Scalable gate control in quantum circuit assemblies

    公开(公告)号:US12248848B2

    公开(公告)日:2025-03-11

    申请号:US17340173

    申请日:2021-06-07

    Abstract: Quantum circuit assemblies that employ active pulse shaping in order to be able to control states of a plurality of qubits with signal pulses propagated over a shared signal propagation channel are disclosed. An example quantum circuit assembly includes a quantum circuit component that includes a first qubit, associated with a first frequency to control the state of the first qubit, and a second qubit, associated with a second frequency to control the state of the second qubit. A shared transmission channel is coupled to the first and second qubits. The assembly further includes a signal pulse generation circuit, configured to generate a signal pulse to be propagated over the shared transmission channel to control the state of the first qubit, where the signal pulse has a center frequency at the first frequency, a bandwidth that includes the second frequency, and a notch at the second frequency.

    TECHNOLOGIES FOR SIGNAL CONDITIONING OF SIGNALS FOR QUBITS

    公开(公告)号:US20230153125A1

    公开(公告)日:2023-05-18

    申请号:US17527875

    申请日:2021-11-16

    CPC classification number: G06F9/4498 G06N10/00

    Abstract: Technologies for signal conditioning for signals for qubits are disclosed. In the illustrative embodiment, a finite impulse response filter is applied to a control signal for a target qubit to filter out a frequency corresponding to a collateral qubit. An infinite impulse response filter is then applied to the signal after the finite impulse response filter, which amplifies some of the frequencies filtered out by the finite impulse response, narrowing the bandwidth that is filtered out. Such an approach reduces the attenuation of the signal and can be used to reduce memory requirements of quantum/classical interface circuitry.

    TECHNOLOGIES FOR HIGH-SPEED INTERFACES FOR CRYOGENIC QUANTUM CONTROL

    公开(公告)号:US20230186142A1

    公开(公告)日:2023-06-15

    申请号:US17549154

    申请日:2021-12-13

    CPC classification number: G06N10/80 G06N10/60 G06N10/40

    Abstract: Technologies for high-speed interfaces for cryogenic quantum control are disclosed. In the illustrative embodiment, a die for quantum/classical interface circuitry includes digital circuitry operating in a first clock domain and analog circuitry operating in a second clock domain. Clock domain crossing circuitry facilitates asynchronous data transfer from the digital circuitry to the analog circuitry. The illustrative clock domain crossing circuitry includes a first asynchronous first-in-first-out (FIFO) queue at the border of the first clock domain. The first asynchronous FIFO queue is connected to a second asynchronous FIFO queue at the border of the second clock domain.

    TECHNOLOGIES FOR IMPEDANCE MATCHING NETWORKS FOR QUBITS

    公开(公告)号:US20230155573A1

    公开(公告)日:2023-05-18

    申请号:US17528453

    申请日:2021-11-17

    CPC classification number: H03H11/28

    Abstract: Technologies for impedance matching networks for qubits are disclosed. In one illustrative embodiment, an impedance matching network matches a 50 Ohm transmission line to a spin qubit with a state-dependent resistance of 100 kiloohms to 105 kiloohms. The illustrative impedance matching network is tunable, allowing the impedance transformation ratio to be changed without significantly changing the matching frequency of the impedance matching network. In some embodiments, the impedance matching network matches a 50 Ohm transmission line to a lower-resistance state of a qubit. In other embodiments, the impedance matching network matches a 50 Ohm transmission line to an impedance value in between a lower-resistance state and a higher-resistance state of a qubit.

    Technologies for a high-voltage transmission gate

    公开(公告)号:US11955965B1

    公开(公告)日:2024-04-09

    申请号:US17827590

    申请日:2022-05-27

    CPC classification number: H03K17/693 G06N10/40 H03K17/6874

    Abstract: Technologies for a high-voltage transmission gate are disclosed. In the illustrative embodiment, a companion chip is connected to a quantum processor. The companion chip provides voltages to gates of qubits on the quantum processor. The companion chip includes one or more high-voltage transmission gates that can be used to charge capacitors linked to gates of qubits on the quantum processor. The transmission gate includes transistors with a breakdown voltage less than a range of input and output voltages of the transmission gate. Control circuitry on the companion chip controls the voltages applied to transistors of the transmission gate to ensure that the voltage differences across the terminals of each transistor is below a breakdown voltage.

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