公开(公告)号：US20240292539A1

公开(公告)日：2024-08-29

申请号：US18113414

申请日：2023-02-23

Applicant: Intel Corporation

Inventor： Juha Paavola ,  Justin M Huttula ,  Sami Heinisuo ,  Kari Mansukoski

IPC: H05K1/14 ,  H05K3/36

CPC classification number: H05K1/141 ,  H05K3/368 ,  H05K2201/10378

Abstract: An electronic device and associated methods are disclosed. In one example, the electronic device includes a standoff interposer between an overlapping portion of a first circuit board and a second circuit board. In selected examples, electronic devices and methods described show one or more conductive pathways within a standoff interposer that provide electrical communication between circuit boards, such as data signals, power delivery, etc.

公开(公告)号：US11656247B2

公开(公告)日：2023-05-23

申请号：US16473378

申请日：2017-03-31

Applicant: Intel Corporation

Inventor： Ronald Michael Kirby ,  Erkan Acar ,  Joe Walczyk ,  Youngseok Oh ,  Justin M Huttula ,  Mohanraj Prabhugoud

IPC: G01R1/07 ,  G01R1/04 ,  G01R1/073

CPC classification number: G01R1/07357 ,  G01R1/0466

Abstract: A coaxial wire interconnect architecture and associated methods are described. In one example, the coaxial wire interconnect architecture is used in a test socket interconnect array. Flexible bends are formed in one or more of the coaxial wire interconnects to provide compliant connections to an electronic device during testing.