公开(公告)号：US09525099B2

公开(公告)日：2016-12-20

申请号：US13866856

申请日：2013-04-19

Applicant: Intevac, Inc.

Inventor： Terry Bluck ,  Ian Latchford ,  Vinay Shah ,  Alex Riposan

IPC: C23C14/04 ,  C23C14/50 ,  C23C16/04 ,  C23C16/458 ,  H01L21/673 ,  H01L31/18

CPC classification number: H01L31/1892 ,  C23C14/042 ,  C23C14/50 ,  C23C16/042 ,  C23C16/4585 ,  H01L21/6734 ,  H01L21/67346 ,  H01L31/18

Abstract: An arrangement for supporting substrates during processing, having a wafer carrier with a susceptor for supporting the substrate and confining the substrate to predetermined position. An inner mask is configured for placing on top of the substrate, the inner mask having an opening pattern to mask unprocessed parts of the substrate, but expose remaining parts of the substrate for processing. An outer mask is configured for placing on top of the inner mask, the outer mask having an opening that exposes the part of the inner mask having the opening pattern, but cover the periphery of the inner mask.

Abstract translation: 一种用于在加工过程中支撑基板的装置，具有带有用于支撑基板并将基板限制在预定位置的基座的晶片载体。 内部掩模被配置为放置在基板的顶部上，内部掩模具有开口图案以掩蔽基板的未处理部分，但是暴露基板的剩余部分以进行处理。 外掩模被配置为放置在内掩模的顶部上，外掩模具有露出具有开口图案的内掩模的一部分，但覆盖内掩模的周边的开口。

公开(公告)号：US10062600B2

公开(公告)日：2018-08-28

申请号：US14627667

申请日：2015-02-20

Applicant: Intevac, Inc.

Inventor： Terry Bluck ,  Vinay Shah ,  Ian Latchford ,  Alexandru Riposan

IPC: H01L21/677 ,  H01L21/687 ,  H01L21/67

CPC classification number: H01L21/68785 ,  H01L21/67173 ,  H01L21/67736 ,  H01L21/67754

Abstract: A system for processing substrates in plasma chambers, such that all substrates transport and loading/unloading operations are performed in atmospheric environment, but processing is performed in vacuum environment. The substrates are transported throughout the system on carriers. The system's chambers are arranged linearly, such that carriers move from one chamber directly to the next. A conveyor, placed above or below the system's chambers, returns the carriers to the system's entry area after processing is completed. The carriers are configured for supporting substrates of different sizes. The carriers are also configured for flipping the substrates such that both surfaces of the substrates may be processed.

公开(公告)号：US20130276978A1

公开(公告)日：2013-10-24

申请号：US13866856

申请日：2013-04-19

Applicant: INTEVAC, INC.

Inventor： Terry Bluck ,  Ian Latchford ,  Vinay Shah ,  Alex Riposan

IPC: H01L31/18

CPC classification number: H01L31/1892 ,  C23C14/042 ,  C23C14/50 ,  C23C16/042 ,  C23C16/4585 ,  H01L21/6734 ,  H01L21/67346 ,  H01L31/18

Abstract: An arrangement for supporting substrates during processing, having a wafer carrier with a susceptor for supporting the substrate and confining the substrate to predetermined position. An inner mask is configured for placing on top of the substrate, the inner mask having an opening pattern to mask unprocessed parts of the substrate, but expose remaining parts of the substrate for processing. An outer mask is configured for placing on top of the inner mask, the outer mask having an opening that exposes the part of the inner mask having the opening pattern, but cover the periphery of the inner mask.

Abstract translation: 一种用于在加工过程中支撑基板的装置，具有带有用于支撑基板并将基板限制在预定位置的基座的晶片载体。 内部掩模被配置为放置在基板的顶部上，内部掩模具有开口图案以掩蔽基板的未处理部分，但是暴露基板的剩余部分以进行处理。 外掩模被配置为放置在内掩模的顶部上，外掩模具有露出具有开口图案的内掩模的一部分，但覆盖内掩模的周边的开口。

公开(公告)号：US20150170947A1

公开(公告)日：2015-06-18

申请号：US14627667

申请日：2015-02-20

Applicant: Intevac, Inc.

Inventor： Terry Bluck ,  Vinay Shah ,  Ian Latchford ,  Alexandru Riposan

IPC: H01L21/677 ,  H01L21/687 ,  H01L21/67

CPC classification number: H01L21/68785 ,  H01L21/67173 ,  H01L21/67736 ,  H01L21/67754

Abstract: A system for processing substrates in plasma chambers, such that all substrates transport and loading/unloading operations are performed in atmospheric environment, but processing is performed in vacuum environment. The substrates are transported throughout the system on carriers. The system's chambers are arranged linearly, such that carriers move from one chamber directly to the next. A conveyor, placed above or below the system's chambers, returns the carriers to the system's entry area after processing is completed. The carriers are configured for supporting substrates of different sizes. The carriers are also configured for flipping the substrates such that both surfaces of the substrates may be processed.

Abstract translation: 用于处理等离子体室中的衬底的系统，使得在大气环境中执行所有衬底的输送和加载/卸载操作，但是在真空环境中进行处理。 基板在载体上通过系统传送。 系统的室线性布置，使得载体从一个室直接移动到下一个室。 放置在系统腔室上方或下方的输送机在处理完成后将载体返回到系统的进入区域。 载体构造成用于支撑不同尺寸的基底。 载体也构造成用于翻转基板，使得可以处理基板的两个表面。