Optical guide with temperature sensing matrix
    1.
    发明授权
    Optical guide with temperature sensing matrix 有权
    带温度传感矩阵的光导

    公开(公告)号:US08591105B2

    公开(公告)日:2013-11-26

    申请号:US11910120

    申请日:2006-04-03

    摘要: The invention relates to an optical element for guiding and forming a laser beam, and to a method for recording beam parameters, particularly in a laser system, comprising a carrier substrate (40) and a coating (39), which is applied to at least one side of the carrier substrate (40), and comprising at least one temperature sensor (38). The temperature sensor (38) is comprised of a number of pixels arranged in a matrix, and each respective pixel has at least one temperature-sensitive element (39). The at least one temperature-sensitive element (39) of the pixel is constructed inside the carrier substrate (40) made of silicon.

    摘要翻译: 本发明涉及一种用于引导和形成激光束的光学元件,以及用于记录光束参数的方法,特别是在激光系统中,包括载体基底(40)和涂层(39),至少应用于 载体基板(40)的一侧,并且包括至少一个温度传感器(38)。 温度传感器(38)由排列成矩阵的多个像素组成,并且各个像素具有至少一个温度敏感元件(39)。 像素的至少一个温度敏感元件(39)被构造在由硅制成的载体衬底(40)的内部。

    OPTICAL GUIDE WITH TEMPERATURE SENSING MATRIX
    2.
    发明申请
    OPTICAL GUIDE WITH TEMPERATURE SENSING MATRIX 有权
    光学指南与温度感应矩阵

    公开(公告)号:US20100296546A1

    公开(公告)日:2010-11-25

    申请号:US11910120

    申请日:2006-04-03

    IPC分类号: G01K13/00 G02B27/09 G02B7/192

    摘要: The invention relates to an optical element for guiding and forming a laser beam, and to a method for recording beam parameters, particularly in a laser system, comprising a carrier substrate (40) and a coating (39), which is applied to at least one side of the carrier substrate (40), and comprising at least one temperature sensor (38). The temperature sensor (38) is comprised of a number of pixels arranged in a matrix, and each respective pixel has at least one temperature-sensitive element (39). The at least one temperature-sensitive element (39) of the pixel is constructed inside the carrier substrate (40) made of silicon.

    摘要翻译: 本发明涉及一种用于引导和形成激光束的光学元件,以及用于记录光束参数的方法,特别是在激光系统中,包括载体基底(40)和涂层(39),至少应用于 载体基板(40)的一侧,并且包括至少一个温度传感器(38)。 温度传感器(38)由排列成矩阵的多个像素组成,并且各个像素具有至少一个温度敏感元件(39)。 像素的至少一个温度敏感元件(39)被构造在由硅制成的载体衬底(40)的内部。