公开(公告)号：US20170013714A1

公开(公告)日：2017-01-12

申请号：US15276073

申请日：2016-09-26

申请人： International Business Machines Corporation

发明人： Ai Kiar Ang ,  Michael Lauri

IPC分类号： H05K1/11 ,  H05K1/03 ,  H01L23/495 ,  H01L25/10 ,  H01L25/00 ,  H05K1/18 ,  H05K3/34

CPC分类号： H05K1/11 ,  H01L21/4839 ,  H01L23/49537 ,  H01L23/49555 ,  H01L23/49565 ,  H01L23/49575 ,  H01L25/105 ,  H01L25/50 ,  H01L2225/1029 ,  H01L2924/181 ,  H05K1/0313 ,  H05K1/144 ,  H05K1/18 ,  H05K1/181 ,  H05K3/328 ,  H05K3/341 ,  H05K3/3421 ,  H05K3/3426 ,  H05K2201/10015 ,  H05K2201/10227 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10962 ,  Y02P70/613 ,  H01L2924/00012

摘要： A method includes forming a multi-stacked electronic device having two or more electronic components, each of the electronic components includes a leadframe, the leadframes of each electronic component are physically joined together using a non-solder metal joining process to form a joint, and the joint is located outside a solder connection region.

摘要翻译： 一种方法包括形成具有两个或多个电子部件的多层电子器件，每个电子部件包括引线框，每个电子部件的引线框架使用非焊接金属接合工艺物理地接合在一起以形成接头，并且 接头位于焊接连接区域的外侧。

公开(公告)号：US20180168038A1

公开(公告)日：2018-06-14

申请号：US15892740

申请日：2018-02-09

申请人： International Business Machines Corporation

发明人： Ai Kiar Ang ,  Michael Lauri

IPC分类号： H05K1/11 ,  H05K3/34 ,  H05K1/18 ,  H01L23/495 ,  H05K1/03 ,  H01L25/00 ,  H01L25/10 ,  H05K3/32 ,  H05K1/14 ,  H01L21/48

CPC分类号： H05K1/11 ,  H01L21/4839 ,  H01L23/49537 ,  H01L23/49555 ,  H01L23/49565 ,  H01L23/49575 ,  H01L25/105 ,  H01L25/50 ,  H01L2225/1029 ,  H01L2924/181 ,  H05K1/0313 ,  H05K1/144 ,  H05K1/18 ,  H05K1/181 ,  H05K3/328 ,  H05K3/341 ,  H05K3/3421 ,  H05K3/3426 ,  H05K2201/10015 ,  H05K2201/10227 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10962 ,  Y02P70/613 ,  H01L2924/00012

摘要： A method includes forming a multi-stacked electronic device having two or more electronic components, each of the electronic components includes a leadframe, the leadframes of each electronic component are physically joined together using a non-solder metal joining process to form a joint, and the joint is located outside a solder connection region.

公开(公告)号：US20180153035A1

公开(公告)日：2018-05-31

申请号：US15880155

申请日：2018-01-25

申请人： International Business Machines Corporation

发明人： Ai Kiar Ang ,  Michael Lauri

IPC分类号： H05K1/11 ,  H05K3/32 ,  H05K1/18 ,  H01L25/10 ,  H05K3/34 ,  H01L23/495 ,  H05K1/03 ,  H01L21/48 ,  H01L25/00 ,  H05K1/14

CPC分类号： H05K1/11 ,  H01L21/4839 ,  H01L23/49537 ,  H01L23/49555 ,  H01L23/49565 ,  H01L23/49575 ,  H01L25/105 ,  H01L25/50 ,  H01L2225/1029 ,  H01L2924/181 ,  H05K1/0313 ,  H05K1/144 ,  H05K1/18 ,  H05K1/181 ,  H05K3/328 ,  H05K3/341 ,  H05K3/3421 ,  H05K3/3426 ,  H05K2201/10015 ,  H05K2201/10227 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10962 ,  Y02P70/613 ,  H01L2924/00012

摘要： A method includes forming a multi-stacked electronic device having two or more electronic components, each of the electronic components includes a leadframe, the leadframes of each electronic component are physically joined together using a non-solder metal joining process to form a joint, and the joint is located outside a solder connection region.

