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公开(公告)号：US07993464B2
公开(公告)日：2011-08-09
申请号：US12055178
申请日：2008-03-25
IPC分类号： B08B7/00
CPC分类号： B08B7/0042 , G03F1/82 , Y10S134/902
摘要： A method for laser surface cleaning of a target surface that has limited or no access to the environment directly above the surface to be cleaned. The method includes the ability to clean the surface with a reduced risk of substrate damage. The method includes direct laser excitation of a contaminated substrate surface and thermal transfer from the substrate to the contaminating particulate or contamination layer. The method also includes producing a thermally based removal and reducing a risk of substrate damage by keeping the temperature required to produce surface cleaning below the thermal damage level of the substrate material. In addition, the method includes reducing the risk of substrate damage by utilizing relatively long pulse-widths, providing for improved removal of small contaminants/particles, and directing the beam through a material disposed relative to the surface that is part of the substrates environmental enclosure.
摘要翻译： 一种用于目标表面的激光表面清洁的方法，该方法在待清洁表面正上方有限制或无法进入环境。 该方法包括清洁表面的能力，降低了底物损伤的风险。 该方法包括对受污染的基底表面的直接激光激发和从基底到污染颗粒或污染层的热转移。 该方法还包括通过将产生表面清洁所需的温度保持在基底材料的热损伤水平以下来产生基于热的去除并降低基底损伤的风险。 此外，该方法包括通过利用相对较长的脉冲宽度降低衬底损伤的风险，提供改善的小污染物/颗粒的去除，以及引导光束穿过相对于作为衬底环境外壳的一部分的表面设置的材料 。
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公开(公告)号：US20090038637A1
公开(公告)日：2009-02-12
申请号：US12055178
申请日：2008-03-25
IPC分类号： B08B7/00
CPC分类号： B08B7/0042 , G03F1/82 , Y10S134/902
摘要： A method for laser surface cleaning of a target surface that has limited or no access to the environment directly above the surface to be cleaned. The method includes the ability to clean the surface with a reduced risk of substrate damage. The method includes direct laser excitation of a contaminated substrate surface and thermal transfer from the substrate to the contaminating particulate or contamination layer. The method also includes producing a thermally based removal and reducing a risk of substrate damage by keeping the temperature required to produce surface cleaning below the thermal damage level of the substrate material. In addition, the method includes reducing the risk of substrate damage by utilizing relatively long pulse-widths, providing for improved removal of small contaminants/particles, and directing the beam through a material disposed relative to the surface that is part of the substrates environmental enclosure.
摘要翻译： 一种用于目标表面的激光表面清洁的方法，该方法在待清洁表面正上方有限制或无法进入环境。 该方法包括清洁表面的能力，降低了底物损伤的风险。 该方法包括对受污染的基底表面的直接激光激发和从基底到污染颗粒或污染层的热转移。 该方法还包括通过将产生表面清洁所需的温度保持在基底材料的热损伤水平以下来产生基于热的去除并降低基底损伤的风险。 此外，该方法包括通过利用相对较长的脉冲宽度降低衬底损伤的风险，提供改善的小污染物/颗粒的去除，以及引导光束穿过相对于作为衬底环境外壳的一部分的表面设置的材料 。
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公开(公告)号：US20090065024A1
公开(公告)日：2009-03-12
申请号：US12277106
申请日：2008-11-24
IPC分类号： B08B7/00
CPC分类号： B08B7/0042 , G03F1/82 , Y10S134/902
摘要： Methods for cleaning a surface of a substrate and for increasing the useable lifetime of a photomask substrate are provided. In one method, a substrate has at least one radiation-produced particle disposed thereon, and a laser that has a wavelength that substantially coincides with a high absorption coefficient of the substrate is directed towards the substrate. A thermal increase is generated in the substrate, and the radiation-produced particle is removed from the substrate by transferring thermal energy from the substrate to the radiation-produced particle until the radiation-produced particle decomposes.
