公开(公告)号：US10115617B2

公开(公告)日：2018-10-30

申请号：US15284450

申请日：2016-10-03

Applicant: Intevac, Inc.

Inventor： Terry Bluck ,  Vinay Shah ,  Alexandru Riposan

IPC: H01L21/677 ,  H01L21/67 ,  H01L21/687

Abstract: A system for processing substrates in plasma chambers, such that all substrates transport and loading/unloading operations are performed in atmospheric environment, but processing is performed in vacuum environment. The substrates are transported throughout the system on carriers. The system's chambers are arranged linearly, such that carriers move from one chamber directly to the next. A conveyor, placed above or below the system's chambers, returns the carriers to the system's entry area after processing is completed. Loading and unloading of substrates may be performed at one side of the system, or loading can be done at the entry side and unloading at the exit side.

公开(公告)号：US20140332376A1

公开(公告)日：2014-11-13

申请号：US14185867

申请日：2014-02-20

Applicant: INTEVAC, INC.

Inventor： Vinay Shah ,  Alex Riposan ,  Terry Bluck

IPC: H01J37/34

CPC classification number: C23C14/351 ,  C23C14/35 ,  C23C14/56 ,  H01J37/32779 ,  H01J37/32899 ,  H01J37/3405 ,  H01J37/3417 ,  H01J37/3452 ,  H01J37/3455 ,  H01J2237/202 ,  H01J2237/3323

Abstract: A system for depositing material from a target onto substrates, comprising a processing chamber; a sputtering target having length L and having sputtering material provided on front surface thereof; a magnet operable to reciprocally scan across the length L in close proximity to rear surface of the target; and a counterweight operable to reciprocally scan at same speed but opposite direction of the magnet.

Abstract translation: 一种用于将材料从靶材沉积到基材上的系统，包括处理室; 具有长度L并在其前表面上设置有溅射材料的溅射靶; 一个磁铁可操作以在紧邻目标的后表面的整个长度L上往复扫描; 以及配重可操作以在与磁体相同的速度但相反的方向上往复扫描。

公开(公告)号：US20130287526A1

公开(公告)日：2013-10-31

申请号：US13871871

申请日：2013-04-26

Applicant: INTEVAC, INC.

Inventor： Terry Bluck ,  Vinay Shah ,  Alex Riposan

IPC: H01L21/677

CPC classification number: H01L21/67709 ,  H01L21/67173 ,  H01L21/67736 ,  H01L21/67739 ,  H01L21/67754 ,  H01L21/67769 ,  H01L21/67775 ,  H01L21/67778 ,  H01L21/67781 ,  H01L21/68742 ,  H01L21/68785

Abstract: A system for processing substrates in plasma chambers, such that all substrates transport and loading/unloading operations are performed in atmospheric environment, but processing is performed in vacuum environment. The substrates are transported throughout the system on carriers. The system's chambers are arranged linearly, such that carriers move from one chamber directly to the next. A conveyor, placed above or below the system's chambers, returns the carriers to the system's entry area after processing is completed. Loading and unloading of substrates may be performed at one side of the system, or loading can be done at the entry side and unloading at the exit side.

Abstract translation: 用于处理等离子体室中的衬底的系统，使得在大气环境中执行所有衬底的输送和加载/卸载操作，但是在真空环境中进行处理。 基板在载体上通过系统传送。 系统的室线性布置，使得载体从一个室直接移动到下一个室。 放置在系统腔室上方或下方的输送机在处理完成后将载体返回到系统的进入区域。 可以在系统的一侧进行基板的装载和卸载，或者可以在入口侧进行装载并在出口侧卸载。

公开(公告)号：US10106883B2

公开(公告)日：2018-10-23

申请号：US14185859

申请日：2014-02-20

Applicant: Intevac, Inc.

Inventor： Vinay Shah ,  Alexandru Riposan ,  Terry Bluck ,  Vladimir Kudriavtsev

IPC: C23C14/34 ,  C23C14/35 ,  H01J37/34 ,  H01J37/32 ,  C23C14/56

Abstract: A sputtering system having a processing chamber with an inlet port and an outlet port, and a sputtering target positioned on a wall of the processing chamber. A movable magnet arrangement is positioned behind the sputtering target and reciprocally slides behind the target. A conveyor continuously transports substrates at a constant speed past the sputtering target, such that at any given time, several substrates face the target between the leading edge and the trailing edge. In certain embodiments, the movable magnet arrangement slides at a speed that is at least several times faster than the constant speed of the conveyor. A rotating zone is defined behind the leading edge and trailing edge of the target, wherein the magnet arrangement decelerates when it enters the rotating zone and accelerates as it reverses direction of sliding within the rotating zone. In certain embodiments, magnet power and/or speed varies as function of direction of magnet travel.

