公开(公告)号：US20210313988A1

公开(公告)日：2021-10-07

申请号：US17354473

申请日：2021-06-22

Applicant: Intel Corporation

Inventor： Scott Weber ,  Aravind Dasu ,  Ravi Gutala ,  Mahesh Iyer ,  Eriko Nurvitadhi ,  Archanna Srinivasan ,  Sean Atsatt ,  James Ball

IPC: H03K19/17736 ,  H03K19/1776 ,  H03K19/17768 ,  H01L25/18

Abstract: A three dimensional circuit system includes first and second integrated circuit (IC) dies. The first IC die includes programmable logic circuits arranged in sectors and first programmable interconnection circuits having first router circuits. The second IC die includes non-programmable circuits arranged in regions and second programmable interconnection circuits having second router circuits. Each of the regions in the second IC die is vertically aligned with at least one of the sectors in the first IC die. Each of the second router circuits is coupled to one of the first router circuits through a vertical die-to-die connection. The first and second programmable interconnection circuits are programmable to route signals between the programmable logic circuits and the non-programmable circuits through the first and second router circuits. The circuit system may include additional IC dies. The first and second IC dies and any additional IC dies are coupled in a vertically stacked configuration.

公开(公告)号：US20210013887A1

公开(公告)日：2021-01-14

申请号：US17033524

申请日：2020-09-25

Applicant: Intel Corporation

Inventor： Sharath Raghava ,  Ankireddy Nalamalpu ,  Dheeraj Subbareddy ,  Harsha Gupta ,  James Ball ,  Kavitha Prasad ,  Sean R. Atsatt

IPC: H03K19/17736 ,  H03K19/17796 ,  H04L12/24

Abstract: Techniques described herein may relate to providing a programmable interconnect network (e.g., a programmable network-on-chip (NOC)). A method may include determining a transmission parameter, bonding one or more channels of an interconnect network based at least in part on the transmission parameter, and power-gating any unused channels after the bonding.

公开(公告)号：US11700002B2

公开(公告)日：2023-07-11

申请号：US17556917

申请日：2021-12-20

Applicant: Intel Corporation

Inventor： Sharath Raghava ,  Ankireddy Nalamalpu ,  Dheeraj Subbareddy ,  Harsha Gupta ,  James Ball ,  Kavitha Prasad ,  Sean R. Atsatt

IPC: H04L12/28 ,  H03K19/17736 ,  H03K19/17796 ,  H04L41/5019 ,  H04L41/5003

CPC classification number: H03K19/17736 ,  H03K19/17796 ,  H04L41/5019 ,  H04L41/5003

Abstract: Techniques described herein may relate to providing a programmable interconnect network (e.g., a programmable network-on-chip (NOC)). A method may include determining a transmission parameter, bonding one or more channels of an interconnect network based at least in part on the transmission parameter, and power-gating any unused channels after the bonding.

公开(公告)号：US20230056118A1

公开(公告)日：2023-02-23

申请号：US17893004

申请日：2022-08-22

Applicant: Intel Corporation

Inventor： Kevin Clark ,  Scott J. Weber ,  James Ball ,  Ravi Prakash Gutala ,  Aravind Raghavendra Dasu

IPC: H03K19/1776 ,  G11C7/10 ,  H01L25/065 ,  G11C5/02

Abstract: An integrated circuit device may include a programmable fabric die having programmable logic fabric and configuration memory that may configure the programmable logic fabric. The integrated circuit device may also include a base die that may provide fabric support circuitry, including memory and/or communication interfaces. The first die and the second die may be coupled using a multi-purpose interface that may allow communication between the first die and the second die. The multi-purpose interface may allow concurrent access to the base die by the programmable logic fabric and the configuration memory by using multiple channels over the multi-purpose interface.

公开(公告)号：US11489527B2

公开(公告)日：2022-11-01

申请号：US17354473

申请日：2021-06-22

Applicant: Intel Corporation

Inventor： Scott Weber ,  Aravind Dasu ,  Ravi Gutala ,  Mahesh Iyer ,  Eriko Nurvitadhi ,  Archanna Srinivasan ,  Sean Atsatt ,  James Ball

IPC: H03K19/17736 ,  H01L25/18 ,  H03K19/17768 ,  H03K19/1776

Abstract: A three dimensional circuit system includes first and second integrated circuit (IC) dies. The first IC die includes programmable logic circuits arranged in sectors and first programmable interconnection circuits having first router circuits. The second IC die includes non-programmable circuits arranged in regions and second programmable interconnection circuits having second router circuits. Each of the regions in the second IC die is vertically aligned with at least one of the sectors in the first IC die. Each of the second router circuits is coupled to one of the first router circuits through a vertical die-to-die connection. The first and second programmable interconnection circuits are programmable to route signals between the programmable logic circuits and the non-programmable circuits through the first and second router circuits. The circuit system may include additional IC dies. The first and second IC dies and any additional IC dies are coupled in a vertically stacked configuration.

