公开(公告)号：US06432847B1

公开(公告)日：2002-08-13

申请号：US09587211

申请日：2000-06-01

申请人： Jian-Shihn Tsang ,  Wen-Chung Tsai ,  Tsung-Yu Chen ,  Chia-Hung Hsu ,  Wei-Chih Lai

发明人： Jian-Shihn Tsang ,  Wen-Chung Tsai ,  Tsung-Yu Chen ,  Chia-Hung Hsu ,  Wei-Chih Lai

IPC分类号： H01L2126

CPC分类号： H01L21/3245 ,  H01L21/268

摘要： A novel method of using lasers for generating driving energy for activating P-type compound semiconductor films and reducing the resistivity thereof. The P-type compound semiconductor films are made from III-V nitrides or II-VI group compounds doped with P-type impurity. The present invention can be carried out in the ambience of atmosphere rather than in the ambience of nitrogen gas. In addition, adjusting the power and focusing distance of a laser source, and the power density can change the time required by the activating process.

摘要翻译： 一种使用激光器产生用于激活P型化合物半导体膜的驱动能并降低其电阻率的新颖方法。 P型化合物半导体膜由掺杂有P型杂质的III-V族氮化物或II-VI族化合物制成。 本发明可以在大气环境中进行，而不是在氮气氛下进行。 此外，调整激光源的功率和聚焦距离，并且功率密度可以改变激活过程所需的时间。

公开(公告)号：US20100129963A1

公开(公告)日：2010-05-27

申请号：US12694239

申请日：2010-01-26

申请人： Chin-Yung Chen ,  Chia-Hung Hsu ,  William Wang ,  Chung-Cheng Chou

发明人： Chin-Yung Chen ,  Chia-Hung Hsu ,  William Wang ,  Chung-Cheng Chou

IPC分类号： H01L21/60

CPC分类号： H01L23/3735 ,  H01L23/3677 ,  H01L24/48 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The invention discloses an integrated circuit package. The integrated circuit package comprises a substrate having a first surface and a second surface opposite thereto and a first hole passing through the substrate from the first surface to the second surface. A plurality of conductive lines is disposed on a portion of the second surface of the substrate. A semiconductor chip is disposed above the second surface of the substrate, wherein a chamber is formed between the semiconductor chip and the substrate. A plurality of bonding pads are disposed on a side of the semiconductor chip which is toward the second surface of the substrate, wherein at least one of the bonding pads are electrically connected to one of the plurality of conductive lines. A first heat dissipation layer is disposed in the first hole, and extends into the chamber. A method for fabricating the integrated circuit package is also provided.

摘要翻译： 本发明公开了一种集成电路封装。 集成电路封装包括具有第一表面和与其相对的第二表面的基板以及从第一表面到第二表面穿过基板的第一孔。 多个导电线设置在基板的第二表面的一部分上。 半导体芯片设置在衬底的第二表面上方，其中在半导体芯片和衬底之间形成腔室。 多个接合焊盘设置在半导体芯片的朝向衬底的第二表面的一侧上，其中至少一个接合焊盘电连接到多条导线之一。 第一散热层设置在第一孔中并延伸到腔室中。 还提供了一种用于制造集成电路封装的方法。

公开(公告)号：US20100238683A1

公开(公告)日：2010-09-23

申请号：US12426962

申请日：2009-04-21

申请人： Chiang-Ching Wang ,  Chi-Wen Kuo ,  Jun-Zhou Chen ,  Chien-Hua Wu ,  Tsung-Hsien Chou ,  Chia-Hung Hsu

发明人： Chiang-Ching Wang ,  Chi-Wen Kuo ,  Jun-Zhou Chen ,  Chien-Hua Wu ,  Tsung-Hsien Chou ,  Chia-Hung Hsu

IPC分类号： H01L33/00

CPC分类号： F21V7/04 ,  G02B6/001 ,  Y10S362/80

摘要： A flexible light-emitting apparatus including a side light-emitting flexible light guide rod, two light emitting diodes, and two lenses is provided. The side light-emitting flexible light guide rod has a first end, a second end opposite to the first end, and a light-emitting surface connecting the first and the second ends. The LEDs are respectively disposed beside the first end and the second end and adapted for emitting light beams toward the side light-emitting flexible light guide rod, respectively. One of the lenses is located between the first end and the LED disposed beside the first end, and the other lens is located between the second end and the LED disposed beside the second end. Each of the light beams enters the side light-emitting flexible light guide rod through the corresponding lens and is transmitted to the outside of the side light-emitting flexible light guide rod through the light-emitting surface.

