DISCONNECT ASSEMBLY FOR ACTIVE COOLING OF PACKAGED ELECTRONICS

    公开(公告)号:US20200011617A1

    公开(公告)日:2020-01-09

    申请号:US16030097

    申请日:2018-07-09

    IPC分类号: F28F9/02 H05K7/20

    摘要: A disconnect assembly includes a solid frame comprising a slit and a first liquid coolant circuit leading to a frame outlet defined in an inner wall of the slit. The assembly further includes an insert element, insertable in the slit so as to reach a sealing position. The latter defines a shut state, in which the insert element seals the frame outlet. The assembly includes a cold plate, comprising a second liquid coolant circuit with a duct open on a side of the cold plate. The cold plate can be inserted in the slit, so as to push the insert element, for the latter to leave the sealing position and the cold plate to reach a fluid communication position. This position defines an open state, in which the duct is vis-à-vis the frame outlet, to enable fluid communication between the first liquid coolant circuit and the second liquid coolant circuit.

    ADSORBING HEAT EXCHANGER
    3.
    发明申请
    ADSORBING HEAT EXCHANGER 有权
    吸附热交换器

    公开(公告)号:US20170030612A1

    公开(公告)日:2017-02-02

    申请号:US14813566

    申请日:2015-07-30

    IPC分类号: F25B15/02

    摘要: An apparatus and corresponding method for heat exchange. The heat exchange apparatus may include an adsorber device. The adsorber device is configured to draw heat from a first heat reservoir and transfer heat to a first heat sink. The heat exchange apparatus may include a heat exchanger fluidly connected to the adsorber device by the working fluid. The heat exchanger transfers heat to a second heat sink. The heat exchange apparatus may include an expansion device fluidly connected to the heat exchanger by the working fluid. The expansion device expands the working fluid, and exchanges heat with a second heat reservoir. The expansion device includes a turbine device for converting at least a part of an exergy of the working fluid during expansion into mechanical work. The heat exchange apparatus may include the adsorber device being fluidly connected to the expansion device by the working fluid.

    摘要翻译: 一种用于热交换的装置和相应的方法。 热交换装置可以包括吸附器装置。 吸附器装置构造成从第一储热器吸取热量并将热量传递到第一散热器。 热交换装置可以包括通过工作流体与吸附器装置流体连接的热交换器。 热交换器将热量传递到第二散热器。 热交换装置可以包括通过工作流体与热交换器流体连接的膨胀装置。 膨胀装置使工作流体膨胀,并与第二储热器交换热量。 膨胀装置包括涡轮机装置,用于在膨胀期间将工作流体的至少一部分的能量转换成机械作业。 热交换装置可以包括通过工作流体与膨胀装置流体连接的吸附器装置。

    WORKING FLUID FOR A DEVICE, DEVICE AND METHOD FOR CONVERTING HEAT INTO MECHANICAL ENERGY
    4.
    发明申请
    WORKING FLUID FOR A DEVICE, DEVICE AND METHOD FOR CONVERTING HEAT INTO MECHANICAL ENERGY 有权
    用于装置的工作流体,将热量转换成机械能的装置和方法

    公开(公告)号:US20160265390A1

    公开(公告)日:2016-09-15

    申请号:US14657567

    申请日:2015-03-13

    摘要: A working fluid (6) for a device (4) for converting heat into mechanical energy is disclosed. The working fluid (6) comprises a fluid (7) having a boiling temperature in the range between 30 and 250° C. at a pressure of 1 bar and nanoparticles (8) which are dispersed or suspended in the liquid phase of the fluid (7). Said nanoparticles (8) are instrumented as condensation and/or boiling nuclei and the surface of said nanoparticles (8) is adapted to support condensation and/or boiling.

    摘要翻译: 公开了一种用于将热量转换成机械能的装置(4)的工作流体(6)。 工作流体(6)包括在1巴的压力下沸点温度在30和250℃之间的流体(7)和分散或悬浮在流体液相中的纳米颗粒(8) 7)。 所述纳米颗粒(8)被装配为冷凝和/或沸腾核,并且所述纳米颗粒(8)的表面适于支持冷凝和/或沸腾。

    SEALING ARRANGEMENT
    5.
    发明申请
    SEALING ARRANGEMENT 审中-公开
    密封安排

    公开(公告)号:US20160061365A1

    公开(公告)日:2016-03-03

    申请号:US14830310

    申请日:2015-08-19

    IPC分类号: F16L21/06

    摘要: An embodiment of the invention may include a sealing apparatus. The sealing apparatus may include a first component having a body, where the body has an outer surface and a first arm protruding from the outer surface. The first arm includes an inner surface facing the outer surface of the body. The sealing apparatus may include a second component engaged by the first arm of the first component. The second component may have a first portion arranged inside a space between the inner surface of the first arm and the outer surface of the body and a second portion arranged outside of the space and adjacent to an outer surface of the first arm.

    摘要翻译: 本发明的实施例可以包括密封装置。 密封装置可以包括具有主体的第一部件,其中主体具有外表面和从外表面突出的第一臂。 第一臂包括面向身体的外表面的内表面。 密封装置可以包括由第一部件的第一臂接合的第二部件。 第二部件可以具有布置在第一臂的内表面和主体的外表面之间的空间内的第一部分和布置在该空间外侧并且邻近第一臂的外表面的第二部分。

    Disconnect assembly for active cooling of packaged electronics

    公开(公告)号:US10767939B2

    公开(公告)日:2020-09-08

    申请号:US16665046

    申请日:2019-10-28

    IPC分类号: F28D1/00 H05K7/20 F28F9/02

    摘要: A disconnect assembly includes a solid frame comprising a slit and a first liquid coolant circuit leading to a frame outlet defined in an inner wall of the slit. The assembly further includes an insert element, insertable in the slit so as to reach a sealing position. The latter defines a shut state, in which the insert element seals the frame outlet. The assembly includes a cold plate, comprising a second liquid coolant circuit with a duct open on a side of the cold plate. The cold plate can be inserted in the slit, so as to push the insert element, for the latter to leave the sealing position and the cold plate to reach a fluid communication position. This position defines an open state, in which the duct is vis-à-vis the frame outlet, to enable fluid communication between the first liquid coolant circuit and the second liquid coolant circuit.

    System and method for cooling and delivering power to a computer system
    9.
    发明授权
    System and method for cooling and delivering power to a computer system 有权
    用于冷却和传送电力到计算机系统的系统和方法

    公开(公告)号:US09591791B1

    公开(公告)日:2017-03-07

    申请号:US14983824

    申请日:2015-12-30

    IPC分类号: H05K7/20

    摘要: A cooling and power delivery system for a computer system includes a first fluid, a second fluid conduit, and a power supply thermally connected to at least one of the first and second fluid conduits. A first board receiving member is fluidically connected to the first and second fluid conduits and electrically connected to the power supply. A second board receiving member is fluidically connected to the first and second fluid conduits and electrically connected to the power supply. An electronics board is supported between the first board receiving member and the second board receiving member. The electronics board is electrically connected to the power supply through at least one of the first and second board receiving members.

    摘要翻译: 用于计算机系统的冷却和电力输送系统包括第一流体,第二流体导管和热连接到第一和第二流体导管中的至少一个的电源。 第一板接收构件流体连接到第一和第二流体导管并电连接到电源。 第二板接收构件流体连接到第一和第二流体导管并电连接到电源。 电子板被支撑在第一板接收构件和第二板接收构件之间。 电子板通过第一和第二板接收构件中的至少一个电连接到电源。