Abstract:
As part of a process for bending workpieces (14), when the workpiece (14) is released from the upper die (8) and/or the lower die (10), the actual size of the bending angle (.beta.) is continually determined; from the actual size of the bending angle (.beta.) found, the change in it is determined and, as soon as the change in the actual size of the bending angle (.beta.) assumes a predetermined value, the actual size of the then existing bending angle (.beta.) is compared with the desired size. On a tooling machine for carrying out the method described, there are scanning elements (17,18) and a device (24) for determining the actual size of the bending angle (.beta.) that are parts of a device (19) for determining the change in the actual size of the bending angle (.beta.). The device (24) for determining the actual size of the bending angle (.beta.) is connected to a comparison device (32) for comparing the actual size of the bending angle (.beta.) to the desired size.
Abstract:
Systems and related methods of programming a laser processing device for automated processing of a workpiece including indicating a processing location on a workpiece with a processing location indicator. The processing location is detected with a processing location detector. The scanner optics of the laser processing device are adjusted to a set position corresponding to the detected processing location. A set position of the scanner optics is detected with a processing location evaluator, and a control program corresponding to the detected set position of the scanner optics is generated with the processing location evaluator.
Abstract:
A laser machine tool includes an analyzer for determining at least one beam characteristic of the laser beam. The guidance system of the laser machine tool moves the laser beam relative to the beam analyzer in the transverse direction to determine at least one beam characteristic of the laser beam, and the numeric control for the machine tool processes the information to control the laser beam in the machining operation.
Abstract:
A method and device for determining the length (b) of at least one of two legs (13, 14), of a workpiece (12) bent toward each other at a bending angle (β) requires location of the workpiece (12) in a defined position. The position of the bending angle vertex (S) and the position of the end (E) of the leg (13, 14) to be measured are determined. Based on the position of the bending angle vertex (S) and of the end (E), the length (b) is calculated as the distance between the bending angle vertex (S) and the end (E). The measuring apparatus includes a system serving to determine the position of the bending angle vertex (S), a unit serving to determine the position of the end (E) and an evaluation unit which, based on the position of the bending angle vertex (S) and of the end (E), calculates the length (b) as the distance between the bending angle vertex (S) and the end (E).
Abstract:
Determination of the relative positioning of a laser machining beam and a process gas jet on a laser machine tool are accomplished by motion of detections made while moving the machining beam and gas jet in relation to a detection element. In some cases actions of the beam and gas jet themselves are detected, such as by cutting light response and sensor deflection caused by the gas jet. Relative head positions at the time of the deflections are used to calculate misalignment between the laser beam and gas jet.
Abstract:
A laser assembly has at least one optic element (6, 8) in the path of the laser beam (5) and at least partially permeable to the laser beam (5). There is at least one component for detecting the temperature of the optic element (6, 8) or which can detect the intensity of the light beamed by the optic element (6, 8). The laser beam (5) can be controlled to influence the temperature of the optic element (6, 8) depending upon the light intensity detected.
Abstract:
Determination of the relative positioning of a laser machining beam and a process gas jet on a laser machine tool are accomplished by motion of detections made while moving the machining beam and gas jet in relation to a detection element. In some cases actions of the beam and gas jet themselves are detected, such as by cutting light response and sensor deflection caused by the gas jet. Relative head positions at the time of the deflections are used to calculate misalignment between the laser beam and gas jet.
Abstract:
The invention relates to an optical element for guiding and forming a laser beam, and to a method for recording beam parameters, particularly in a laser system, comprising a carrier substrate (40) and a coating (39), which is applied to at least one side of the carrier substrate (40), and comprising at least one temperature sensor (38). The temperature sensor (38) is comprised of a number of pixels arranged in a matrix, and each respective pixel has at least one temperature-sensitive element (39). The at least one temperature-sensitive element (39) of the pixel is constructed inside the carrier substrate (40) made of silicon.
Abstract:
Systems and related methods of programming a laser processing device for automated processing of a workpiece including indicating a processing location on a workpiece with a processing location indicator. The processing location is detected with a processing location detector. The scanner optics of the laser processing device are adjusted to a set position corresponding to the detected processing location. A set position of the scanner optics is detected with a processing location evaluator, and a control program corresponding to the detected set position of the scanner optics is generated with the processing location evaluator.
Abstract:
The invention relates to an optical element for guiding and forming a laser beam, and to a method for recording beam parameters, particularly in a laser system, comprising a carrier substrate (40) and a coating (39), which is applied to at least one side of the carrier substrate (40), and comprising at least one temperature sensor (38). The temperature sensor (38) is comprised of a number of pixels arranged in a matrix, and each respective pixel has at least one temperature-sensitive element (39). The at least one temperature-sensitive element (39) of the pixel is constructed inside the carrier substrate (40) made of silicon.