公开(公告)号：US10062600B2

公开(公告)日：2018-08-28

申请号：US14627667

申请日：2015-02-20

Applicant: Intevac, Inc.

Inventor： Terry Bluck ,  Vinay Shah ,  Ian Latchford ,  Alexandru Riposan

IPC: H01L21/677 ,  H01L21/687 ,  H01L21/67

CPC classification number: H01L21/68785 ,  H01L21/67173 ,  H01L21/67736 ,  H01L21/67754

Abstract: A system for processing substrates in plasma chambers, such that all substrates transport and loading/unloading operations are performed in atmospheric environment, but processing is performed in vacuum environment. The substrates are transported throughout the system on carriers. The system's chambers are arranged linearly, such that carriers move from one chamber directly to the next. A conveyor, placed above or below the system's chambers, returns the carriers to the system's entry area after processing is completed. The carriers are configured for supporting substrates of different sizes. The carriers are also configured for flipping the substrates such that both surfaces of the substrates may be processed.

公开(公告)号：US20160177438A1

公开(公告)日：2016-06-23

申请号：US15053997

申请日：2016-02-25

Applicant: Intevac, Inc.

Inventor： Vinay Shah ,  Alexandru Riposan ,  Terry Bluck

IPC: C23C14/35 ,  H01J37/34 ,  C23C14/56

CPC classification number: C23C14/351 ,  C23C14/35 ,  C23C14/56 ,  H01J37/32779 ,  H01J37/32899 ,  H01J37/3405 ,  H01J37/3417 ,  H01J37/3452 ,  H01J37/3455 ,  H01J2237/202 ,  H01J2237/3323

Abstract: A method for depositing material from a target onto substrates, comprising using a processing chamber; a sputtering target having length L and having sputtering material provided on front surface thereof; a magnet operable to reciprocally scan across the length L in close proximity to rear surface of the target; and a counterweight operable to reciprocally scan at same speed but opposite direction of the magnet; and moving the magnets at speeds at least several times faster than the speed of the substrates.

Abstract translation: 一种用于将材料从靶材沉积到基板上的方法，包括使用处理室; 具有长度L并在其前表面上设置有溅射材料的溅射靶; 一个磁铁可操作以在紧邻目标的后表面的整个长度L上往复扫描; 以及配重可操作以在磁体的相同速度但相反的方向上往复扫描; 并以比基片的速度至少几倍的速度移动磁体。

公开(公告)号：US20130276978A1

公开(公告)日：2013-10-24

申请号：US13866856

申请日：2013-04-19

Applicant: INTEVAC, INC.

Inventor： Terry Bluck ,  Ian Latchford ,  Vinay Shah ,  Alex Riposan

IPC: H01L31/18

CPC classification number: H01L31/1892 ,  C23C14/042 ,  C23C14/50 ,  C23C16/042 ,  C23C16/4585 ,  H01L21/6734 ,  H01L21/67346 ,  H01L31/18

Abstract: An arrangement for supporting substrates during processing, having a wafer carrier with a susceptor for supporting the substrate and confining the substrate to predetermined position. An inner mask is configured for placing on top of the substrate, the inner mask having an opening pattern to mask unprocessed parts of the substrate, but expose remaining parts of the substrate for processing. An outer mask is configured for placing on top of the inner mask, the outer mask having an opening that exposes the part of the inner mask having the opening pattern, but cover the periphery of the inner mask.

Abstract translation: 一种用于在加工过程中支撑基板的装置，具有带有用于支撑基板并将基板限制在预定位置的基座的晶片载体。 内部掩模被配置为放置在基板的顶部上，内部掩模具有开口图案以掩蔽基板的未处理部分，但是暴露基板的剩余部分以进行处理。 外掩模被配置为放置在内掩模的顶部上，外掩模具有露出具有开口图案的内掩模的一部分，但覆盖内掩模的周边的开口。

公开(公告)号：US20130149075A1

公开(公告)日：2013-06-13

申请号：US13708751

申请日：2012-12-07

Applicant: INTEVAC, INC.

