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公开(公告)号：US20160104689A1
公开(公告)日：2016-04-14
申请号：US14969779
申请日：2015-12-15
申请人： Invensas Corporation
发明人： Scott Jay Crane , Simon J. S. McElrea , Scott McGrath , Weiping Pan , De Ann Eileen Melcher , Marc E. Robinson
IPC分类号： H01L23/00
CPC分类号： H01L24/83 , H01L23/293 , H01L23/3171 , H01L23/3185 , H01L24/24 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/73 , H01L25/0657 , H01L2224/24145 , H01L2224/24146 , H01L2224/27452 , H01L2224/29005 , H01L2224/29006 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/83191 , H01L2224/8385 , H01L2224/92247 , H01L2225/0651 , H01L2225/06524 , H01L2225/06551 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01038 , H01L2924/01082 , H01L2924/12042 , H01L2924/14 , H01L2924/00 , H01L2924/00012
摘要： A conformal coating on a semiconductor die provides adhesion between the die and a support. No additional adhesive is necessary to affix the die on the support. The conformal coating protects the die during assembly, and serves to electrically insulate the die from electrically conductive parts that the die may contact. The conformal coating may be an organic polymer, such as a parylene, for example. Also, a method for adhering a die onto a support, which may optionally be another die, includes providing a coating of a conformal between the die and the support, and heating the coating between the die and the support. The conformal coating may be provided on a die attach area of a surface of the die, or on a die mount region of a surface of the support, or on both a die attach area of a surface of the die and on a die mount region of a surface of the support; and the conformal coating may be provided following placement of the die on the support.
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公开(公告)号：US20140213020A1
公开(公告)日：2014-07-31
申请号：US14242206
申请日：2014-04-01
申请人： Invensas Corporation
发明人： Scott Jay Crane , Simon J. S. McElrea , Scott McGrath , Weiping Pan , De Ann Eileen Melcher , Marc E. Robinson
IPC分类号： H01L23/00
CPC分类号： H01L24/83 , H01L23/293 , H01L23/3171 , H01L23/3185 , H01L24/24 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/73 , H01L25/0657 , H01L2224/24145 , H01L2224/24146 , H01L2224/27452 , H01L2224/29005 , H01L2224/29006 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/83191 , H01L2224/8385 , H01L2224/92247 , H01L2225/0651 , H01L2225/06524 , H01L2225/06551 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01038 , H01L2924/01082 , H01L2924/12042 , H01L2924/14 , H01L2924/00 , H01L2924/00012
摘要： A conformal coating on a semiconductor die provides adhesion between the die and a support. No additional adhesive is necessary to affix the die on the support. The conformal coating protects the die during assembly, and serves to electrically insulate the die from electrically conductive parts that the die may contact. The conformal coating may be an organic polymer, such as a parylene, for example. Also, a method for adhering a die onto a support, which may optionally be another die, includes providing a coating of a conformal between the die and the support, and heating the coating between the die and the support. The conformal coating may be provided on a die attach area of a surface of the die, or on a die mount region of a surface of the support, or on both a die attach area of a surface of the die and on a die mount region of a surface of the support; and the conformal coating may be provided following placement of the die on the support.
摘要翻译： 半导体管芯上的保形涂层提供了管芯和支撑件之间的粘附。 不需要额外的粘合剂将模具固定在支撑件上。 共形涂层在组装期间保护模具，并且用于使模具与模具可接触的导电部件电绝缘。 保形涂层可以是有机聚合物，例如聚对二甲苯。 此外，将模具粘附到可任选地是另一个模具的支撑件上的方法包括在模具和支撑件之间提供共形的涂层，以及加热模具和支撑件之间的涂层。 保形涂层可以设置在模具的表面的芯片附着区域上，或在支撑体的表面的模具安装区域上，或者在模具的表面的芯片附着区域上以及模具安装区域 的支撑体的表面; 并且可以在将模具放置在支撑件上之后提供保形涂层。
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公开(公告)号：US20160218088A1
公开(公告)日：2016-07-28
申请号：US15086693
申请日：2016-03-31
申请人： Invensas Corporation
IPC分类号： H01L25/065
CPC分类号： H01L25/0657 , H01L21/56 , H01L23/48 , H01L24/24 , H01L24/80 , H01L24/82 , H01L29/0657 , H01L2224/24145 , H01L2224/32145 , H01L2224/32225 , H01L2224/76155 , H01L2224/82102 , H01L2225/06524 , H01L2225/06551 , H01L2225/06555 , H01L2225/06562 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01033 , H01L2924/01038 , H01L2924/01047 , H01L2924/01067 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/15311 , H01L2924/15787 , H01L2924/00
摘要： Stacked die assemblies are electrically connected to connection sites on any support, without electrical connection to any interposed substrate or leadframe, and without solder.
