摘要:
An integrated circuit (IC) device includes a fin-type active region formed in a substrate, a step insulation layer on at least one sidewall of the fin-type active region, and a first high-level isolation layer on the at least one sidewall of the fin-type active region. The fin-type active region protrudes from the substrate and extending in a first direction parallel to a main surface of the substrate, includes a channel region having a first conductivity type, and includes the stepped portion. The step insulation layer contacts the stepped portion of the fin-type active region. The step insulation layer is between the first high-level isolation layer and the at least one sidewall of the fin-type active region. The first high-level isolation layer extends in a second direction that is different from the first direction.
摘要:
An integrated circuit device includes first and second fin-type active regions having different conductive type channel regions, a first device isolation layer covering both sidewalk of the first fin-type active region, and a second device isolation layer covering both sidewalls of the second fin-type active region. The first device isolation layer and the second device isolation layer have different stack structures. To manufacture the integrated circuit device, the first device isolation layer covering both sidewalls of the first fin-type active region and the second device isolation layer covering both sidewalk of the second fin-type active region are formed after the first fin-type active region and the second fin-type active region are formed. The first device isolation layer and the second device isolation layer are formed to have different stack structure.
摘要:
An integrated circuit device includes first and second fin-type active regions having different conductive type channel regions, a first device isolation layer covering both sidewalk of the first fin-type active region, and a second device isolation layer covering both sidewalls of the second fin-type active region. The first device isolation layer and the second device isolation layer have different stack structures. To manufacture the integrated circuit device, the first device isolation layer covering both sidewalls of the first fin-type active region and the second device isolation layer covering both sidewalk of the second fin-type active region are formed after the first fin-type active region and the second fin-type active region are formed. The first device isolation layer and the second device isolation layer are formed to have different stack structure.
摘要:
Integrated circuit devices are provided. An integrated circuit device includes a substrate having first and second fin-shaped Field Effect Transistor (FinFET) bodies protruding from the substrate. The first and second FinFET bodies have different respective first and second shapes in a first region and a second region, respectively, of the integrated circuit device.
摘要:
An integrated circuit device includes a substrate, first and second fin-type active areas which extend in a first direction on the substrate, first and second gate lines on the substrate that extend in a second direction that crosses the first direction, and first and second contact structures. The first and second gate lines intersect the first and second fin-type active areas, respectively. The first contact structure is on the first fin-type active area at a side of the first gate line and contacts the first gate line. The second contact structure is on the second fin-type active area at a side of the second gate line. The first contact structure includes a first lower contact including metal silicide and a first upper contact on the first lower contact. The second contact structure includes a second lower contact including metal silicide and a second upper contact on the second lower contact.
摘要:
An integrated circuit device can include a substrate having a first area and a second area and a pair of first fin-shaped active areas each having a first shape protruding from the first area in a first direction, adjacent to each other, and extending in a straight line. A fin separation insulating film can be between the pair of first fin-shaped active areas in the first area and a second fin-shaped active area can protrude from the second area in the first direction and have a second shape that is different from the first shape, wherein respective widths of each of the pair of first fin-shaped active areas are less than a corresponding width of the second fin-shaped active area.
摘要:
Integrated circuit devices are provided. An integrated circuit device includes a substrate having first and second fin-shaped Field Effect Transistor (FinFET) bodies protruding from the substrate. The first and second FinFET bodies have different respective first and second shapes in a first region and a second region, respectively, of the integrated circuit device.