摘要翻译： 提供了包括侧发光柔性导光杆，两个发光二极管和两个透镜的柔性发光装置。 侧发光柔性导光杆具有第一端，与第一端相对的第二端和连接第一端和第二端的发光面。 LED分别设置在第一端和第二端的旁边，并且分别用于朝向侧面发光柔性导光棒发射光束。 其中一个透镜位于第一端和设置在第一端旁边的LED之间，另一透镜位于第二端和位于第二端旁边的LED之间。 每个光束通过相应的透镜进入侧发光柔性导光杆，并通过发光表面传输到侧发光柔性导光杆的外侧。

公开(公告)号：US20090014317A1

公开(公告)日：2009-01-15

申请号：US11926310

申请日：2007-10-29

申请人： Chia-Yuan CHANG ,  Chia-Hung Hsu

发明人： Chia-Yuan CHANG ,  Chia-Hung Hsu

IPC分类号： C23C14/34

CPC分类号： C23C14/562 ,  C23C14/022

摘要： An apparatus for film deposition on a continuous flexible web includes: a deposition chamber; a web-supporting drum disposed rotatably in the deposition chamber and having an outer surface for supporting the flexible web thereon; a web-conveying unit including a web-supplying roller and a web-take-up roller for conveying the continuous flexible web from the web-supplying roller onto the outer surface of the web-supporting drum and then to the web-take-up roller; and a plurality of sputtering guns disposed around the outer surface of the web-supporting drum for depositing a film on the first surface of the flexible web on the outer surface of the web-supporting drum.

摘要翻译： 用于在连续柔性幅材上沉积膜的设备包括：沉积室; 卷筒纸支撑鼓可旋转地设置在沉积室中，并具有用于在其上支撑柔性幅材的外表面; 纸幅输送单元，其包括幅材供给辊和幅材卷取辊，用于将连续的柔性幅材从幅材供给辊输送到幅材支撑鼓的外表面上，然后到幅材卷取 滚筒; 以及多个溅射枪，其设置在所述幅材支撑滚筒的外表面周围，用于在所述幅材支撑滚筒的外表面上的柔性幅材的第一表面上沉积薄膜。

公开(公告)号：US07993046B2

公开(公告)日：2011-08-09

申请号：US12426962

申请日：2009-04-21

申请人： Chiang-Ching Wang ,  Chi-Wen Kuo ,  Jun-Zhou Chen ,  Chien-Hua Wu ,  Tsung-Hsien Chou ,  Chia-Hung Hsu

发明人： Chiang-Ching Wang ,  Chi-Wen Kuo ,  Jun-Zhou Chen ,  Chien-Hua Wu ,  Tsung-Hsien Chou ,  Chia-Hung Hsu

IPC分类号： F21V7/04 ,  H01L33/00

CPC分类号： F21V7/04 ,  G02B6/001 ,  Y10S362/80

摘要： A flexible light-emitting apparatus including a side light-emitting flexible light guide rod, two light emitting diodes, and two lenses is provided. The side light-emitting flexible light guide rod has a first end, a second end opposite to the first end, and a light-emitting surface connecting the first and the second ends. The LEDs are respectively disposed beside the first end and the second end and adapted for emitting light beams toward the side light-emitting flexible light guide rod, respectively. One of the lenses is located between the first end and the LED disposed beside the first end, and the other lens is located between the second end and the LED disposed beside the second end. Each of the light beams enters the side light-emitting flexible light guide rod through the corresponding lens and is transmitted to the outside of the side light-emitting flexible light guide rod through the light-emitting surface.

