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17 条记录 (耗时 0.03 秒)

    Fill material for dual damascene processes
    1.
    发明授权
    Fill material for dual damascene processes 有权
    填充双镶嵌工艺的材料

    公开(公告)号：US06391472B1

    公开(公告)日：2002-05-21

    申请号：US09931264

    申请日：2001-08-16

    申请人： James E. Lamb, III ,  Xie Shao

    发明人： James E. Lamb, III ,  Xie Shao

    IPC分类号： B21D3900

    CPC分类号： H01L21/76808 ,  H01L21/312 ,  Y10T428/12556 ,  Y10T428/24802

    摘要： An improved via and contact hole fill composition and method for using the composition in the dual damascene production of circuits is provided. Broadly, the fill compositions include a quantity of solid components including a polymer binder and a solvent system for the solid components. The boiling point of the solvent system is less than the cross-linking temperature of the composition. Preferred solvents for use in the solvent system include those selected from the group consisting of alcohols, ethers, glycol ethers, amides, ketones, and mixtures thereof. Preferred polymer binders are those having an aliphatic backbone and a molecular weight of less than about 80,000, with polyesters being particularly preferred. In use, the fill composition is applied to the substrate surfaces forming the contact or via holes as well as to the substrate surfaces surrounding the holes, followed by heating to the composition reflow temperature so as to cause the composition to uniformly flow into and cover the hole-forming surfaces and substrate surfaces. The composition is then cured, and the remainder of the dual damascene process is carried out.

    摘要翻译： 提供了一种改进的通孔和接触孔填充组合物以及在双镶嵌生产电路中使用该组合物的方法。 广泛地，填充组合物包括一定量的固体组分，包括聚合物粘合剂和固体组分的溶剂体系。 溶剂系统的沸点小于组合物的交联温度。 用于溶剂系统的优选溶剂包括选自醇，醚，二醇醚，酰胺，酮及其混合物的那些溶剂。 优选的聚合物粘合剂是具有脂族主链且分子量小于约80,000的聚合物粘合剂，特别优选聚酯。 在使用中，将填充组合物施加到形成接触或通孔的基底表面以及围绕孔的基底表面，随后加热到组成回流温度，以使组合物均匀地流入并覆盖 孔形成表面和基底表面。 然后将组合物固化，并进行双镶嵌工艺的其余部分。

    Anti-reflective coating of polymer with epoxide rings reacted with light attenuating compound and unreacted epoxide rings
    2.
    发明授权
    Anti-reflective coating of polymer with epoxide rings reacted with light attenuating compound and unreacted epoxide rings 有权
    具有环氧化物环的聚合物的抗反射涂层与光衰减化合物和未反应的环氧化物环反应

    公开(公告)号：US06670425B2

    公开(公告)日：2003-12-30

    申请号：US09874783

    申请日：2001-06-05

    申请人： Rama Puligadda ,  James E. Lamb, III ,  Tony D. Flaim ,  Runhui Huang ,  Xie Shao

    发明人： Rama Puligadda ,  James E. Lamb, III ,  Tony D. Flaim ,  Runhui Huang ,  Xie Shao

    IPC分类号： B32B2706

    CPC分类号： G03F7/091 ,  Y10S438/952 ,  Y10T428/31511 ,  Y10T428/31525

    摘要： Anti-reflective compositions and methods of using those compositions with low dielectric constant materials are provided. In one embodiment, the compositions include polymers comprising recurring monomers having unreacted epoxide groups. In another embodiment, the polymers further comprise recurring monomers comprising epoxide rings reacted with a light attenuating compound so as to open the ring. The compositions can be applied to dielectric layers so as to minimize or prevent reflection during the dual damascene process while simultaneously blocking via or photoresist poisoning which commonly occurs when organic anti-reflective coatings are applied to low dielectric constant layers.

    摘要翻译： 提供抗反射组合物和使用具有低介电常数材料的那些组合物的方法。 在一个实施方案中，组合物包括包含具有未反应的环氧基团的重复单体的聚合物。 在另一个实施方案中，聚合物还包含包含与光衰减化合物反应以便打开环的环氧化物环的重复单体。 组合物可以施加到电介质层，以便在双镶嵌工艺期间最小化或防止反射，同时阻挡当将有机抗反射涂层施加到低介电常数层时通常发生的通孔或光致抗蚀剂中毒。

    Crosslinkable fill compositions for uniformly protecting via and contact holes
    4.
    发明授权
    Crosslinkable fill compositions for uniformly protecting via and contact holes 有权
    用于均匀保护通孔和接触孔的可交联填充组合物

    公开(公告)号：US07998318B2

    公开(公告)日：2011-08-16

    申请号：US10964288

    申请日：2004-10-13

    申请人： James E. Lamb, III ,  Xie Shao

    发明人： James E. Lamb, III ,  Xie Shao

    IPC分类号： H01L21/28 ,  H01L21/302 ,  H01L21/3065 ,  H01L21/3205 ,  H01L21/312 ,  H01L21/4763 ,  H01L21/768

    CPC分类号： H01L21/02118 ,  H01L21/02282 ,  H01L21/312 ,  H01L21/76808 ,  Y10T428/31663 ,  Y10T428/31667 ,  Y10T428/31692

    摘要： A via and contact hole fill composition and method for using the composition in the dual damascene production of circuits is provided. Broadly, the fill compositions include a quantity of solid components including a polymer binder and a solvent system for the solid components. The boiling point of the solvent system is less than the cross-linking temperature of the composition. Preferred solvents for use in the solvent system include those selected from the group consisting of alcohols, ethers, glycol ethers, amides, ketones, and mixtures thereof. Preferred polymer binders are those having an aliphatic backbone and a molecular weight of less than about 80,000, with polyesters being particularly preferred. In use, the fill composition is applied to the substrate surfaces forming the contact or via holes as well as to the substrate surfaces surrounding the holes, followed by heating to the composition reflow temperature so as to cause the composition to uniformly flow into and cover the hole-forming surfaces and substrate surfaces. The composition is then cured, and the remainder of the dual damascene process is carried out.

