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    METHODS OF FORMING SOLID LUBRICANT COATINGS ON SUBSTRATES
    7.
    发明申请
    METHODS OF FORMING SOLID LUBRICANT COATINGS ON SUBSTRATES 有权
    在基材上形成固体润滑涂料的方法

    公开(公告)号：US20100310763A1

    公开(公告)日：2010-12-09

    申请号：US12479034

    申请日：2009-06-05

    申请人： Reza Oboodi ,  James Piascik ,  Bjoern Schenk ,  Eric Passman ,  Richard Bye

    发明人： Reza Oboodi ,  James Piascik ,  Bjoern Schenk ,  Eric Passman ,  Richard Bye

    IPC分类号： B05D3/00

    CPC分类号： C23C18/1216 ,  B22F7/04 ,  C23C18/1225 ,  C23C18/127 ,  C23C18/1279 ,  C23C18/1283 ,  C23C18/1295 ,  F16C33/043 ,  F16C33/1095

    摘要： A method includes applying a coating precursor material over a substrate, the coating precursor material comprising a powder having an average particle diameter in a range of about 10 nanometers to about 10 microns comprising a fluoride eutectic, a metal capable of oxidizing at about 535° C. to about 800° C., one or more materials selected from the group consisting of a metal oxide, a glass, a carbide, and a nitride, and optionally, a precious metal selected from silver, palladium, platinum, gold, rhodium, and alloys thereof, subjecting the coating to a sintering heat treatment, occurring at a first temperature in an inert or reducing atmosphere to sinter the metal of the precursor material, and exposing the coating to an oxidizing heat treatment performed in an oxidizing atmosphere at a second temperature that is less than the first temperature to oxidize a portion of the metal in the coating precursor material.

    摘要翻译： 一种方法包括将涂层前体材料涂覆在基底上，所述涂层前体材料包含平均粒径在约10纳米至约10微米范围内的粉末，其包含氟化物共晶体，能够在约535℃下氧化的金属 至约800℃，选自金属氧化物，玻璃，碳化物和氮化物的一种或多种材料，以及任选的选自银，钯，铂，金，铑， 及其合金，对涂层进行烧结热处理，在惰性或还原性气氛中的第一温度下进行烧结，烧结前体材料的金属，并在第二次氧化气氛中进行氧化热处理 温度小于第一温度以氧化涂层前体材料中的一部分金属。

    Methods of forming solid lubricant coatings on substrates
    8.
    发明授权
    Methods of forming solid lubricant coatings on substrates 有权
    在基材上形成固体润滑剂涂层的方法

    公开(公告)号：US08158205B2

    公开(公告)日：2012-04-17

    申请号：US12479034

    申请日：2009-06-05

    申请人： Reza Oboodi ,  James Piascik ,  Bjoern Schenk ,  Eric Passman ,  Richard Bye

    发明人： Reza Oboodi ,  James Piascik ,  Bjoern Schenk ,  Eric Passman ,  Richard Bye

    IPC分类号： B05D3/02

    CPC分类号： C23C18/1216 ,  B22F7/04 ,  C23C18/1225 ,  C23C18/127 ,  C23C18/1279 ,  C23C18/1283 ,  C23C18/1295 ,  F16C33/043 ,  F16C33/1095

    摘要： A method includes applying a coating precursor material over a substrate, the coating precursor material comprising a powder having an average particle diameter in a range of about 10 nanometers to about 10 microns comprising a fluoride eutectic, a metal capable of oxidizing at about 535° C. to about 800° C., one or more materials selected from the group consisting of a metal oxide, a glass, a carbide, and a nitride, and optionally, a precious metal selected from silver, palladium, platinum, gold, rhodium, and alloys thereof, subjecting the coating to a sintering heat treatment, occurring at a first temperature in an inert or reducing atmosphere to sinter the metal of the precursor material, and exposing the coating to an oxidizing heat treatment performed in an oxidizing atmosphere at a second temperature that is less than the first temperature to oxidize a portion of the metal in the coating precursor material.

