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8 条记录 (耗时 0.017 秒)

    Warpage control stiffener ring package and fabrication method
    3.
    发明授权
    Warpage control stiffener ring package and fabrication method 有权
    翘曲控制加强环包装和制造方法

    公开(公告)号：US08986806B1

    公开(公告)日：2015-03-24

    申请号：US13452006

    申请日：2012-04-20

    申请人： Bora Baloglu ,  Jeff Watson

    发明人： Bora Baloglu ,  Jeff Watson

    IPC分类号： H01L21/00 ,  H01L23/10 ,  H01L23/00

    CPC分类号： H01L23/562 ,  H01L23/49833 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/0002 ,  H01L2924/15311 ,  H05K1/0271 ,  H05K2201/09136 ,  H05K2201/2018 ,  H01L2924/00

    摘要： A warpage control stiffener ring package includes a substrate having an upper surface and corners. A segmented stiffener ring is formed of “L” shaped segments, each segment being mounted to the upper surface at a corner of the substrate, wherein a gap exists between each of the segments. By forming the segmented stiffener ring of segments having gaps therebetween, warpage of the segmented stiffener ring itself, and thus the thermal stress applied by the segmented stiffener ring on to the substrate, is reduced as compared to a continuous stiffener ring. This allows the segmented stiffener ring to be designed to minimize warpage of the warpage control stiffener ring package.

    摘要翻译： 翘曲控制加强环包装件包括具有上表面和拐角的基板。 分段的加强环由“L”形的段形成，每个段被安装到衬底的角部的上表面，其中在每个段之间存在间隙。 通过形成具有间隙的节段的分段加强环，与连续的加强环相比，分段加强环自身的翘曲以及因此由分段的加强环施加到基底上的热应力减小。 这允许分段加强环被设计成使翘曲控制加强环包装的翘曲最小化。

    Method for controlling molding compound geometry around a semiconductor die
    4.
    发明授权
    Method for controlling molding compound geometry around a semiconductor die 有权
    控制半导体晶片周围模塑复合几何形状的方法

    公开(公告)号：US08912051B1

    公开(公告)日：2014-12-16

    申请号：US13564567

    申请日：2012-08-01

    申请人： Ahmer Syed ,  Miguel Jimarez ,  Jeff Watson

    发明人： Ahmer Syed ,  Miguel Jimarez ,  Jeff Watson

    IPC分类号： H01L21/00 ,  H01L23/28

    CPC分类号： H01L21/565 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A novel die seal design, and method for utilization thereof, controls contact of a mold material with the surfaces of a semiconductor die during application, reducing stresses due to a mismatch of the coefficient of thermal expansion of the mold material and the semiconductor die, thereby reducing cracking of the semiconductor die, resulting in increased yields and lower costs, and permits reuse of elements of a mold tool over a range of die sizes.

    摘要翻译： 一种新颖的模具密封设计及其利用方法控制了在施加期间模具材料与半导体模具表面的接触，减少了由于模具材料和半导体模具的热膨胀系数不匹配引起的应力，由此 减少了半导体管芯的开裂，从而提高了产量并降低了成本，并且允许在一定范围的管芯尺寸上重复利用模具的元件。

    Mini boom bumper
    5.
    发明授权
    Mini boom bumper 失效
    迷你吊臂保险杠

    公开(公告)号：US5439343A

    公开(公告)日：1995-08-08

    申请号：US221238

    申请日：1994-03-31

    申请人： Jeff Watson

    发明人： Jeff Watson

    IPC分类号： B60P1/54 ,  B66C23/42 ,  B66C23/44 ,  B66C23/80 ,  B66F11/04 ,  B66C5/00

    CPC分类号： B60P1/5433 ,  B66C23/42 ,  B66C23/44 ,  B66C23/80 ,  B66F11/046

    摘要： A combined bumper and hoist for use on a vehicle has an elongate housing that mounts transversely across the end of the vehicle as a bumper. A hoist having a mast and a boom is pivotally mounted in the housing for movement between a stored position collapsed into the housing and a raised position with the mast upright and the boom projecting laterally from the mast. The raising of the hoist simultaneously lowers two legs from the bumper to support the bumper on the ground. All of the hoist functions, including raising the hoist to the use position, rotating the mast about its axis and raising and lowering the boom are performed hydraulically. The boom may be equipped with various accessories, including a chain hook and a jib carrying a cherry picker bucket.

