公开(公告)号：US20180226381A1

公开(公告)日：2018-08-09

申请号：US15863821

申请日：2018-01-05

Applicant: Intel Corporation

Inventor： KYU-OH LEE ,  ISLAM A. SALAMA ,  RAM S. VISWANATH ,  ROBERT L. SANKMAN ,  BABAK SABI ,  SRI CHAITRA JYOTSNA CHAVALI

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/498

Abstract: Disclosed herein are integrated circuit (IC) structures having recessed conductive contacts for package on package (PoP). For example, an IC structure may include: an IC package having a first resist surface; a recess disposed in the first resist surface, wherein a bottom of the recess includes a second resist surface; a first plurality of conductive contacts located at the first resist surface; and a second plurality of conductive contacts located at the second resist surface. Other embodiments may be disclosed and/or claimed.

公开(公告)号：US20170207196A1

公开(公告)日：2017-07-20

申请号：US15038008

申请日：2015-06-25

Applicant: Intel Corporation

Inventor： KYU-OH LEE ,  ISLAM A. SALAMA ,  RAM S. VISWANATH ,  ROBERT L. SANKMAN ,  BABAK SABI ,  SRI CHAITRA JYOTSNA CHAVALI

IPC: H01L25/065 ,  H01L23/498 ,  H01L23/00

CPC classification number: H01L25/0657 ,  H01L23/13 ,  H01L23/48 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/05 ,  H01L24/11 ,  H01L24/17 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/05147 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2225/06517 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/15311

Abstract: Disclosed herein are integrated circuit (IC) structures having recessed conductive contacts for package on package (PoP). For example, an IC structure may include: an IC package having a first resist surface; a recess disposed in the first resist surface, wherein a bottom of the recess includes a second resist surface; a first plurality of conductive contacts located at the first resist surface; and a second plurality of conductive contacts located at the second resist surface. Other embodiments may be disclosed and/or claimed

公开(公告)号：US20170170109A1

公开(公告)日：2017-06-15

申请号：US15038001

申请日：2015-06-25

Applicant: Intel Corporation

Inventor： KYU-OH LEE ,  ISLAM A. SALAMA

IPC: H01L23/498 ,  H01L23/66 ,  H01L21/48 ,  H01L23/00

CPC classification number: H01L23/49838 ,  H01L21/4853 ,  H01L21/4857 ,  H01L23/13 ,  H01L23/48 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/50 ,  H01L23/5385 ,  H01L23/66 ,  H01L24/16 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2223/6666 ,  H01L2224/16157 ,  H01L2224/16197 ,  H01L2224/16225 ,  H01L2924/1205 ,  H01L2924/15311

Abstract: Disclosed herein are integrated circuit (IC) structures having interposers with recesses. For example, an IC structure may include: an interposer having a resist surface; a recess disposed in the resist surface, wherein a bottom of the recess is surface-finished; and a plurality of conductive contacts located at the resist surface. Other embodiments may be disclosed and/or claimed.