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    Techniques and configurations to control movement and position of surface mounted electrical devices
    3.
    发明授权
    Techniques and configurations to control movement and position of surface mounted electrical devices 有权

    公开(公告)号：US10186497B2

    公开(公告)日：2019-01-22

    申请号：US15495581

    申请日：2017-04-24

    Applicant: Intel Corporation

    Inventor： Mark D. Summers ,  Kuang C. Liu

    IPC: B23K31/02 ,  H01L23/00 ,  B23K1/00 ,  B23K1/008 ,  B23K101/40

    Abstract: Embodiments of the present disclosure are directed towards techniques and configurations to control movement and position of surface mounted electrical devices. In one embodiment, an electrical contact includes a leg portion configured to extend in a first direction, a foot portion coupled with the leg portion, the foot portion having a surface that extends in a second direction that is substantially perpendicular to the first direction, the surface being configured to directly couple with solderable material to form a solder joint, a heel portion adjoining the leg portion and the foot portion, the heel portion having a profile shape, and a toe portion extending from the foot portion and disposed opposite to the heel portion, the toe portion having a profile shape that is symmetric with the profile shape of the heel portion. Other embodiments may be described and/or claimed.

    TECHNIQUES AND CONFIGURATIONS TO CONTROL MOVEMENT AND POSITION OF SURFACE MOUNTED ELECTRICAL DEVICES
    4.
    发明申请
    TECHNIQUES AND CONFIGURATIONS TO CONTROL MOVEMENT AND POSITION OF SURFACE MOUNTED ELECTRICAL DEVICES 有权
    控制表面安装电气设备运动和位置的技术和配置

    公开(公告)号：US20160087361A1

    公开(公告)日：2016-03-24

    申请号：US14491646

    申请日：2014-09-19

    Applicant: Intel Corporation

    Inventor： Mark D. Summers ,  Kuang C. Liu

    IPC: H01R12/71 ,  H01R13/22 ,  H01L23/498 ,  H01R12/70 ,  B23K1/00 ,  H05K3/34

    CPC classification number: H01R12/718 ,  B23K1/0016 ,  B23K2101/38 ,  H01L23/147 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L2924/0002 ,  H01R12/7076 ,  H01R13/22 ,  H05K3/3426 ,  H05K2201/10325 ,  Y02P70/613 ,  H01L2924/00

    Abstract: Embodiments of the present disclosure are directed towards techniques and configurations to control movement and position of surface mounted electrical devices. In one embodiment, an electrical contact includes a leg portion configured to extend in a first direction, a foot portion coupled with the leg portion, the foot portion having a surface that extends in a second direction that is substantially perpendicular to the first direction, the surface being configured to directly couple with solderable material to form a solder joint, a heel portion adjoining the leg portion and the foot portion, the heel portion having a profile shape, and a toe portion extending from the foot portion and disposed opposite to the heel portion, the toe portion having a profile shape that is symmetric with the profile shape of the heel portion. Other embodiments may be described and/or claimed.

    Abstract translation: 本公开的实施例涉及用于控制表面安装的电气装置的运动和位置的技术和构造。 在一个实施例中，电触点包括被配置成沿第一方向延伸的腿部部分，与腿部部分联接的脚部分，所述脚部部分具有沿基本上垂直于第一方向的第二方向延伸的表面， 表面构造成直接与可焊接材料结合以形成焊接接头，邻接腿部和脚部的跟部，跟部具有轮廓形状，以及从脚部延伸并与鞋跟相对设置的趾部 趾部具有与跟部的轮廓形状对称的轮廓形状。 可以描述和/或要求保护其他实施例。

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