利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

119 条记录 (耗时 0.05 秒)

    Method for preparing amorphous calcium phosphate and oral care composition containing amorphous calcium phosphate prepared by the same
    3.
    发明申请
    Method for preparing amorphous calcium phosphate and oral care composition containing amorphous calcium phosphate prepared by the same 审中-公开
    制备无定形磷酸钙的方法和含有由其制备的无定形磷酸钙的口腔护理组合物

    公开(公告)号：US20100143271A1

    公开(公告)日：2010-06-10

    申请号：US12461942

    申请日：2009-08-28

    申请人： Jen-Chang Yang ,  Dian-Yu Ji ,  Chien-Chung Chen ,  Haw-Ming Huang ,  Sheng-Yang Lee

    发明人： Jen-Chang Yang ,  Dian-Yu Ji ,  Chien-Chung Chen ,  Haw-Ming Huang ,  Sheng-Yang Lee

    IPC分类号： A61K8/21 ,  A61Q11/00 ,  C01B25/26

    CPC分类号： A61K8/987 ,  A61K8/24 ,  A61Q11/00 ,  C01B25/32

    摘要： A method for preparing amorphous calcium phosphate (ACP) and oral care composition containing ACP prepared by the same are disclosed, wherein the method comprises the following steps: (a) cleaning and pulverizing the oyster shells; (b) sintering the oyster shells to obtain a calcium-containing powder; (c) dissolving the calcium-containing powder in water to obtain a calcium-containing solution; and (d) mixing the calcium-containing solution with a other phosphate-containing solution, to produce amorphous calcium phosphate.The method of the present invention not only can simplify the process and reduce the cost, but also can solve the problem of environment pollution resulting from wasted oyster shells. In addition, the ACP prepared in accordance with the method of the present invention further comprises some trace elements, such as strontium (Sr) and fluoride (F), which can improve dental health.

    摘要翻译： 公开了一种制备无定形磷酸钙（ACP）的方法和含有由其制备的ACP的口腔护理组合物，其中该方法包括以下步骤：（a）清洗和粉碎牡蛎壳; （b）烧结牡蛎壳以获得含钙粉末; （c）将含钙粉末溶解在水中以得到含钙溶液; 和（d）将含钙溶液与其它含磷酸盐溶液混合，制成无定形磷酸钙。 本发明的方法不仅可以简化工艺，降低成本，而且可以解决蚝壳浪费造成环境污染的问题。 此外，根据本发明的方法制备的ACP还包含一些可以改善牙齿健康的微量元素，例如锶（Sr）和氟化物（F）。

    Novel Condition Before TMAH Improved Device Performance
    6.
    发明申请
    Novel Condition Before TMAH Improved Device Performance 有权
    TMAH改进设备性能之前的新条件

    公开(公告)号：US20130207218A1

    公开(公告)日：2013-08-15

    申请号：US13396870

    申请日：2012-02-15

    申请人： En-Ting Lee ,  Kun-El Chen ,  Yu-Sheng Wang ,  Chien-Chung Chen ,  Huai-Tei Yang

    发明人： En-Ting Lee ,  Kun-El Chen ,  Yu-Sheng Wang ,  Chien-Chung Chen ,  Huai-Tei Yang

    IPC分类号： H01L31/02

    CPC分类号： H01L31/0352 ,  H01L21/26513 ,  H01L27/1446 ,  H01L27/1464 ,  H01L27/14643 ,  H01L27/14687

    摘要： The present disclosure relates to a method of forming a back-side illuminated CMOS image sensor (BSI CIS). In some embodiments, the method comprises forming a plurality of photodetectors within a front-side of a semiconductor substrate. An implant is performed on the back-side of the semiconductor substrate to form an implantation region having a doping concentration that is greater in the center than at the edges of the semiconductor substrate. The back-side of the workpiece is then exposed to an etchant, having an etch rate that is inversely proportional to the doping concentration, which thins the semiconductor substrate to a thickness that allows for light to pass through the back-side of the substrate to the plurality of photodetectors. By implanting the substrate prior to etching, the etching rate is made uniform over the back- side of the substrate improving total thickness variation between the photodetectors and the back-side of the substrate.

    摘要翻译： 本公开涉及形成背面照明CMOS图像传感器（BSI CIS）的方法。 在一些实施例中，该方法包括在半导体衬底的正面内形成多个光电探测器。 在半导体衬底的背面进行注入，以形成掺杂浓度在中心比在半导体衬底的边缘处大的掺杂浓度。 然后将工件的背面暴露于蚀刻剂，其蚀刻速率与掺杂浓度成反比，该掺杂浓度将半导体衬底沉积到允许光通过衬底的背面的厚度到 多个光检测器。 通过在蚀刻之前植入基板，使蚀刻速率在基板的背面上均匀，从而提高光电检测器与基板的背面之间的总厚度变化。

    Sub-micron adjustable mount for supporting a component and method
    7.
    发明授权
    Sub-micron adjustable mount for supporting a component and method 失效
    用于支撑元件和方法的亚微米可调支架

