公开(公告)号：US09999137B2

公开(公告)日：2018-06-12

申请号：US14931356

申请日：2015-11-03

Applicant: Intrinsiq Materials, Inc.

Inventor： David Ciufo ,  Janet Heyen

IPC: H01K3/10 ,  H05K3/40 ,  H05K3/00 ,  H05K3/42 ,  H05K1/03 ,  H05K1/09 ,  H05K3/12 ,  H05K3/22 ,  H05K3/26 ,  H05K3/46

CPC classification number: H05K3/4069 ,  H05K1/0306 ,  H05K1/032 ,  H05K1/097 ,  H05K3/0047 ,  H05K3/1233 ,  H05K3/227 ,  H05K3/26 ,  H05K3/429 ,  H05K3/4617 ,  H05K2201/0266 ,  H05K2201/0347 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2203/0139 ,  H05K2203/085 ,  H05K2203/086 ,  H05K2203/107 ,  H05K2203/1131 ,  H05K2203/143 ,  H05K2203/1438 ,  Y10T29/49165

Abstract: A method for filling a via on a printed circuit board formulates a paste as a dispersion of copper particulate that includes nanocopper particles in a solvent and a binder and depositing the paste into a via cavity formed in the printed circuit board. Heating the paste-filled cavity removes most of the solvent. The method sinters the deposited paste in the via cavity, planarizes the sintered via, and overplates the filled via with copper.

公开(公告)号：US20160128201A1

公开(公告)日：2016-05-05

申请号：US14931356

申请日：2015-11-03

Applicant: Intrinsiq Materials, Inc.

Inventor： David Ciufo ,  Janet Heyen

IPC: H05K3/00 ,  H05K3/42

CPC classification number: H05K3/4069 ,  H05K1/0306 ,  H05K1/032 ,  H05K1/097 ,  H05K3/0047 ,  H05K3/1233 ,  H05K3/227 ,  H05K3/26 ,  H05K3/429 ,  H05K3/4617 ,  H05K2201/0266 ,  H05K2201/0347 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2203/0139 ,  H05K2203/085 ,  H05K2203/086 ,  H05K2203/107 ,  H05K2203/1131 ,  H05K2203/143 ,  H05K2203/1438 ,  Y10T29/49165

Abstract: A method for filling a via on a printed circuit board formulates a paste as a dispersion of copper particulate that includes nanocopper particles in a solvent and a binder and depositing the paste into a via cavity formed in the printed circuit board. Heating the paste-filled cavity removes most of the solvent. The method sinters the deposited paste in the via cavity, planarizes the sintered via, and overplates the filled via with copper.

Abstract translation: 用于在印刷电路板上填充通孔的方法将作为包括纳米颗粒在内的铜颗粒的分散体的糊剂制成溶剂和粘合剂，并将该糊料沉积到形成在印刷电路板中的通孔中。 加热糊状空腔去除大部分溶剂。 该方法将沉积的糊料烧结在通孔腔中，使烧结的通孔平坦化，并用铜填充填充的通孔。