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    FLUID FLOW PATH IN MICROFLUIDIC DEVICE
    1.
    发明申请
    FLUID FLOW PATH IN MICROFLUIDIC DEVICE 审中-公开
    微流化装置中的流体流路

    公开(公告)号：US20080202694A1

    公开(公告)日：2008-08-28

    申请号：US11678647

    申请日：2007-02-26

    申请人： Jeffrey P. Serbicki ,  Mario J. Ciminelli ,  Randy J. Kennard

    发明人： Jeffrey P. Serbicki ,  Mario J. Ciminelli ,  Randy J. Kennard

    IPC分类号： B41J2/00

    CPC分类号： B41J2/16 ,  B41J2/02 ,  B41J2/1623 ,  B41J2202/03 ,  B41J2202/22 ,  Y10T156/17

    摘要： A fluid flow path, a microfluidic device including the fluid flow path, and methods of forming the same are described. The fluid flow path can include an inlet and at least one outlet, and is defined by a first substrate and a second substrate, each having one or more fluid via extending therethrough, and an adhesive sealant between the first substrate and the second substrate, wherein the adhesive sealant surrounds at least one via of each substrate such that fluid flows through the vias and an area bounded by the adhesive sealant between the substrates. The adhesive sealant can be a bismaleimide-containing compound.

    摘要翻译： 描述了流体流动路径，包括流体流动路径的微流体装置及其形成方法。 流体流路可以包括入口和至少一个出口，并且由第一基底和第二基底限定，第一基底和第二基底各自具有一个或多个通过其延伸的流体通道，以及在第一基底和第二基底之间的粘合密封剂，其中 粘合剂密封剂围绕每个基底的至少一个通孔，使得流体流过通孔和由基底之间的粘合剂密封剂界定的区域。 粘合剂密封剂可以是含双马来酰亚胺的化合物。

    PRINTHEAD WIREBOND ENCAPSULATION
    2.
    发明申请
    PRINTHEAD WIREBOND ENCAPSULATION 审中-公开
    电线接线

    公开(公告)号：US20080158298A1

    公开(公告)日：2008-07-03

    申请号：US11617126

    申请日：2006-12-28

    申请人： Jeffrey P. Serbicki ,  Randy J. Kennard ,  Douglas L. Morgan ,  Mario J. Ciminelli ,  C. Glenn Prince

    发明人： Jeffrey P. Serbicki ,  Randy J. Kennard ,  Douglas L. Morgan ,  Mario J. Ciminelli ,  C. Glenn Prince

    IPC分类号： B41J2/16

    CPC分类号： B41J2/14072

    摘要： A printhead includes a printhead die and an interconnect substrate. The printhead die includes a surface. The interconnect substrate includes electrical circuitry and a surface. The electrical circuitry is in electrical communication with the printhead die through a plurality of electrical connections. An encapsulant structure is positioned to encapsulate the plurality of electrical connections, and includes a barrier portion and a filler portion. The barrier portion includes a first wall and a second wall. The first wall is in contact with the surface of the printhead die and the second wall is in contact with the surface of the interconnect substrate. The filler portion is in contact with the plurality of electrical connections and positioned between the first wall of the barrier portion and the second wall of the barrier portion.

    摘要翻译： 打印头包括打印头芯片和互连基板。 打印头芯片包括一个表面。 互连基板包括电路和表面。 电路通过多个电气连接与打印头芯片电连通。 密封剂结构定位成封装多个电连接，并且包括阻挡部分和填充部分。 阻挡部分包括第一壁和第二壁。 第一壁与打印头芯片的表面接触，第二壁与互连基板的表面接触。 填料部分与多个电连接件接触并且定位在阻挡部分的第一壁和阻挡部分的第二壁之间。

    Desiccation of moisture-sensitive electronic devices
    3.
    发明授权
    Desiccation of moisture-sensitive electronic devices 有权
    湿度敏感电子设备的干燥

    公开(公告)号：US06226890B1

    公开(公告)日：2001-05-08

    申请号：US09543973

    申请日：2000-04-07

    申请人： Michael L. Boroson ,  Jeffrey P. Serbicki ,  Peter G. Bessey

    发明人： Michael L. Boroson ,  Jeffrey P. Serbicki ,  Peter G. Bessey

    IPC分类号： F26B300

    CPC分类号： F26B21/083 ,  H01L51/5259

    摘要： A method of desiccating an environment surrounding a moisture-sensitive electronic device sealed within an enclosure, includes selecting a desiccant comprised of solid particles having a particle size range 0.1 to 200 micrometers, the desiccant selected to provide an equilibrium minimum humidity level lower than a humidity level to which the device is sensitive within the sealed enclosure; choosing a binder that maintains or enhances the moisture absorption rate of the desiccant for blending the selected desiccant therein, the binder being in liquid phase or dissolved in a liquid; forming a castable blend including at least the desiccant particles and the binder, the blend having a preferred weight fraction of the desiccant particles in the blend in a range of 10% to 90%; casting a measured amount of the blend onto a portion of an interior surface of an enclosure to form a desiccant layer thereover, the enclosure having a sealing flange; solidifying the desiccant layer to a solid; and sealing the electronic device with the enclosure along the sealing flange.

