OPTIMIZED PHASE CHANGE MEMORY STRUCTURE TO IMPROVE NUCLEATION TIME VARIATION

    公开(公告)号:US20230371408A1

    公开(公告)日:2023-11-16

    申请号:US17744374

    申请日:2022-05-13

    Abstract: Memory devices having optimized phase change memory (PCM) structures to improve nucleation time variation and methods for forming the phase change memory structures. The PCM structures are composed of layers including a first electrode layer, a PCM layer having a first interface with the first electrode layer comprising a first electrode/PCM interface, and a second electrode layer, having a second interface with the phase change material layer comprising a PCM/second electrode interface. The first electrode/PCM interface and the PCM/second electrode interface are non-flat and configured to reduce statistical variation of nucleation time. Techniques/processes for forming these interfaces include creating serrated or rough edges, forming patterned shapes, and attaching nanodots. The average contact angle of heterogenous nucleation is significantly reduced from the flat surface used in conventional PCM structures, enabling the new PCM structure to exhibit a more controlled nucleation time with less statistical variation.

    MULTISTAGE SET PROCEDURE FOR PHASE CHANGE MEMORY

    公开(公告)号:US20200035300A1

    公开(公告)日:2020-01-30

    申请号:US16593530

    申请日:2019-10-04

    Abstract: Phase change material can be set with a multistage set process. Set control logic can heat a phase change semiconductor material (PM) to a first temperature for a first period of time. The first temperature is configured to promote nucleation of a crystalline state of the PM. The control logic can increase the temperature to a second temperature for a second period of time. The second temperature is configured to promote crystal growth within the PM. The nucleation and growth of the crystal set the PM to the crystalline state. The multistage ramping up of the temperature can improve the efficiency of the set process relative to traditional approaches.

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