公开(公告)号：US12237831B2

公开(公告)日：2025-02-25

申请号：US18198122

申请日：2023-05-16

Applicant: Intel Corporation

Inventor： Sharath Raghava ,  Ankireddy Nalamalpu ,  Dheeraj Subbareddy ,  Harsha Gupta ,  James Ball ,  Kavitha Prasad ,  Sean R. Atsatt

IPC: H03K19/177 ,  H03K19/17736 ,  H03K19/17796 ,  H04L41/5019 ,  H04L41/5003

Abstract: Techniques described herein may relate to providing a programmable interconnect network (e.g., a programmable network-on-chip (NOC)). A method may include determining a transmission parameter, bonding one or more channels of an interconnect network based at least in part on the transmission parameter, and power-gating any unused channels after the bonding.

公开(公告)号：US11342918B2

公开(公告)日：2022-05-24

申请号：US17033524

申请日：2020-09-25

Applicant: Intel Corporation

Inventor： Sharath Raghava ,  Ankireddy Nalamalpu ,  Dheeraj Subbareddy ,  Harsha Gupta ,  James Ball ,  Kavitha Prasad ,  Sean R. Atsatt

IPC: H03K19/177 ,  H03K19/17736 ,  H03K19/17796 ,  H04L41/5019 ,  H04L41/5003

Abstract: Techniques described herein may relate to providing a programmable interconnect network (e.g., a programmable network-on-chip (NOC)). A method may include determining a transmission parameter, bonding one or more channels of an interconnect network based at least in part on the transmission parameter, and power-gating any unused channels after the bonding.

公开(公告)号：US10666265B2

公开(公告)日：2020-05-26

申请号：US16146849

申请日：2018-09-28

Applicant: Intel Corporation

Inventor： Kevin Clark ,  Scott J. Weber ,  James Ball ,  Simon Chong ,  Ravi Prakash Gutala ,  Aravind Raghavendra Dasu ,  Jun Pin Tan

IPC: H03K19/173 ,  G06F7/38 ,  H03K19/1776 ,  H03K19/17768 ,  H03K19/17704 ,  H03K19/17758

Abstract: An integrated circuit device may include programmable logic fabric disposed on a first integrated circuit die and having configuration memory. The integrated circuit device may also include a base die that may provide memory and/or operating supporting circuitry. The first die and the second die may be coupled using a high-speed parallel interface. The interface may employ microbumps. The first die and the second die may also include controllers for the interface.

公开(公告)号：US20190140648A1

公开(公告)日：2019-05-09

申请号：US16235984

申请日：2018-12-28

Applicant: Intel Corporation

Inventor： Kevin Clark ,  Scott J. Weber ,  James Ball ,  Ravi Prakash Gutala ,  Aravind Raghavendra Dasu

IPC: H03K19/177 ,  H01L25/065 ,  G11C7/10

Abstract: An integrated circuit device may include a programmable fabric die having programmable logic fabric and configuration memory that may configure the programmable logic fabric. The integrated circuit device may also include a base die that may provide fabric support circuitry, including memory and/or communication interfaces. The first die and the second die may be coupled using a multi-purpose interface that may allow communication between the first die and the second die. The multi-purpose interface may allow concurrent access to the base die by the programmable logic fabric and the configuration memory by using multiple channels over the multi-purpose interface.

公开(公告)号：US11424744B2

公开(公告)日：2022-08-23

申请号：US17094612

申请日：2020-11-10

Applicant: Intel Corporation

Inventor： Kevin Clark ,  Scott J. Weber ,  James Ball ,  Ravi Prakash Gutala ,  Aravind Raghavendra Dasu

IPC: H03K19/1776 ,  G11C5/02 ,  G11C7/10 ,  H01L25/065

Abstract: An integrated circuit device may include a programmable fabric die having programmable logic fabric and configuration memory that may configure the programmable logic fabric. The integrated circuit device may also include a base die that may provide fabric support circuitry, including memory and/or communication interfaces. The first die and the second die may be coupled using a multi-purpose interface that may allow communication between the first die and the second die. The multi-purpose interface may allow concurrent access to the base die by the programmable logic fabric and the configuration memory by using multiple channels over the multi-purpose interface.