Method of bonding together two bodies with silicon oxide and practically
pure boron
    1.
    发明授权
    Method of bonding together two bodies with silicon oxide and practically pure boron 失效
    使用氧化硅和实践纯硼连接两个体的方法

    公开(公告)号:US5054683A

    公开(公告)日:1991-10-08

    申请号:US576328

    申请日:1990-08-29

    摘要: A method is set forth of bonding together two bodies (1, 2), according to which a first body (1) is provided with a flat surface (5) and the second body (2) is provided with a silicon oxide layer (4) with a flat surface (6), after which a connecting layer (7) containing boron is provided on at least one of the two flat surfaces. Subsequently, the two bodies (1, 2) are pressed together at elevated temperature, so that a borosilicate glass layer is formed. According to the invention, a layer of practically pure boron is used by way of connecting layer (7). Among the advantages of this is that the composition of the borosilicate glass layer is exclusively determined by the previously chosen layer thicknesses.

    摘要翻译: 提出了一种将两个主体(1,2)接合在一起的方法,根据该主体,第一主体(1)设置有平坦表面(5),并且第二主体(2)设置有氧化硅层(4) ),之后在两个平坦表面中的至少一个上提供含有硼的连接层(7)。 随后,将两个体(1,2)在升高的温度下压在一起,从而形成硼硅酸盐玻璃层。 根据本发明,通过连接层(7)使用实际上纯硼的层。 其优点之一是硼硅酸盐玻璃层的组成仅由先前选择的层厚决定。

    Semiconductor device comprising an integrated circuit provided with a ceramic security coating and method of manufacturing such a device
    6.
    发明授权
    Semiconductor device comprising an integrated circuit provided with a ceramic security coating and method of manufacturing such a device 有权
    包括具有陶瓷安全涂层的集成电路的半导体器件及其制造方法

    公开(公告)号:US06198155B1

    公开(公告)日:2001-03-06

    申请号:US09328253

    申请日:1999-06-08

    IPC分类号: H01L21331

    摘要: A semiconductor device comprising a silicon substrate is provided with semiconductor elements on a first side, a metallization with connection pads for external contact, and a passivation layer which leaves the connection pads of the metallization exposed. The integrated circuit thus formed is also provided with a ceramic security coating having a matrix of monoaluminium phosphate which also leaves the connection pads of the metallization exposed. The protective layer can be deposited so as to have a thickness in the range from 2 to 10 &mgr;m, and hence is suitable for protecting integrated circuits used in smart cards. As a result, the information stored therein is not accessible.

    摘要翻译: 包括硅衬底的半导体器件在第一侧上设置有半导体元件,具有用于外部接触的连接焊盘的金属化以及使金属化的连接焊盘露出的钝化层。 由此形成的集成电路还设置有具有磷酸铝的基体的陶瓷安全涂层,其也使得暴露的金属化物的连接焊盘离开。 保护层可以沉积成具有在2至10μm范围内的厚度,因此适用于保护在智能卡中使用的集成电路。 结果,其中存储的信息是不可访问的。

    Iron and soleplate for an iron
    7.
    发明授权
    Iron and soleplate for an iron 失效
    铁和铁板铁

    公开(公告)号:US6000157A

    公开(公告)日:1999-12-14

    申请号:US933595

    申请日:1997-09-19

    IPC分类号: D06F75/38

    摘要: The invention relates to an iron having a metal soleplate, which is provided with an anti-friction layer containing an inorganic polymer. To improve the scratch resistance of the anti-friction layer, a hard intermediate layer is provided between the predominantly aluminum part of the soleplate facing the anti-friction layer and the anti-friction layer.This intermediate layer is preferably composed of aluminum oxide which is provided by means of an electrochemical treatment. The use of polymerized alkyl trialkoxysilane, in particular methyl trimethoxysilane, in the anti-friction layer makes it possible to obtain layers which are thicker and hence more scratch-resistant. In such layers, oxidic nano-particles and inorganic color pigments may be incorporated, which cause a further increase of the scratch resistance.

    摘要翻译: 本发明涉及一种具有金属底板的铁,其具有含有无机聚合物的抗摩擦层。 为了提高抗摩擦层的抗划伤性,在面向抗摩擦层的底板的主要铝部分和抗摩擦层之间设置有硬的中间层。 该中间层优选由通过电化学处理提供的氧化铝组成。 在抗摩擦层中使用聚合的烷基三烷氧基硅烷,特别是甲基三甲氧基硅烷,使得可以获得更厚的层,因此更耐刮擦。 在这样的层中,可以掺入氧化性纳米颗粒和无机颜色颜料,这进一步提高耐擦伤性。