Manufacture of carbon/carbon composites by hot pressing
    2.
    发明申请
    Manufacture of carbon/carbon composites by hot pressing 审中-公开
    通过热压制造碳/碳复合材料

    公开(公告)号:US20050003037A1

    公开(公告)日:2005-01-06

    申请号:US10760946

    申请日:2004-01-20

    摘要: A mixture of carbon-containing fibers, such as mesophase or isotropic pitch fibers, and a suitable matrix material, such as a milled pitch, is compressed while resistively heating the mixture to form a carbonized composite material having a density of about 1.5 g/cm3, or higher. The composite material is formed in under ten minutes. This is a significantly shorter time than for conventional processes, which typically take several days and achieve a lower density material. Consequently, carbon/carbon composite materials having final densities of about 1.6-1.8 g/cm3, or higher are readily achieved with one or two infiltration cycles using a pitch or other carbonaceous material to fill voids in the composite and rebaking.

    摘要翻译: 将含碳纤维如中间相或各向同性沥青纤维以及适当的基质材料如磨碎沥青的混合物压缩,同时电阻加热混合物以形成密度为约1.5g / cm 2的碳化复合材料 <3>或更高。 复合材料在10分钟内形成。 这比通常需要几天并实现较低密度材料的常规工艺明显更短的时间。 因此,通过使用沥青或其他含碳材料填充复合材料中的空隙并进行重新组装,可以通过一次或两次渗透循环,容易地实现最终密度为约1.6-1.8g / cm 3或更高的碳/碳复合材料。

    Bonding of receiver to camera based mobile device having connectivity
    5.
    发明授权
    Bonding of receiver to camera based mobile device having connectivity 有权
    将接收机绑定到具有连接性的基于摄像机的移动设备

    公开(公告)号:US09392430B2

    公开(公告)日:2016-07-12

    申请号:US13093215

    申请日:2011-04-25

    申请人: Richard Lewis

    发明人: Richard Lewis

    IPC分类号: H04B7/00 H04W4/20

    摘要: A mobile device is bonded to a controllable device by reading a code on the controllable device, banding the mobile device to the controllable device by use of the code, and transmitting a remote control signal from the mobile device to control a controllable function of the bonded controllable device so that only the bonded controllable device responds to the remote control signal by performing the controllable function.

    摘要翻译: 移动设备通过读取可控设备上的代码而被绑定到可控设备,通过使用代码将移动设备绑定到可控设备,以及从移动设备发送遥控信号,以控制绑定的可控功能 可控制装置,使得只有结合的可控制装置通过执行可控功能来响应遥控信号。

    METHODS AND SYSTEMS FOR FAST PCR HEATING
    8.
    发明申请
    METHODS AND SYSTEMS FOR FAST PCR HEATING 有权
    快速PCR加热的方法和系统

    公开(公告)号:US20120214207A1

    公开(公告)日:2012-08-23

    申请号:US13329183

    申请日:2011-12-16

    IPC分类号: C12M1/40 C12P19/34

    摘要: A microplate for polymerase chain reaction (PCR) comprises a substrate having a metallic material for heating PCR samples, and a barrier layer disposed adjacent to the substrate. In some cases, the barrier layer is formed of a first polymeric material. The microplate includes one or more wells for containing PCR samples. The one or more wells are formed of a second polymeric material sealed to the barrier layer. In some cases, the substrate can provide a PCR ramp rate of at least about 5° C./second.

    摘要翻译: 用于聚合酶链反应(PCR)的微孔板包括具有用于加热PCR样品的金属材料的底物和与基底相邻设置的阻挡层。 在一些情况下,阻挡层由第一聚合物材料形成。 微孔板包括一个或多个用于含有PCR样品的孔。 一个或多个孔由密封到阻挡层的第二聚合材料形成。 在一些情况下,底物可以提供至少约5℃/秒的PCR斜率。

    Camera, encoder, and modulator in same enclosure
    9.
    发明授权
    Camera, encoder, and modulator in same enclosure 有权
    摄像机,编码器和调制器在同一个机箱中

    公开(公告)号:US07969474B2

    公开(公告)日:2011-06-28

    申请号:US11710360

    申请日:2007-02-23

    申请人: Richard Lewis

    发明人: Richard Lewis

    IPC分类号: H04N5/228 H04N9/64

    CPC分类号: H04N5/225 H04N21/4223

    摘要: An RF signal source having a camera that provides a camera output, an encoder that encodes the camera output in a compressed digital format, and a modulator that digitally encodes and modulates the compressed camera output and that provides the digitally encoded, modulated, and compressed camera output as an RF output of the RF signal source. The camera, the encoder, and the modulator may be contained in an enclosure. Additionally or alternatively, the encoder, the modulator, and at least part of the camera may be formed on a semiconductor substrate.

    摘要翻译: 具有提供相机输出的相机的RF信号源,以压缩数字格式编码相机输出的编码器以及对压缩的相机输出进行数字编码和调制并且提供数字编码的调制和压缩的相机的调制器 作为RF信号源的RF输出输出。 相机,编码器和调制器可以包含在外壳中。 附加地或替代地,编码器,调制器和照相机的至少一部分可以形成在半导体衬底上。