Method for preparing sterically hindered phosphoramidates
    1.
    发明授权
    Method for preparing sterically hindered phosphoramidates 有权
    空间位阻氨基磷酸酯的制备方法

    公开(公告)号:US06291700B1

    公开(公告)日:2001-09-18

    申请号:US09538882

    申请日:2000-03-30

    IPC分类号: C07F908

    CPC分类号: C07F9/2458

    摘要: Sterically hindered phosphoramidates such as N,N′-bis[di-(2,6-xylyl)phosphoryl]piperazine are prepared by the reaction of a sterically hindered diaryl chlorophosphate, such as di-(2,6-xylyl) chlorophosphate, with a basic nitrogen compound containing at least two basic N—H groups, preferably a heterocyclic compound such as piperazine, in the presence of an acid acceptor such as triethylamine. The reaction is conducted in methylene chloride or an aromatic hydrocarbon such as toluene as solvent. If an aromatic hydrocarbon is employed, there is also present at least one dipolar aprotic nitrogen compound, such as 4-dimethylaminopyridine, in an amount effective to increase the reaction rate.

    摘要翻译: 通过空间位阻的二芳基氯磷酸酯如二(2,6-二甲苯基)氯磷酸酯与二(2,6-二甲苯基)磷酸二磷酸酯的反应与N,N'-双[二(2,6-二甲苯基)磷酰基]哌嗪 在酸受体如三乙胺的存在下,含有至少两个碱性NH基团,优选杂环化合物如哌嗪的碱性氮化合物。 该反应在二氯甲烷或芳族烃如甲苯中作为溶剂进行。 如果使用芳族烃,则还存在有效提高反应速率的量的至少一种偶极非质子氮化合物,如4-二甲基氨基吡啶。

    Underfill composition and packaged solid state device
    8.
    发明授权
    Underfill composition and packaged solid state device 有权
    底部填充成分和包装固态装置

    公开(公告)号:US07279223B2

    公开(公告)日:2007-10-09

    申请号:US10737453

    申请日:2003-12-16

    摘要: An underfill composition with enhanced adhesion and improved resistance to cracking comprising an epoxy resin in combination with a difunctional siloxane anhydride epoxy hardener and optional reagents. In some embodiments, the epoxy resin includes a functionalized colloidal silica filler having a particle size ranging from about 1 nm to about 500 nm. The difunctional siloxane anhydride epoxy hardener can optionally be combined with liquid anhydride epoxy hardeners. Cure catalysts, hydroxyl-containing monomers, adhesion promoters, flame retardants and defoaming agents may also be added to the composition. Further embodiments of the present disclosure include packaged solid state devices comprising the underfill compositions.

    摘要翻译: 具有增强的粘附性和改善的抗开裂性的底部填充剂组合物,其包含环氧树脂与双官能硅氧烷酐环氧固化剂和任选试剂的组合。 在一些实施方案中,环氧树脂包括粒度范围为约1nm至约500nm的官能化胶体二氧化硅填料。 双官能硅氧烷酐环氧固化剂可以任选地与液体酐环氧固化剂组合。 固化催化剂,含羟基单体,粘合促进剂,阻燃剂和消泡剂也可以加入到组合物中。 本公开的另外的实施方案包括包含底部填充剂组合物的包装的固态装置。