公开(公告)号：US10231334B2

公开(公告)日：2019-03-12

申请号：US15892740

申请日：2018-02-09

申请人： International Business Machines Corporation

发明人： Ai Kiar Ang ,  Michael Lauri

IPC分类号： H01L23/495 ,  H05K1/11 ,  H05K1/18 ,  H05K3/32 ,  H05K3/34 ,  H05K1/14 ,  H01L25/10 ,  H01L25/00 ,  H01L21/48 ,  H05K1/03

摘要： A method includes forming a multi-stacked electronic device having two or more electronic components, each of the electronic components includes a leadframe, the leadframes of each electronic component are physically joined together using a non-solder metal joining process to form a joint, and the joint is located outside a solder connection region.

公开(公告)号：US09936576B2

公开(公告)日：2018-04-03

申请号：US15174208

申请日：2016-06-06

申请人： International Business Machines Corporation

发明人： Ai Kiar Ang ,  Michael Lauri

IPC分类号： H01L21/44 ,  H05K1/11 ,  H05K1/18 ,  H05K3/32 ,  H05K3/34 ,  H05K1/14 ,  H01L23/495 ,  H01L25/10 ,  H01L25/00 ,  H01L21/48 ,  H05K1/03

CPC分类号： H05K1/11 ,  H01L21/4839 ,  H01L23/49537 ,  H01L23/49555 ,  H01L23/49565 ,  H01L23/49575 ,  H01L25/105 ,  H01L25/50 ,  H01L2225/1029 ,  H01L2924/181 ,  H05K1/0313 ,  H05K1/144 ,  H05K1/18 ,  H05K1/181 ,  H05K3/328 ,  H05K3/341 ,  H05K3/3421 ,  H05K3/3426 ,  H05K2201/10015 ,  H05K2201/10227 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10962 ,  Y02P70/613 ,  H01L2924/00012

摘要： A method includes forming a multi-stacked electronic device having two or more electronic components, each of the electronic components includes a leadframe, the leadframes of each electronic component are physically joined together using a non-solder metal joining process to form a joint, and the joint is located outside a solder connection region.

公开(公告)号：US09913375B2

公开(公告)日：2018-03-06

申请号：US15276073

申请日：2016-09-26

申请人： International Business Machines Corporation

发明人： Ai Kiar Ang ,  Michael Lauri

IPC分类号： H01L23/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/32 ,  H05K3/34 ,  H05K1/14 ,  H01L23/495 ,  H01L25/10 ,  H01L25/00 ,  H01L21/48 ,  H05K1/03

CPC分类号： H05K1/11 ,  H01L21/4839 ,  H01L23/49537 ,  H01L23/49555 ,  H01L23/49565 ,  H01L23/49575 ,  H01L25/105 ,  H01L25/50 ,  H01L2225/1029 ,  H01L2924/181 ,  H05K1/0313 ,  H05K1/144 ,  H05K1/18 ,  H05K1/181 ,  H05K3/328 ,  H05K3/341 ,  H05K3/3421 ,  H05K3/3426 ,  H05K2201/10015 ,  H05K2201/10227 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10962 ,  Y02P70/613 ,  H01L2924/00012

摘要： A method includes forming a multi-stacked electronic device having two or more electronic components, each of the electronic components includes a leadframe, the leadframes of each electronic component are physically joined together using a non-solder metal joining process to form a joint, and the joint is located outside a solder connection region.

