420700B2

公开(公告)日：2016-08-16

申请号：US14882133

申请日：2015-10-13

Applicant: Intel Corporation

Inventor： Gerrit J Vreman ,  Tom E Pearson ,  Peter L Chang ,  Jia-Hung Tseng

IPC: H01L21/00 ,  H05K3/30 ,  H01L31/18 ,  G06F3/042 ,  H01L31/12 ,  H01L31/02 ,  H01L23/495 ,  H01L21/56 ,  H01L23/00

CPC classification number: H05K3/30 ,  G06F3/0421 ,  G06F2203/04109 ,  H01L21/561 ,  H01L21/568 ,  H01L23/49541 ,  H01L23/49551 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/92 ,  H01L24/97 ,  H01L31/02005 ,  H01L31/12 ,  H01L31/125 ,  H01L31/18 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  Y10T29/49002 ,  Y10T29/4913 ,  H01L2924/00012 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An optical touchscreen assembly may employ a photonic chip packaged with a chip surface at an angle inclined between horizontal and vertical orientations. An inclined paddle sawn flat no-leads (IPSFN) package may be affixed to a cover glass surface along a perimeter of a display. IPSFN packages may incorporate a photo-emitter chip and a photo-detector chip that may be inclined for a desired angle of incidence relative to the cover glass. A CMOS integrated optical transceiver package may include inclined photonic chips and a non-inclined CMOS chip having at least one of a photo-emitter driver, or a photo-detector TIA and/or ADC. A chip package lead frame may include cantilevered paddle tabs amenable to controlled deflection during package assembly. An inclined packaging assembly method may include attaching a chip to a lead frame paddle and form pressing the lead frame to incline the chip to a desired angle before encapsulation.