    公开(公告)号：US08243375B2

    公开(公告)日：2012-08-14

    申请号：US12689188

    申请日：2010-01-18

    申请人： Nathan G. Woodard ,  Eric C. Johnson ,  Jon F. Nielsen ,  Joseph R. Demers ,  Chien-Chung Chen

    发明人： Nathan G. Woodard ,  Eric C. Johnson ,  Jon F. Nielsen ,  Joseph R. Demers ,  Chien-Chung Chen

    IPC分类号： G02B7/02

    CPC分类号： G02B7/00

    摘要： An optical assembly includes a light path and at least one optic to be positioned in the path. A support arrangement supports the optic having a foot arrangement including at least one foot that receives a direct manipulation with the foot slidingly engaged against a support surface to move the optic relative to the light path. Movement of the foot may move the optic along a predetermined path. The foot defines a footprint for engaging the support surface and receives the direct manipulation in a way which changes the footprint on the support surface to move the optic responsive to changes in the footprint. A movement arrangement may selectively bias the foot against the support surface during a movement mode, intended to permit movement of the foot against the support surface, and in a locked mode, intended to lock the foot against the support surface.

    摘要翻译： 光学组件包括光路和要定位在路径中的至少一个光学元件。 支撑装置支撑光学元件，其具有足部布置，其包括至少一个脚，其接收直接操纵，脚与滑​​动地抵靠支撑表面接合以相对于光路移动光学元件。 脚的运动可以沿着预定的路径移动光学元件。 脚定义了用于接合支撑表面的足迹，并且以一种方式接收直接操纵，其改变了支撑表面上的占地面积，以响应于占地面积的变化来移动光学器件。 移动装置可以在移动模式期间选择性地将脚抵靠支撑表面偏置，以允许脚抵靠支撑表面移动，并且处于锁定模式，以将脚锁定在支撑表面上。

    Integrated circuit with power control and power control method thereof
    8.
    发明授权
    Integrated circuit with power control and power control method thereof 有权
    具有功率控制及其功率控制方法的集成电路

    公开(公告)号：US07831847B2

    公开(公告)日：2010-11-09

    申请号：US11744898

    申请日：2007-05-07

    申请人： Wei-Jen Chen ,  Chien-Chung Chen ,  Hung-Der Lin ,  Siou-Shen Lin ,  Ching-hsiang Liao

    发明人： Wei-Jen Chen ,  Chien-Chung Chen ,  Hung-Der Lin ,  Siou-Shen Lin ,  Ching-hsiang Liao

    IPC分类号： G06F1/00 ,  G06F1/26 ,  G06F1/32

    CPC分类号： G06F1/3203 ,  G06F9/4418 ,  Y02D10/44

    摘要： Power management methods for integrated circuits are disclosed. A system core block is disposed in a chip and comprises a central processing unit. A power control block is disposed in the chip and comprises a power management mechanism coupled to a power supply to control the supply of power to the system core block. The power management mechanism outputs a power down signal and stops supply of power to the system core block according to a power saving mode setting signal from the central processor unit and starts the supply of power to the system core block according to a power saving mode release signal.

    摘要翻译： 公开了集成电路的电源管理方法。 系统核心块设置在芯片中并且包括中央处理单元。 功率控制块设置在芯片中，并且包括耦合到电源的功率管理机构，以控制对系统核心块的供电。 功率管理机构根据来自中央处理器单元的省电模式设定信号输出掉电信号，停止对系统核心块的供电，并根据省电模式释放开始向系统核心块供电 信号。

    ASSEMBLED LIGHT-GUIDING MODULE WITH HIGH LIGHT-GUIDING EFFICIENCY
    9.
    发明申请
    ASSEMBLED LIGHT-GUIDING MODULE WITH HIGH LIGHT-GUIDING EFFICIENCY 失效
    具有高光引导效率的组装指导模块

    公开(公告)号：US20100110717A1

    公开(公告)日：2010-05-06

    申请号：US12500261

    申请日：2009-07-09

    申请人： Chien-Chung Chen

    发明人： Chien-Chung Chen

    IPC分类号： G02B6/00

    CPC分类号： G02B6/001

    摘要： An assembled light-guiding module with high light-guiding efficiency is composed of a plurality of light-guiding structures. Each light-guiding structure includes a light-guiding body unit and a light-reflecting microstructure unit. The light-guiding body unit has a light-guiding portion, at least one concave light-entering portion is formed on one end of the light-guiding portion, and a hollow portion is formed on a plane surface of the light-guiding portion. The light-reflecting microstructure unit has a plurality of light-reflecting microstructures disposed in the hollow portion. Thereby, the light-guiding structures are assembled to form a light pipe, wherein the concave light-entering portions are mated to form a light-entering groove on one end of the light pipe, and the hollow portions are mated to form a cavity space that is embedded in the light pipe.

    摘要翻译： 具有高导光效率的组装导光模块由多个导光结构组成。 每个导光结构包括导光体单元和光反射微结构单元。 导光体单元具有导光部，在导光部的一端形成有至少一个凹入光入射部，在导光部的平面上形成有中空部。 光反射微结构单元具有设置在中空部分中的多个光反射微结构。 由此，导光结构被组装形成光管，其中凹入的光入射部分配合以在光管的一端上形成入光槽，并且将中空部分配合形成空腔 嵌入在光管中。