公开(公告)号：US20230097624A1

公开(公告)日：2023-03-30

申请号：US17484486

申请日：2021-09-24

申请人： Intel Corporation

发明人： Kyle McElhinny ,  Onur Ozkan ,  Ali Lehaf ,  Xiaoying Guo ,  Steve Cho ,  Leonel Arana ,  Jung Kyu Han ,  Srinivas Pietambaram ,  Sashi Kandanur ,  Alexander Aguinaga

IPC分类号： H01L23/498 ,  H01L23/00 ,  H01L23/12 ,  H01L25/065 ,  H01L21/48 ,  H01L21/50

摘要： Methods and apparatus to reduce defects in interconnects between semiconductor dies and package substrates are disclosed. An apparatus includes a substrate and a semiconductor die mounted to the substrate. The apparatus further includes an array of bumps to electrically couple the die to the substrate. Each of the bumps have a corresponding base. Different ones of the bases have different widths that vary spatially across the array of bumps.

公开(公告)号：US20230096835A1

公开(公告)日：2023-03-30

申请号：US17484519

申请日：2021-09-24

申请人： Intel Corporation

发明人： Kyle McElhinny ,  Bohan Shan ,  Hongxia Feng ,  Xiaoying Guo ,  Adam Schmitt ,  Jacob Vehonsky ,  Steve Cho ,  Leonel Arana

IPC分类号： H01L23/00 ,  H01L21/60 ,  H01L23/538

摘要： Methods and apparatus to reduce defects in interconnects between semiconductor dies and package substrates are disclosed. An apparatus includes a substrate and a semiconductor die mounted to the substrate. The apparatus further includes operational bridge bumps to electrically connect the die to a bridge within the substrate. The apparatus also includes dummy bumps adjacent the operational bridge bumps.

公开(公告)号：US20230095281A1

公开(公告)日：2023-03-30

申请号：US17484499

申请日：2021-09-24

申请人： Intel Corporation

发明人： Kyle McElhinny ,  Hongxia Feng ,  Xiaoying Guo ,  Steve Cho ,  Jung Kyu Han ,  Changhua Liu ,  Leonel Arana ,  Rahul Manepalli ,  Dingying Xu ,  Amram Eitan

IPC分类号： H01L23/00 ,  H01L21/60 ,  H01L23/488 ,  H01L23/538

摘要： Methods and apparatus to reduce defects in interconnects between semiconductor dies and package substrates are disclosed. An apparatus includes a substrate and a semiconductor die mounted to the substrate. The apparatus further includes bumps to electrically couple the die to the substrate. Ones of the bumps have corresponding bases. The bases have a shape that is non-circular.