    摘要翻译： 一种干燥密封在外壳内的湿度敏感电子设备的环境的方法，包括选择由粒度范围为0.1至200微米的固体颗粒组成的干燥剂，选择干燥剂以提供低于湿度的平衡最小湿度水平 在密封的外壳内设备敏感的水平; 选择粘合剂，其维持或提高用于混合所选择的干燥剂的干燥剂的吸湿率，所述粘合剂处于液相或溶解在液体中; 形成包含至少干燥剂颗粒和粘合剂的可浇铸混合物，所述共混物在共混物中的干燥剂颗粒的优选重量分数在10％至90％的范围内; 将测量量的共混物浇铸到外壳的内表面的一部分上以在其上形成干燥剂层，外壳具有密封凸缘; 将干燥剂层固化成固体; 并且沿着密封凸缘将具有外壳的电子设备密封。

    Method of fabricating a cover plate bonded over an encapsulated OLEDs
    4.
    发明授权
    Method of fabricating a cover plate bonded over an encapsulated OLEDs 有权
    制造封装在封装的OLED上的盖板的方法

    公开(公告)号：US07135352B2

    公开(公告)日：2006-11-14

    申请号：US10787513

    申请日：2004-02-26

    申请人： Joseph E. Yokajty ,  Jeffrey P. Serbicki ,  Steven A. Van Slyke

    发明人： Joseph E. Yokajty ,  Jeffrey P. Serbicki ,  Steven A. Van Slyke

    IPC分类号： H01L21/00 ,  H01L29/16

    CPC分类号： H01L51/5246 ,  H01L51/524 ,  H01L2251/5315 ,  H01L2251/566

    摘要： A method of bonding a common cover plate over a plurality of OLED devices formed on a device substrate includes providing an unpatterned or a patterned layer of a pressure-sensitive adhesive (PSA) material over a surface of the cover plate; bonding the cover plate over the OLED devices; and singulating individual OLED devices having a bonded cover plate and permitting electrical access to electrical interconnects associated with each OLED device for attaching electrical leads thereto.

    摘要翻译： 将公共盖板粘合在形成在器件基板上的多个OLED器件上的方法包括在盖板的表面上提供未图案化的或压敏粘合剂（PSA）材料的图案化层; 将盖板结合在OLED器件上; 以及分离具有接合的盖板并且允许电连接到与每个OLED器件相关联的电互连件的单个OLED器件，用于将电引线附接到其上。

    Method of making an OLED display device with enhanced optical and mechanical properties
    6.
    发明授权
    Method of making an OLED display device with enhanced optical and mechanical properties 有权
    制造具有增强的光学和机械性能的OLED显示装置的方法

    公开(公告)号：US07279063B2

    公开(公告)日：2007-10-09

    申请号：US10759914

    申请日：2004-01-16

    申请人： Joseph E. Yokajty ,  Jeffrey P. Serbicki ,  Steven A. Van Slyke

    发明人： Joseph E. Yokajty ,  Jeffrey P. Serbicki ,  Steven A. Van Slyke

    IPC分类号： B29C65/54

    CPC分类号： H01L51/5259 ,  H01L51/5246 ,  H01L2251/5315

    摘要： A method of bonding a cover plate over OLED devices formed on a surface of a device substrate wherein each one of the OLED devices includes at least one electrical interconnect area includes providing a flow-preventing pattern on a surface of the cover plate or on the OLED devices absent from the electrical interconnect areas of the OLED devices to prevent flow of a flowable adhesive material into at least the outermost portions of such interconnect areas; dispensing a selected amount of a flowable curable adhesive material on the surface of the cover plate in registration with the flow-preventing pattern; engaging the cover plate in alignment with the substrate; and curing the adhesive material.

    摘要翻译： 一种将盖板结合在形成在器件基板的表面上的OLED器件上的方法，其中每个OLED器件包括至少一个电互连区域，包括在盖板的表面上或在OLED上提供防流形图案 设备不存在于OLED器件的电互连区域，以防止可流动的粘合剂材料流入该互连区域的至少最外部分; 在所述盖板的表面上分配选定量的可流动固化粘合剂材料，与所述防流动图案对准; 使所述盖板与所述基板对准地接合; 并固化粘合剂材料。