    摘要翻译： 提供了一种通孔和接触孔填充组合物和在双镶嵌生产电路中使用组合物的方法。 广泛地，填充组合物包括一定量的固体组分，包括聚合物粘合剂和固体组分的溶剂体系。 溶剂系统的沸点小于组合物的交联温度。 用于溶剂系统的优选溶剂包括选自醇，醚，二醇醚，酰胺，酮及其混合物的那些溶剂。 优选的聚合物粘合剂是具有脂族主链且分子量小于约80,000的聚合物粘合剂，特别优选聚酯。 在使用中，将填充组合物施加到形成接触或通孔的基底表面以及围绕孔的基底表面，随后加热到组成回流温度，以使组合物均匀地流入并覆盖 孔形成表面和基底表面。 然后将组合物固化，并进行双镶嵌工艺的其余部分。

    Fill material for dual damascene processes
    5.
    发明授权
    Fill material for dual damascene processes 有权

    公开(公告)号：US07026237B2

    公开(公告)日：2006-04-11

    申请号：US10759447

    申请日：2004-01-16

    申请人： James E. Lamb, III ,  Xie Shao

    发明人： James E. Lamb, III ,  Xie Shao

    IPC分类号： H01L21/4763

    CPC分类号： H01L21/76808 ,  H01L21/312 ,  Y10T428/12556 ,  Y10T428/24802

    摘要： An improved via and contact hole fill composition and method for using the composition in the dual damascene production of circuits is provided. Broadly, the fill compositions include a quantity of solid components including a polymer binder and a solvent system for the solid components. The boiling point of the solvent system is less than the cross-linking temperature of the composition. Preferred solvents for use in the solvent system include those selected from the group consisting of alcohols, ethers, glycol ethers, amides, ketones, and mixtures thereof. Preferred polymer binders are those having an aliphatic backbone and a molecular weight of less than about 80,000, with polyesters being particularly preferred. In use, the fill composition is applied to the substrate surfaces forming the contact or via holes as well as to the substrate surfaces surrounding the holes, followed by heating to the composition reflow temperature so as to cause the composition to uniformly flow into and cover the hole-forming surfaces and substrate surfaces. The composition is then cured, and the remainder of the dual damascene process is carried out.

    Crosslinkable fill compositons for uniformly protecting via and contact holes
    8.
    发明申请
    Crosslinkable fill compositons for uniformly protecting via and contact holes 有权
    可交联填料组合物，用于均匀保护孔和接触孔

    公开(公告)号：US20050159520A1

    公开(公告)日：2005-07-21

    申请号：US10964288

    申请日：2004-10-13

    申请人： James Lamb ,  Xie Shao

    发明人： James Lamb ,  Xie Shao

    IPC分类号： H01L21/312 ,  H01L21/768 ,  C08K5/17

    CPC分类号： H01L21/02118 ,  H01L21/02282 ,  H01L21/312 ,  H01L21/76808 ,  Y10T428/31663 ,  Y10T428/31667 ,  Y10T428/31692

    摘要： A via and contact hole fill composition and method for using the composition in the dual damascene production of circuits is provided. Broadly, the fill compositions include a quantity of solid components including a polymer binder and a solvent system for the solid components. The boiling point of the solvent system is less than the cross-linking temperature of the composition. Preferred solvents for use in the solvent system include those selected from the group consisting of alcohols, ethers, glycol ethers, amides, ketones, and mixtures thereof. Preferred polymer binders are those having an aliphatic backbone and a molecular weight of less than about 80,000, with polyesters being particularly preferred. In use, the fill composition is applied to the substrate surfaces forming the contact or via holes as well as to the substrate surfaces surrounding the holes, followed by heating to the composition reflow temperature so as to cause the composition to uniformly flow into and cover the hole-forming surfaces and substrate surfaces. The composition is then cured, and the remainder of the dual damascene process is carried out.

    摘要翻译： 提供了一种通孔和接触孔填充组合物和在双镶嵌生产电路中使用组合物的方法。 广泛地，填充组合物包括一定量的固体组分，包括聚合物粘合剂和固体组分的溶剂体系。 溶剂系统的沸点小于组合物的交联温度。 用于溶剂系统的优选溶剂包括选自醇，醚，二醇醚，酰胺，酮及其混合物的那些溶剂。 优选的聚合物粘合剂是具有脂族主链且分子量小于约80,000的聚合物粘合剂，特别优选聚酯。 在使用中，将填充组合物施加到形成接触或通孔的基底表面以及围绕孔的基底表面，随后加热到组成回流温度，以使组合物均匀地流入并覆盖 孔形成表面和基底表面。 然后将组合物固化，并进行双镶嵌工艺的其余部分。