公开(公告)号：US20230420338A1

公开(公告)日：2023-12-28

申请号：US18034133

申请日：2021-03-06

Applicant: Intel Corporation

Inventor： Prabhakar SUBRAHMANYAM ,  Tong Wa CHAO ,  Ying-Feng PANG ,  Yi XIA ,  Rahima K. MOHAMMED ,  Victor P. POLYANKO ,  Ridvan A. SAHAN ,  Guangying ZHANG ,  Guoliang YING ,  Chuanlou WANG ,  Jun LU ,  Liguang DU ,  Peng WEI ,  Xiang QUE

IPC: H01L23/473 ,  G06F1/20 ,  H01L23/367

CPC classification number: H01L23/473 ,  G06F1/206 ,  H01L23/3672 ,  G06F2200/201

Abstract: Techniques for heat sinks and cold plates for compute systems are disclosed. In one embodiment, a heat sink includes two sub-heat sinks that are mechanically connected but thermally isolated. The two sub-heat sinks can independently cool different dies on the same integrated circuit component. In another embodiment, a system includes an integrated circuit component that is cooled by a first water block and a second water block. The first water block forms a loop with a gap in it, and the second water block has a pedestal that extends through the gap in the first water block to contact the integrated circuit component. The first water block and the second water block can independently cool different dies on the same integrated circuit component.