摘要:
A stator core for a dynamoelectric machine includes two pairs of dovetail slots disposed at respective predetermined radial positions in each armature slot. All stator slots contain armature bars. A few equally spaced stator slots also contain "P" bars atop or radially inward from armature bars. Wedges are installed in the radially outer dovetail slots of stator slots containing only armature bars. Wedges are installed in radially inner dovetail slots in stator slots containing both armature bars and "P" bars.
摘要:
A coil assembly includes a first winding for circumferentially surrounding at least a portion of a leg of a transformer core, a second winding spaced from and circumferentially surrounding at least a portion of the first winding, first supports, such as axially extending insulative rods, disposed between the first and second winding, for inhibiting axial motion of the second winding relative to the first winding and a second support disposed about at least a portion of the outer periphery of the second winding for inhibiting radial motion of the second winding relative to the first winding. Encapsulating material, such as an epoxy resin having glass fibers disposed therethrough, is disposed between the first winding and the leg, between the first and second winding and disposed about the second support for forming a monolithic structure. In a transformer including such a coil assembly, the leg and conductors forming the windings may be fluid cooled. In a method for forming a coil assembly, the encapsulating material is flowed from the bottom of the assembly to fill spaces and to avoid formation of bubbles therein before curing.
摘要:
An improved support system for "P" bars is disclosed, wherein the "P" bar is mounted in a stator slot of the stator core of a dynamoelectric machine which has an integral excitation system. The support system includes a number of elements, all of which, in combination, serve to secure the "P" bars in the slots of the stator core and, additionally, provide a low friction interface between the "P" bar and the support system such that the "P" bar is independently suspended and is actually capable of slight movement along its longitudinal axis.
摘要:
Embodiments of the present disclosure include methods and systems for a catheter assembly including a catheter shaft, a balloon positioned on the catheter shaft, where the balloon has a first balloon waist, a first lead extending longitudinally through the catheter shaft, and a first sealing member adjacent the first balloon waist and coupled to the first lead, where the first lead can provide electrical current to reversibly transition the first sealing member from a nonactivated state to an activated state in response to a temperature change in the first sealing member, and where at least a portion of the balloon rotates relative the catheter shaft in the nonactivated state and the first sealing member engages the first balloon waist to form a fluid tight seal and to prevent rotation of the balloon relative the catheter shaft in the activated state.
摘要:
Embodiments of the present disclosure include methods and systems for a catheter assembly including a catheter shaft, a balloon positioned on the catheter shaft, where the balloon has a first balloon waist, a first lead extending longitudinally through the catheter shaft, and a first sealing member adjacent the first balloon waist and coupled to the first lead, where the first lead can provide electrical current to reversibly transition the first sealing member from a nonactivated state to an activated state in response to a temperature change in the first sealing member, and where at least a portion of the balloon rotates relative the catheter shaft in the nonactivated state and the first sealing member engages the first balloon waist to form a fluid tight seal and to prevent rotation of the balloon relative the catheter shaft in the activated state.
摘要:
A communications apparatus and method use tapped delay lines as multiplexers and demultiplexers. In one embodiment, a receiver (100) uses a tapped delay line (110) as a demultiplexer to acquire a burst communication at very high data rates in the range of 2.5 to 80 Gbps with low preamble overhead. A sliding window correlator (114) continually samples the delay line (110) to determine when a PN encoded word is contained therein. The transmission frequency is pre-acquired before any data is present through the use of a ring oscillator frequency calibration loop (130) that is imbedded within the tapped delay line (110).
摘要:
The image scanning system (52) of the present invention scans slides and film strips containing photographic images and creates a corresponding plurality of digital representations of the photographic images. The system (52) includes a touch screen monitor (96), a computer (54), a scanner (62), a high speed interface (112) and a printer (98). The scanner (62) includes a light source (172) for projecting light through the film strip. A light sensor (124) senses the light projected through the film strip and generates pixel data. A film drive advances the film strip between the light source (172) and the light sensor (124). A lens located between the light source and the light sensor directs the light projected through the film strip onto the light sensor (124). The pixel data is transmitted through the high speed interface (112) to the computer (54) for processing operations. After the pixel data has been processed, digital images are displayed on the monitor (96) and may also be printed out.
摘要:
A semiconductor device, a microelectromechanical system package and a method of making the same utilize high performance vias for vertical IC packaging. A semiconductor die of the device/package has a substrate with integrated circuitry formed on a front side of the substrate. A metal bonding pad overlies the substrate on the front side of the substrate and is electrically connected to the integrated circuitry. A solder bump is located on the metal bonding pad. An electrically conductive via extends through the substrate from the metal bonding pad to a back side of the substrate where the via forms a side wall of a via hole. A plurality of the substrates are stacked on one another with the outer end of the solder bump of one substrate fitting within the via hole of an adjacent substrate. During reflow soldering, surface tension forces of the molten solder bump self-align the substrates.
摘要:
An extended play radio video cassette recorder (EPRVCR) capable of receiving and recording audio and video signals transmitted over a radio frequency channel is provided. The EPRVCR includes a videocassette recorder (VCR) and a tuner capable of receiving of radio frequency signals and television frequency signals electrically connected to the VCR. Method for broadcasting and receiving a composite video and audio signal over a radio frequency for subsequent recording by an extended play radio video cassette recorder is also provided. The method includes the steps of providing a VCR having a tuner capable of receiving radio frequency signals; broadcasting audio on a preselected baseband radio frequency; broadcasting a visual image on a subcarrier sideband of the preselected baseband frequency; and receiving the audio and visual image using the tuner of the VCR. The VCR is also capable of recording the audio and video image simultaneously onto a single video cassette. The EPRVCR is also capable of playing the audio and visual image through the VCR for display on a monitor. In an embodiment, the tuner is a direct digital frequency synthesis tuner.
摘要:
The chip-to-board (or chip-to-MCM) connection assembly and method therefor features a semiconductor chip (31) having a front surface (31f) on which external terminal pads are provided; a board or MCM (32) having a surface (e.g., a recessed surface) at a first side thereof to which the rear surface (31r) of the chip is affixed; and a connection carrier (33), disposed as an overlay, which electrically links the chip and the board or MCM. In this assembly scheme, the connection carrier (e.g., a bump carrier) which is affixed to both the chip and the board or MCM, contains all required signal line tracings (57) to provide the electrical interconnection between the semiconductor chip and the board or MCM. The bump carrier replaces all bond wires (24) and the like and can include support/control circuitry, passive and/or active, associated with, for example, high-speed/high-power IC chips (51). The connection carrier (33) is provided with the electrical contacts (34) such as bump electrodes each interconnecting a contact location (37) at the surface side of the connection carrier facing the semiconductor chip and the oppositely disposed (i) external pad on the chip or (ii) external pad or landing (35) at a side of the board (32) facing the connection carrier (33). Heat generated during operation is released through the rear side of the semiconductor chip (31r), which is affixed to the board or MCM (32).