Inventor： Vinay Shah ,  William Runstadler, JR. ,  Kevin P. Fairbairn ,  Terry Bluck ,  Richard Henry Cooke

IPC: H01L21/677

CPC classification number: H01L21/67736 ,  H01L21/67126 ,  H01L21/67201 ,  H01L21/67271 ,  H01L21/67288

Abstract: A system for transporting substrates from an atmospheric pressure to high vacuum pressure and comprising: a rough vacuum chamber having an entry valve and an exit opening; a high vacuum chamber having an entry opening, the high vacuum chamber coupled to the rough vacuum chamber such that the exit opening and the entry opening are aligned; a valve situated between the exit opening and the entry opening; a first conveyor belt provided in the rough vacuum chamber; a second conveyor provided in the high vacuum chamber; a sensing element provided in the high vacuum chamber to enable detection of broken substrates on the second conveyor; and, a mechanism provided on the second conveyor belt enabling dumping of broken substrates onto the bottom of the high vacuum chamber.

Abstract translation: 一种用于将基板从大气压输送到高真空压力的系统，包括：具有入口阀和出口的粗真空室; 具有进入开口的高真空室，所述高真空室联接到所述粗真空室，使得所述出口和入口开口对齐; 位于出口和入口之间的阀; 设置在粗糙真空室中的第一传送带; 设置在高真空室中的第二传送器; 设置在所述高真空室中以便能够检测所述第二输送机上的破裂的基板的感测元件; 以及设置在第二传送带上的机构，其能够将破碎的基板倾倒到高真空室的底部上。

公开(公告)号：US09525099B2

公开(公告)日：2016-12-20

申请号：US13866856

申请日：2013-04-19

Applicant: Intevac, Inc.

Inventor： Terry Bluck ,  Ian Latchford ,  Vinay Shah ,  Alex Riposan

IPC: C23C14/04 ,  C23C14/50 ,  C23C16/04 ,  C23C16/458 ,  H01L21/673 ,  H01L31/18

CPC classification number: H01L31/1892 ,  C23C14/042 ,  C23C14/50 ,  C23C16/042 ,  C23C16/4585 ,  H01L21/6734 ,  H01L21/67346 ,  H01L31/18

Abstract: An arrangement for supporting substrates during processing, having a wafer carrier with a susceptor for supporting the substrate and confining the substrate to predetermined position. An inner mask is configured for placing on top of the substrate, the inner mask having an opening pattern to mask unprocessed parts of the substrate, but expose remaining parts of the substrate for processing. An outer mask is configured for placing on top of the inner mask, the outer mask having an opening that exposes the part of the inner mask having the opening pattern, but cover the periphery of the inner mask.

Abstract translation: 一种用于在加工过程中支撑基板的装置，具有带有用于支撑基板并将基板限制在预定位置的基座的晶片载体。 内部掩模被配置为放置在基板的顶部上，内部掩模具有开口图案以掩蔽基板的未处理部分，但是暴露基板的剩余部分以进行处理。 外掩模被配置为放置在内掩模的顶部上，外掩模具有露出具有开口图案的内掩模的一部分，但覆盖内掩模的周边的开口。

公开(公告)号：US08998553B2

公开(公告)日：2015-04-07

申请号：US13708751

申请日：2012-12-07

Applicant: Intevac, Inc.

Inventor： Vinay Shah ,  William Runstadler, Jr. ,  Kevin P. Fairbairn ,  Terry Bluck ,  Richard Henry Cooke

IPC: H01L21/677 ,  H01L21/67

CPC classification number: H01L21/67736 ,  H01L21/67126 ,  H01L21/67201 ,  H01L21/67271 ,  H01L21/67288

Abstract: A system for transporting substrates from an atmospheric pressure to high vacuum pressure and comprising: a rough vacuum chamber having an entry valve and an exit opening; a high vacuum chamber having an entry opening, the high vacuum chamber coupled to the rough vacuum chamber such that the exit opening and the entry opening are aligned; a valve situated between the exit opening and the entry opening; a first conveyor belt provided in the rough vacuum chamber; a second conveyor provided in the high vacuum chamber; a sensing element provided in the high vacuum chamber to enable detection of broken substrates on the second conveyor; and, a mechanism provided on the second conveyor belt enabling dumping of broken substrates onto the bottom of the high vacuum chamber.

Abstract translation: 一种用于将基板从大气压输送到高真空压力的系统，包括：具有入口阀和出口的粗真空室; 具有进入开口的高真空室，所述高真空室联接到所述粗真空室，使得所述出口和入口开口对齐; 位于出口和入口之间的阀; 设置在粗糙真空室中的第一传送带; 设置在高真空室中的第二传送器; 设置在所述高真空室中以便能够检测所述第二输送机上的破裂的基板的感测元件; 以及设置在第二传送带上的机构，其能够将破碎的基板倾倒到高真空室的底部上。