    摘要翻译： 用于车辆的组合保险杠和起重机具有细长的壳体，其以保险杠横向安装在车辆的端部。 具有桅杆和起重臂的起重机枢转地安装在壳体中，用于在坍缩到壳体中的存储位置和具有桅杆直立的升高位置和从桅杆横向突出的悬臂之间移动。 升降机同时降低保险杠的两条腿，以支撑地面上的保险杠。 所有的起重机功能，包括将起重机提升到使用位置，旋转桅杆绕其轴线并升高和降低起重臂是液压地执行的。 吊杆可能配备有各种附件，包括链钩和带有樱桃铲斗的吊臂。

    System for switching data using dynamic scheduling
    6.
    发明申请
    System for switching data using dynamic scheduling 有权
    使用动态调度切换数据的系统

    公开(公告)号：US20070206604A1

    公开(公告)日：2007-09-06

    申请号：US11796682

    申请日：2007-04-27

    申请人： Robert Best ,  Ramaswamy Chandrasekaran ,  John Rudin ,  Rose Hu ,  Jeff Watson ,  Lakshman Tamil ,  Alessandro Fabbri

    发明人： Robert Best ,  Ramaswamy Chandrasekaran ,  John Rudin ,  Rose Hu ,  Jeff Watson ,  Lakshman Tamil ,  Alessandro Fabbri

    IPC分类号： H04L12/56

    CPC分类号： H04L49/254 ,  H04L49/205

    摘要： The invention includes systems and methods for improving the performance of non-blocking data switching systems. One embodiment of the invention includes a method comprising routing data from a plurality of inputs to a plurality of outputs through a switching core according to a first switching schedule, receiving a first set of reports comprising reports from data sources associated with the plurality of inputs, evaluating one or more reports of the first set of reports, determining a sufficiency of the first switching schedule based on the one or more reports, adapting a second switching schedule, wherein the second switching schedule differs from the first switching schedule, sending the second switching schedule to the data sources, issuing one or more synchronization signals associated with a transition to the second switching schedule to the data sources and routing data from the plurality of inputs to the plurality of outputs through the switching core according to the second switching schedule.

    摘要翻译： 本发明包括用于提高非阻塞数据交换系统的性能的系统和方法。 本发明的一个实施例包括一种方法，其包括根据第一切换时间表通过切换核心将数据从多个输入路由到多个输出;接收包括与所述多个输入相关联的数据源的报告的第一组报告， 评估所述第一组报告的一个或多个报告，基于所述一个或多个报告确定所述第一切换调度的充分性，修改第二切换调度，其中所述第二切换调度与所述第一切换调度不同，发送所述第二切换 调度到数据源，发出与向第二切换调度转换到数据源相关联的一个或多个同步信号，并且根据第二切换时间表通过交换核心将数据从多个输入路由到多个输出。

    Heat sink design integrating interface material
    8.
    发明授权
    Heat sink design integrating interface material 失效
    散热器设计集成界面材料

    公开(公告)号：US5168926A

    公开(公告)日：1992-12-08

    申请号：US766425

    申请日：1991-09-25

    申请人： Jeff Watson ,  Charles Ruff

    发明人： Jeff Watson ,  Charles Ruff

    IPC分类号： H01L23/40 ,  H01L21/48 ,  H01L23/367

    CPC分类号： H01L23/367 ,  H01L21/4882 ,  H01L2924/0002

    摘要： A method and assembly for a heat sink that is attached to a chip carrier. The heat sink has a plurality of fins extending from the first surface of a plate and a pair of rails extending from a second opposite surface of the plate. The rails are constructed to contain and restrain the heat sink on the chip carrier. The heat sink also has a recess and a pair of support surfaces between the rails. To attach the chip carrier to the heat sink, a thermally conductive adhesive is applied into the center of the recess. The chip carrier is then placed on the support surfaces between the rails. Mounting the carrier on the support surface pushes the adhesive throughout the recess. The adhesive cures at room temperature, wherein the heat sink is bonded to the chip carrier.

    摘要翻译： 一种连接到芯片载体的散热器的方法和组件。 散热器具有从板的第一表面延伸的多个翅片和从板的第二相对表面延伸的一对轨道。 轨道被构造成容纳和限制芯片载体上的散热器。 散热器还具有凹槽和轨道之间的一对支撑表面。 为了将芯片载体附接到散热器，将导热粘合剂施加到凹部的中心。 然后将芯片载体放置在轨道之间的支撑表面上。 将载体安装在支撑表面上将粘合剂推向整个凹槽。 粘合剂在室温下固化，其中散热片结合到芯片载体上。