公开(公告)号：US09362204B2

公开(公告)日：2016-06-07

申请号：US14628645

申请日：2015-02-23

Applicant: Invensas Corporation

Inventor： Charles G. Woychik ,  Cyprian Emeka Uzoh ,  Hiroaki Sato

IPC: H01L21/48 ,  H01L23/48 ,  H01L21/768 ,  H01L23/00 ,  H01L23/498 ,  H01L25/065 ,  H01L23/433 ,  H01L25/16 ,  H01L25/18

CPC classification number: H01L23/562 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/76898 ,  H01L23/4334 ,  H01L23/481 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49833 ,  H01L24/03 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/167 ,  H01L25/18 ,  H01L2224/0401 ,  H01L2224/131 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/3011 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A composite interposer can include a substrate element and a support element. The substrate element can have first and second opposite surfaces defining a thickness of 200 microns or less, and can have a plurality of contacts exposed at the first surface and electrically conductive structure extending through the thickness. The support element can have a body of at least one of dielectric or semiconductor material exposed at a second surface of the support element, openings extending through a thickness of the body, conductive vias extending within at least some of the openings in a direction of the thickness of the body, and terminals exposed at a first surface of the support element. The second surface of the support element can be united with the second surface of the substrate element. The terminals can be electrically connected with the contacts through the conductive vias and the electrically conductive structure.

公开(公告)号：US20150162216A1

公开(公告)日：2015-06-11

申请号：US14628645

申请日：2015-02-23

Applicant: Invensas Corporation

Inventor： Charles G. Woychik ,  Cyprian Emeka Uzoh ,  Hiroaki Sato

IPC: H01L21/48

CPC classification number: H01L23/562 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/76898 ,  H01L23/4334 ,  H01L23/481 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49833 ,  H01L24/03 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/167 ,  H01L25/18 ,  H01L2224/0401 ,  H01L2224/131 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/3011 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A composite interposer can include a substrate element and a support element. The substrate element can have first and second opposite surfaces defining a thickness of 200 microns or less, and can have a plurality of contacts exposed at the first surface and electrically conductive structure extending through the thickness. The support element can have a body of at least one of dielectric or semiconductor material exposed at a second surface of the support element, openings extending through a thickness of the body, conductive vias extending within at least some of the openings in a direction of the thickness of the body, and terminals exposed at a first surface of the support element. The second surface of the support element can be united with the second surface of the substrate element. The terminals can be electrically connected with the contacts through the conductive vias and the electrically conductive structure.

Abstract translation: 复合插入件可以包括衬底元件和支撑元件。 衬底元件可以具有限定200微米或更小的厚度的第一和第二相对表面，并且可以具有在第一表面处暴露的多个触点和延伸穿过该厚度的导电结构。 支撑元件可以具有暴露在支撑元件的第二表面处的电介质或半导体材料中的至少一个的主体，延伸穿过主体的厚度的开口，在至少一些开口内沿着 主体的厚度以及在支撑元件的第一表面处露出的端子。 支撑元件的第二表面可以与衬底元件的第二表面结合。 端子可以通过导电通孔和导电结构与触点电连接。

公开(公告)号：US09780042B2

公开(公告)日：2017-10-03

申请号：US15171604

申请日：2016-06-02

Applicant: Invensas Corporation

Inventor： Charles G. Woychik ,  Cyprian Emeka Uzoh ,  Hiroaki Sato

IPC: H01L23/58 ,  H01L23/00 ,  H01L23/48 ,  H01L21/768 ,  H01L23/498 ,  H01L25/065 ,  H01L21/48 ,  H01L23/433 ,  H01L25/16 ,  H01L25/18

CPC classification number: H01L23/562 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/76898 ,  H01L23/4334 ,  H01L23/481 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49833 ,  H01L24/03 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/167 ,  H01L25/18 ,  H01L2224/0401 ,  H01L2224/131 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/3011 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A composite interposer can include a substrate element and a support element. The substrate element can have first and second opposite surfaces defining a thickness of 200 microns or less, and can have a plurality of contacts exposed at the first surface and electrically conductive structure extending through the thickness. The support element can have a body of at least one of dielectric or semiconductor material exposed at a second surface of the support element, openings extending through a thickness of the body, conductive vias extending within at least some of the openings in a direction of the thickness of the body, and terminals exposed at a first surface of the support element. The second surface of the support element can be united with the second surface of the substrate element. The terminals can be electrically connected with the contacts through the conductive vias and the electrically conductive structure.

公开(公告)号：US20160276296A1

公开(公告)日：2016-09-22

申请号：US15171604

申请日：2016-06-02

Applicant: Invensas Corporation

Inventor： Charles G. Woychik ,  Cyprian Emeka Uzoh ,  Hiroaki Sato

IPC: H01L23/00 ,  H01L21/48 ,  H01L23/498

CPC classification number: H01L23/562 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/76898 ,  H01L23/4334 ,  H01L23/481 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49833 ,  H01L24/03 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/167 ,  H01L25/18 ,  H01L2224/0401 ,  H01L2224/131 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/3011 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A composite interposer can include a substrate element and a support element. The substrate element can have first and second opposite surfaces defining a thickness of 200 microns or less, and can have a plurality of contacts exposed at the first surface and electrically conductive structure extending through the thickness. The support element can have a body of at least one of dielectric or semiconductor material exposed at a second surface of the support element, openings extending through a thickness of the body, conductive vias extending within at least some of the openings in a direction of the thickness of the body, and terminals exposed at a first surface of the support element. The second surface of the support element can be united with the second surface of the substrate element. The terminals can be electrically connected with the contacts through the conductive vias and the electrically conductive structure.