摘要翻译： 堆叠的模具组件电连接到任何支撑件上的连接部位，而不与任何插入的基板或引线框架电连接，并且没有焊料。
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公开(公告)号：US09252116B2
公开(公告)日：2016-02-02
申请号：US14242206
申请日：2014-04-01
申请人： Invensas Corporation
发明人： Scott Jay Crane , Simon J. S. McElrea , Scott McGrath , Weiping Pan , De Ann Eileen Melcher , Marc E. Robinson
IPC分类号： H01L23/00 , H01L25/065 , H01L23/29
CPC分类号： H01L24/83 , H01L23/293 , H01L23/3171 , H01L23/3185 , H01L24/24 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/73 , H01L25/0657 , H01L2224/24145 , H01L2224/24146 , H01L2224/27452 , H01L2224/29005 , H01L2224/29006 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/83191 , H01L2224/8385 , H01L2224/92247 , H01L2225/0651 , H01L2225/06524 , H01L2225/06551 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01038 , H01L2924/01082 , H01L2924/12042 , H01L2924/14 , H01L2924/00 , H01L2924/00012
摘要： A conformal coating on a semiconductor die provides adhesion between the die and a support. No additional adhesive is necessary to affix the die on the support. The conformal coating protects the die during assembly, and serves to electrically insulate the die from electrically conductive parts that the die may contact. The conformal coating may be an organic polymer, such as a parylene, for example. Also, a method for adhering a die onto a support, which may optionally be another die, includes providing a coating of a conformal between the die and the support, and heating the coating between the die and the support. The conformal coating may be provided on a die attach area of a surface of the die, or on a die mount region of a surface of the support, or on both a die attach area of a surface of the die and on a die mount region of a surface of the support; and the conformal coating may be provided following placement of the die on the support.
摘要翻译： 半导体管芯上的保形涂层提供了管芯和支撑件之间的粘附。 不需要额外的粘合剂将模具固定在支撑件上。 共形涂层在组装期间保护模具，并且用于使模具与模具可接触的导电部件电绝缘。 保形涂层可以是有机聚合物，例如聚对二甲苯。 此外，将模具粘附到可任选地是另一个模具的支撑件上的方法包括在模具和支撑件之间提供共形的涂层，以及加热模具和支撑件之间的涂层。 保形涂层可以设置在模具的表面的芯片附着区域上，或在支撑体的表面的模具安装区域上，或者在模具的表面的芯片附着区域上以及模具安装区域 的支撑体的表面; 并且可以在将模具放置在支撑件上之后提供保形涂层。
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公开(公告)号：US09824999B2
公开(公告)日：2017-11-21
申请号：US14969779
申请日：2015-12-15
申请人： Invensas Corporation
发明人： Scott Jay Crane , Simon J. S. McElrea , Scott McGrath , Weiping Pan , De Ann Eileen Melcher , Marc E. Robinson
IPC分类号： H01L23/00 , H01L25/065 , H01L23/29
CPC分类号： H01L24/83 , H01L23/293 , H01L23/3171 , H01L23/3185 , H01L24/24 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/73 , H01L25/0657 , H01L2224/24145 , H01L2224/24146 , H01L2224/27452 , H01L2224/29005 , H01L2224/29006 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/83191 , H01L2224/8385 , H01L2224/92247 , H01L2225/0651 , H01L2225/06524 , H01L2225/06551 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01038 , H01L2924/01082 , H01L2924/12042 , H01L2924/14 , H01L2924/00 , H01L2924/00012
摘要： A conformal coating on a semiconductor die provides adhesion between the die and a support. No additional adhesive is necessary to affix the die on the support. The conformal coating protects the die during assembly, and serves to electrically insulate the die from electrically conductive parts that the die may contact. The conformal coating may be an organic polymer, such as a parylene, for example. Also, a method for adhering a die onto a support, which may optionally be another die, includes providing a coating of a conformal between the die and the support, and heating the coating between the die and the support. The conformal coating may be provided on a die attach area of a surface of the die, or on a die mount region of a surface of the support, or on both a die attach area of a surface of the die and on a die mount region of a surface of the support; and the conformal coating may be provided following placement of the die on the support.
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