APPARATUS AND METHOD FOR SURFACE PROCESSING
    1.
    发明申请
    APPARATUS AND METHOD FOR SURFACE PROCESSING 审中-公开
    用于表面处理的装置和方法

    公开(公告)号:US20110305846A1

    公开(公告)日:2011-12-15

    申请号:US12885018

    申请日:2010-09-17

    摘要: The present disclosure provides a surface processing apparatus, comprising a reaction chamber provided to form a deposition layer on a substrate, a carrying chamber connected to the reaction chamber and comprising a slot, and a plasma generator installed in the slot and providing plasma to process the substrate surface. Whereby the disclosure further provides a surface processing method, which flatten surface of a deposition layer on the substrate when the substrate is carried form the reaction chamber to the carrying chamber after the deposition process in the reaction chamber.

    摘要翻译: 本公开提供了一种表面处理装置,其包括设置成在基板上形成沉积层的反应室,连接到反应室并包括槽的承载室和安装在槽中的等离子体发生器,并提供等离子体以处理 基材表面。 因此,本公开进一步提供了一种表面处理方法,当在反应室中沉积工艺之后,当衬底被承载形成反应室至承载室时,使衬底上的沉积层的表面变平。