摘要翻译： 提供了清洁基板的表面和增加光掩模基板的使用寿命的方法。 在一种方法中，衬底具有设置在其上的至少一个辐射产生颗粒，并且具有基本上与衬底的高吸收系数一致的波长的激光器被引向衬底。 在衬底中产生热增加，并且通过将热能从衬底转移到辐射产生的颗粒直到辐射产生的颗粒分解，从衬底去除辐射产生的颗粒。
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公开(公告)号：US20090070979A1
公开(公告)日：2009-03-19
申请号：US11898837
申请日：2007-09-17
申请人： Bernabe J. Arruza , Ronald Bozak , Kenneth Gilbert Roessler , Andrew Dinsdale , Tod Evan Robinson , David Brinkley
发明人： Bernabe J. Arruza , Ronald Bozak , Kenneth Gilbert Roessler , Andrew Dinsdale , Tod Evan Robinson , David Brinkley
CPC分类号： B81C1/00634 , B81C2201/0146 , Y10T29/49778
摘要： A method of nanomachining is provided. The method includes plunging a nanometer-scaled tip into a surface of a substrate at a first location in a first direction that is substantially perpendicular to the surface, thereby displacing a first portion of the substrate with the tip. The method also includes withdrawing the tip from the substrate in a second direction that is substantially opposite to the first direction. The method further includes moving at least one of the tip and the substrate laterally relative to each other. In addition, the method also includes plunging the tip into the substrate at a second location in a third direction that is substantially parallel to the first direction, thereby displacing a second portion of the substrate with the tip and withdrawing the tip from the substrate in a fourth direction that is substantially opposite to the third direction.
摘要翻译： 提供了一种纳米加工的方法。 该方法包括在基本上垂直于表面的第一方向上的第一位置处将纳米级尖端突入基片的表面，从而使基片的第一部分与尖端移位。 该方法还包括在基本上与第一方向相反的第二方向从衬底取出尖端。 该方法还包括相对于彼此横向移动尖端和衬底中的至少一个。 此外，该方法还包括在基本上平行于第一方向的第三方向上的第二位置处将尖端插入基板，从而使基板的第二部分与尖端移位，并且将尖端从基板中取出 第四方向与第三方向基本相反。
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公开(公告)号：US07829360B2
公开(公告)日：2010-11-09
申请号：US11898837
申请日：2007-09-17
申请人： Bernabe J. Arruza , Ronald Bozak , Kenneth Gilbert Roessler , Andrew Dinsdale , Tod Evan Robinson , David Brinkley
发明人： Bernabe J. Arruza , Ronald Bozak , Kenneth Gilbert Roessler , Andrew Dinsdale , Tod Evan Robinson , David Brinkley
IPC分类号： H01L21/00
CPC分类号： B81C1/00634 , B81C2201/0146 , Y10T29/49778
摘要： A method of nanomachining is provided. The method includes plunging a nanometer-scaled tip into a surface of a substrate at a first location in a first direction that is substantially perpendicular to the surface, thereby displacing a first portion of the substrate with the tip. The method also includes withdrawing the tip from the substrate in a second direction that is substantially opposite to the first direction. The method further includes moving at least one of the tip and the substrate laterally relative to each other. In addition, the method also includes plunging the tip into the substrate at a second location in a third direction that is substantially parallel to the first direction, thereby displacing a second portion of the substrate with the tip and withdrawing the tip from the substrate in a fourth direction that is substantially opposite to the third direction.
摘要翻译： 提供了一种纳米加工的方法。 该方法包括在基本上垂直于表面的第一方向上的第一位置处将纳米级尖端突入基片的表面，从而使基片的第一部分与尖端移位。 该方法还包括在基本上与第一方向相反的第二方向从衬底取出尖端。 该方法还包括相对于彼此横向移动尖端和衬底中的至少一个。 此外，该方法还包括在基本上平行于第一方向的第三方向上的第二位置处将尖端插入基板，从而使基板的第二部分与尖端移位，并且将尖端从基板中取出 第四方向与第三方向基本相反。
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公开(公告)号：US08562749B2
公开(公告)日：2013-10-22
申请号：US13475997
申请日：2012-05-20
IPC分类号： B08B7/00
CPC分类号： B08B7/0042 , G03F1/62 , G03F1/82 , H01L21/67028 , Y10S134/902
摘要： A wafer fabrication process with removal of haze formation from a pellicalized photomask surface is provided. The wafer fabrication process includes pre-print wafer processing, wafer print processing using at least one photomask having a pellicle, photomask clean processing, wafer print processing using the photomask, and post-print wafer processing. The photomask clean processing step includes directing a laser through the pellicle towards an inorganic particle disposed on the photomask to remove the particle from the photomask by thermal decomposition.