    摘要翻译： 一种方法包括将涂层前体材料涂覆在基底上，所述涂层前体材料包含平均粒径在约10纳米至约10微米范围内的粉末，其包含氟化物共晶体，能够在约535℃下氧化的金属 至约800℃，选自金属氧化物，玻璃，碳化物和氮化物的一种或多种材料，以及任选的选自银，钯，铂，金，铑， 及其合金，对涂层进行烧结热处理，在惰性或还原性气氛中的第一温度下进行烧结，烧结前体材料的金属，并在第二次氧化气氛中进行氧化热处理 温度小于第一温度以氧化涂层前体材料中的一部分金属。

    Methods of forming insulated wires and hermetically-sealed packages for use in electromagnetic devices
    9.
    发明授权
    Methods of forming insulated wires and hermetically-sealed packages for use in electromagnetic devices 有权
    形成用于电磁装置的绝缘电线和气密封装的方法

    公开(公告)号：US08484831B2

    公开(公告)日：2013-07-16

    申请号：US12844611

    申请日：2010-07-27

    申请人： James Piascik ,  Reza Oboodi ,  Robert Franconi

    发明人： James Piascik ,  Reza Oboodi ,  Robert Franconi

    IPC分类号： H01F7/06

    CPC分类号： H01B3/12 ,  H01B3/084 ,  H01F5/02 ,  H01F41/005 ,  Y10T29/49071 ,  Y10T29/49073 ,  Y10T29/49076

    摘要： A method includes coating a conductive wire with a paste comprising a first inorganic dielectric material, an organic binder, and a solvent to form a coated wire, drying the coated wire at a first drying temperature to remove at least a portion of the solvent and form a green wire, winding the green wire around a core to form a green assembly, heat treating the green assembly at a decomposing temperature above the first temperature and below a melting point of the first inorganic dielectric material to decompose the organic binder to form an intermediate assembly, and exposing the intermediate assembly to a densifying temperature that is above the decomposing temperature and substantially equal to or above the melting point of the first inorganic dielectric material to densify the dielectric material on the conductive wire.

    摘要翻译： 一种方法包括用包含第一无机介电材料，有机粘合剂和溶剂的糊料涂覆导线，以形成涂覆的丝线，在第一干燥温度下干燥涂覆的丝线以除去至少一部分溶剂并形成 绿色线，将芯线缠绕在芯上以形成绿色组件，在高于第一温度并低于第一无机介电材料的熔点的分解温度下对生坯组件进行热处理，以分解有机粘合剂以形成中间体 组装，并将中间组件暴露于高于分解温度并且基本上等于或高于第一无机介电材料的熔点的致密化温度，以致致密导电导线上的电介质材料。

    METHODS OF FORMING INSULATED WIRES AND HERMETICALLY-SEALED PACKAGES FOR USE IN ELECTROMAGNETIC DEVICES
    10.
    发明申请
    METHODS OF FORMING INSULATED WIRES AND HERMETICALLY-SEALED PACKAGES FOR USE IN ELECTROMAGNETIC DEVICES 有权
    形成绝缘线的方法和用于电磁设备的密封封装

    公开(公告)号：US20120023870A1

    公开(公告)日：2012-02-02

    申请号：US12844611

    申请日：2010-07-27

    申请人： James Piascik ,  Reza Oboodi ,  Robert Franconi

    发明人： James Piascik ,  Reza Oboodi ,  Robert Franconi

    IPC分类号： B65B31/02 ,  B05D5/12

    CPC分类号： H01B3/12 ,  H01B3/084 ,  H01F5/02 ,  H01F41/005 ,  Y10T29/49071 ,  Y10T29/49073 ,  Y10T29/49076

    摘要： A method includes coating a conductive wire with a paste comprising a first inorganic dielectric material, an organic binder, and a solvent to form a coated wire, drying the coated wire at a first drying temperature to remove at least a portion of the solvent and form a green wire, winding the green wire around a core to form a green assembly, heat treating the green assembly at a decomposing temperature above the first temperature and below a melting point of the first inorganic dielectric material to decompose the organic binder to form an intermediate assembly, and exposing the intermediate assembly to a densifying temperature that is above the decomposing temperature and substantially equal to or above the melting point of the first inorganic dielectric material to densify the dielectric material on the conductive wire.

    摘要翻译： 一种方法包括用包含第一无机介电材料，有机粘合剂和溶剂的糊料涂覆导线，以形成涂覆的丝线，在第一干燥温度下干燥涂覆的丝线以除去至少一部分溶剂并形成 绿色线，将芯线缠绕在芯上以形成绿色组件，在高于第一温度并低于第一无机介电材料的熔点的分解温度下对生坯组件进行热处理，以分解有机粘合剂以形成中间体 组装，并将中间组件暴露于高于分解温度并且基本上等于或高于第一无机介电材料的熔点的致密化温度，以致致密导电导线上的电介质材料。