公开(公告)号：US08969134B2

公开(公告)日：2015-03-03

申请号：US13891279

申请日：2013-05-10

Applicant: Intel Corporation

Inventor： Xavier F. Brun ,  Takashi Kumamoto ,  Sufi Ahmed

IPC: H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L23/00

CPC classification number: H01L24/11 ,  H01L21/6835 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/03845 ,  H01L2224/0391 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/05571 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/1134 ,  H01L2224/11442 ,  H01L2224/11474 ,  H01L2224/11849 ,  H01L2224/1191 ,  H01L2224/13023 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2924/12042 ,  H01L2924/013 ,  H01L2924/00014 ,  H01L2924/0105 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A tape capable of laser ablation may be used in the formation of microelectronic interconnects, wherein the tape may be attached to bond pads on a microelectronic device and vias may be formed by laser ablation through the tape to expose at least a portion of corresponding bond pads. The microelectronic interconnects may be formed on the bond pads within the vias, such as by solder paste printing and solder reflow. The laser ablation tape can be removed after the formation of the microelectronic interconnects.

Abstract translation: 可以使用能够进行激光烧蚀的胶带来形成微电子互连，其中胶带可以附着到微电子器件上的接合焊盘，并且通孔可以通过激光烧蚀形成，以通过带暴露至少一部分相应的焊盘 。 微电子互连可以形成在通孔内的接合焊盘上，例如通过焊膏印刷和焊料回流。 在形成微电子互连后，可以去除激光烧蚀带。

公开(公告)号：US10224290B2

公开(公告)日：2019-03-05

申请号：US14757965

申请日：2015-12-24

Applicant: Intel Corporation

Inventor： Rajendra Dias ,  Takashi Kumamoto ,  Yoshishiro Tomita ,  Mitul Modi ,  Joshua Heppner ,  Eric Li

IPC: H01L21/56 ,  H01L23/552 ,  H01L23/31 ,  H01L25/16

Abstract: Electromagnetically shielded electronic device technology is disclosed. In an example, a method of making an electronic device package can comprise providing a substrate having a conductor pad and an electronic component. The method can also comprise forming a conformal insulating layer on the substrate and electronic component. The conformal insulating layer conforms to the electronic component. The method can further comprise exposing the conductor pad. In addition, the method can comprise forming an electrically conductive electromagnetic interference (EMI) layer on the insulating layer and in contact with the conductor pad.

公开(公告)号：US20170186697A1

公开(公告)日：2017-06-29

申请号：US14757965

申请日：2015-12-24

Applicant: Intel Corporation

Inventor： Rajendra Dias ,  Takashi Kumamoto ,  Yoshishiro Tomita ,  Mitul Modi ,  Joshua Heppner ,  Eric Li

IPC: H01L23/552 ,  H01L23/31 ,  H01L21/56

CPC classification number: H01L23/552 ,  H01L21/561 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/3135 ,  H01L25/16 ,  H01L2224/73204

Abstract: Electromagnetically shielded electronic device technology is disclosed. In an example, a method of making an electronic device package can comprise providing a substrate having a conductor pad and an electronic component. The method can also comprise forming a conformal insulating layer on the substrate and electronic component. The conformal insulating layer conforms to the electronic component. The method can further comprise exposing the conductor pad. In addition, the method can comprise forming an electrically conductive electromagnetic interference (EMI) layer on the insulating layer and in contact with the conductor pad.