摘要翻译： 提供了从薄膜光掩模表面去除雾霾形成的晶片制造工艺。 晶片制造工艺包括预打印晶片处理，使用至少一个具有防护薄膜的光掩模，光掩模清洁处理，使用光掩模的晶片印刷处理和印后晶片处理的晶片印刷处理。 光掩模清洁处理步骤包括将激光穿过防护薄膜，朝向设置在光掩模上的无机颗粒，以通过热分解从光掩模中除去颗粒。
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公开(公告)号：US08293019B2
公开(公告)日：2012-10-23
申请号：US12277106
申请日：2008-11-24
IPC分类号： B08B7/00
CPC分类号： B08B7/0042 , G03F1/82 , Y10S134/902
摘要： Methods for cleaning a surface of a substrate and for increasing the useable lifetime of a photomask substrate are provided. In one method, a substrate has at least one radiation-produced particle disposed thereon, and a laser that has a wavelength that substantially coincides with a high absorption coefficient of the substrate is directed towards the substrate. A thermal increase is generated in the substrate, and the radiation-produced particle is removed from the substrate by transferring thermal energy from the substrate to the radiation-produced particle until the radiation-produced particle decomposes.
摘要翻译： 提供了清洁基板的表面和增加光掩模基板的使用寿命的方法。 在一种方法中，衬底具有设置在其上的至少一个辐射产生颗粒，并且具有基本上与衬底的高吸收系数一致的波长的激光器被引向衬底。 在衬底中产生热增加，并且通过将热能从衬底转移到辐射产生的颗粒直到辐射产生的颗粒分解，从衬底去除辐射产生的颗粒。
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公开(公告)号：US20120231397A1
公开(公告)日：2012-09-13
申请号：US13475997
申请日：2012-05-20
IPC分类号： G03F7/20
CPC分类号： B08B7/0042 , G03F1/62 , G03F1/82 , H01L21/67028 , Y10S134/902
摘要： A wafer fabrication process with removal of haze formation from a pellicalized photomask surface is provided. The wafer fabrication process includes pre-print wafer processing, wafer print processing using at least one photomask having a pellicle, photomask clean processing, wafer print processing using the photomask, and post-print wafer processing. The photomask clean processing step includes directing a laser through the pellicle towards an inorganic particle disposed on the photomask to remove the particle from the photomask by thermal decomposition.
摘要翻译： 提供了从薄膜光掩模表面去除雾霾形成的晶片制造工艺。 晶片制造工艺包括预打印晶片处理，使用至少一个具有防护薄膜的光掩模，光掩模清洁处理，使用光掩模的晶片印刷处理和印后晶片处理的晶片印刷处理。 光掩模清洁处理步骤包括将激光穿过防护薄膜，朝向设置在光掩模上的无机颗粒，以通过热分解从光掩模中除去颗粒。
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公开(公告)号：US08182609B1
公开(公告)日：2012-05-22
申请号：US12188564
申请日：2008-08-08
IPC分类号： B08B7/00
CPC分类号： B08B7/0042 , G03F1/62 , G03F1/82 , H01L21/67028 , Y10S134/902
摘要： The present invention provides a method for cleaning a surface of a substrate that includes directing a laser towards at least one radiation-produced particle disposed on a substrate, generating a thermal increase in the particle and removing the particle from the substrate by thermal decomposition. The laser has a wavelength that substantially coincides with a high absorption coefficient of the particle.
摘要翻译： 本发明提供了一种清洁基板表面的方法，其包括将激光朝向设置在基板上的至少一个辐射产生的颗粒引导，产生颗粒的热量增加并通过热分解从基板移除颗粒。 激光器具有与颗粒的高吸收系数基本一致的波长。
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