公开(公告)号：US20160284633A1

公开(公告)日：2016-09-29

申请号：US15174208

申请日：2016-06-06

申请人： International Business Machines Corporation

发明人： Ai Kiar Ang ,  Michael Lauri

IPC分类号： H01L23/495 ,  H01L21/48

CPC分类号： H05K1/11 ,  H01L21/4839 ,  H01L23/49537 ,  H01L23/49555 ,  H01L23/49565 ,  H01L23/49575 ,  H01L25/105 ,  H01L25/50 ,  H01L2225/1029 ,  H01L2924/181 ,  H05K1/0313 ,  H05K1/144 ,  H05K1/18 ,  H05K1/181 ,  H05K3/328 ,  H05K3/341 ,  H05K3/3421 ,  H05K3/3426 ,  H05K2201/10015 ,  H05K2201/10227 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10962 ,  Y02P70/613 ,  H01L2924/00012

摘要： A method includes forming a multi-stacked electronic device having two or more electronic components, each of the electronic components includes a leadframe, the leadframes of each electronic component are physically joined together using a non-solder metal joining process to form a joint, and the joint is located outside a solder connection region.

公开(公告)号：US10237977B2

公开(公告)日：2019-03-19

申请号：US15880155

申请日：2018-01-25

申请人： International Business Machines Corporation

发明人： Ai Kiar Ang ,  Michael Lauri

IPC分类号： H01L21/44 ,  H05K1/11 ,  H05K1/18 ,  H05K3/32 ,  H05K3/34 ,  H05K1/14 ,  H01L23/495 ,  H01L25/10 ,  H01L25/00 ,  H01L21/48 ,  H05K1/03

摘要： A method includes forming a multi-stacked electronic device having two or more electronic components, each of the electronic components includes a leadframe, the leadframes of each electronic component are physically joined together using a non-solder metal joining process to form a joint, and the joint is located outside a solder connection region.

公开(公告)号：US09474153B2

公开(公告)日：2016-10-18

申请号：US14885405

申请日：2015-10-16

申请人： International Business Machines Corporation

发明人： Ai Kiar Ang ,  Michael Lauri

IPC分类号： H01L23/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/32 ,  H05K3/34 ,  H05K1/14 ,  H01L23/495 ,  H01L25/10 ,  H01L25/00

CPC分类号： H05K1/11 ,  H01L21/4839 ,  H01L23/49537 ,  H01L23/49555 ,  H01L23/49565 ,  H01L23/49575 ,  H01L25/105 ,  H01L25/50 ,  H01L2225/1029 ,  H01L2924/181 ,  H05K1/0313 ,  H05K1/144 ,  H05K1/18 ,  H05K1/181 ,  H05K3/328 ,  H05K3/341 ,  H05K3/3421 ,  H05K3/3426 ,  H05K2201/10015 ,  H05K2201/10227 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10962 ,  Y02P70/613 ,  H01L2924/00012

摘要： A method includes forming a multi-stacked electronic device having two or more electronic components, each of the electronic components includes a leadframe, the leadframes of each electronic component are physically joined together using a non-solder metal joining process to form a joint, and the joint is located outside a solder connection region.

公开(公告)号：US09392691B2

公开(公告)日：2016-07-12

申请号：US14332776

申请日：2014-07-16

申请人： International Business Machines Corporation

发明人： Ai Kiar Ang ,  Michael Lauri

IPC分类号： H01L21/44 ,  H05K1/11 ,  H05K1/18 ,  H05K3/32 ,  H05K3/34 ,  H05K1/14

CPC分类号： H05K1/11 ,  H01L21/4839 ,  H01L23/49537 ,  H01L23/49555 ,  H01L23/49565 ,  H01L23/49575 ,  H01L25/105 ,  H01L25/50 ,  H01L2225/1029 ,  H01L2924/181 ,  H05K1/0313 ,  H05K1/144 ,  H05K1/18 ,  H05K1/181 ,  H05K3/328 ,  H05K3/341 ,  H05K3/3421 ,  H05K3/3426 ,  H05K2201/10015 ,  H05K2201/10227 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10962 ,  Y02P70/613 ,  H01L2924/00012

摘要： A method includes forming a multi-stacked electronic device having two or more electronic components, each of the electronic components includes a leadframe, the leadframes of each electronic component are physically joined together using a non-solder metal joining process to form a joint, and the joint is located outside a solder connection region.

摘要翻译： 一种方法包括形成具有两个或更多个电子部件的多层电子器件，每个电子部件包括引线框，每个电子部件的引线框架使用非焊接金属接合工艺物理地接合在一起以形成接头，并且 接头位于焊接连接区域的外侧。