Technologies for improving processor thermal design power

    公开(公告)号:US11317542B2

    公开(公告)日:2022-04-26

    申请号:US15859392

    申请日:2017-12-30

    Abstract: A compute device for operation in a rack of a data center includes a substrate, a solid state drive array, a fan array, and a plurality of physical resources. The components of the compute device are arranged on the substrate to prevent or reduce shadowing of heat-producing physical resources, such as a processor, by other heat-producing physical resources relative to an airflow generated by the fan array. To do so, ruler solid state drives are used to facilitate positioning of the fan array toward a front edge of the substrate.

    TECHNOLOGIES FOR IMPROVING PROCESSOR THERMAL DESIGN POWER

    公开(公告)号:US20190045668A1

    公开(公告)日:2019-02-07

    申请号:US15859392

    申请日:2017-12-30

    Abstract: A compute device for operation in a rack of a data center includes a substrate, a solid state drive array, a fan array, and a plurality of physical resources. The components of the compute device are arranged on the substrate to prevent or reduce shadowing of heat-producing physical resources, such as a processor, by other heat-producing physical resources relative to an airflow generated by the fan array. To do so, ruler solid state drives are used to facilitate positioning of the fan array toward a front edge of the substrate.

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