摘要翻译： 提供了包括侧发光柔性导光杆，两个发光二极管和两个透镜的柔性发光装置。 侧发光柔性导光杆具有第一端，与第一端相对的第二端和连接第一端和第二端的发光面。 LED分别设置在第一端和第二端的旁边，并且分别用于朝向侧面发光柔性导光棒发射光束。 其中一个透镜位于第一端和设置在第一端旁边的LED之间，另一透镜位于第二端和位于第二端旁边的LED之间。 每个光束通过相应的透镜进入侧发光柔性导光杆，并通过发光表面传输到侧发光柔性导光杆的外侧。

公开(公告)号：US07638956B2

公开(公告)日：2009-12-29

申请号：US11775236

申请日：2007-07-10

申请人： Ming-Dah Liu ,  Yu-Chuan Wen ,  Chia-Hung Hsu

发明人： Ming-Dah Liu ,  Yu-Chuan Wen ,  Chia-Hung Hsu

IPC分类号： G05F1/00

CPC分类号： G01J1/4228 ,  G01J1/0488 ,  G01J1/18 ,  G01J1/32 ,  G01J3/51 ,  G01J3/513 ,  G01J2001/4252

摘要： To control chroma and brightness in a backlight module, a plurality of reference values of a plurality of monochromatic light beams are provided, and a brightness reference value is provided for the light formed of the monochromatic light beams. Then, a plurality of first light signals of the monochromatic light beams, and a second light signal of the light formed of the monochromatic light beams are sensed and compared with the reference values and the brightness reference value, respectively. Finally, the monochromatic light beams outputted by the plurality of LEDs is calibrated according to a comparison result of the plurality of first light signals with the plurality of reference values and a comparison result of the second light signal with the brightness reference value.

摘要翻译： 为了控制背光模块中的色度和亮度，提供多个单色光束的多个参考值，并且为由单色光束形成的光提供亮度基准值。 然后，分别检测单色光束的多个第一光信号和由单色光束形成的光的第二光信号，并将其与基准值和亮度基准值进行比较。 最后，根据具有多个参考值的多个第一光信号的比较结果和第二光信号与亮度参考值的比较结果，校准由多个LED输出的单色光束。

公开(公告)号：US20090197494A1

公开(公告)日：2009-08-06

申请号：US12155988

申请日：2008-06-12

申请人： Chia-Yuan Chang ,  Chia-Hung Hsu

发明人： Chia-Yuan Chang ,  Chia-Hung Hsu

IPC分类号： C23C14/14 ,  D03D15/00 ,  B32B15/14

CPC分类号： C23C14/205 ,  Y10T442/3398 ,  Y10T442/481 ,  Y10T442/657

摘要： A method for producing an anti-microbial fabric includes: (a) depositing anti-microbial metal-based clusters on an outer surface of a fabric substrate by sputtering a metal-based target material which possesses anti-microbial activity and which is prone to oxidation upon air exposure; and (b) depositing oxidation-resistant metal-based clusters on the outer surface of the fabric substrate by sputtering an oxidation-resistant metal-based target material in such an amount as to enable the oxidation-resistant metal-based clusters to partially cover the anti-microbial metal-based clusters so as to permit exposure of at least a part of one of the anti-microbial metal-based clusters. An anti-microbial fabric produced thereby is also disclosed.

摘要翻译： 抗微生物织物的制造方法包括：（a）通过溅射具有抗微生物活性且容易氧化的金属靶材，在织物基材的外表面上沉积抗微生物金属簇 经空气曝晒; 和（b）通过溅射抗氧化金属基靶材料使其抗氧化金属基团能够部分地覆盖在织物基材的外表面上，从而将抗氧化金属基簇沉积 抗微生物金属基簇以允许至少一部分抗微生物金属基簇的暴露。 还公开了由此制备的抗微生物织物。

公开(公告)号：US20090179324A1

公开(公告)日：2009-07-16

申请号：US12102439

申请日：2008-04-14

申请人： Chin-Yung Chen ,  Chia-Hung Hsu ,  William Wang ,  Chung-Cheng Chou

发明人： Chin-Yung Chen ,  Chia-Hung Hsu ,  William Wang ,  Chung-Cheng Chou

IPC分类号： H01L23/36 ,  H01L21/56

CPC分类号： H01L23/3735 ,  H01L23/3677 ,  H01L24/48 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The invention discloses an integrated circuit package. The integrated circuit package comprises a substrate having a first surface and a second surface opposite thereto and a first hole passing through the substrate from the first surface to the second surface. A plurality of conductive lines is disposed on a portion of the second surface of the substrate. A semiconductor chip is disposed above the second surface of the substrate, wherein a chamber is formed between the semiconductor chip and the substrate. A plurality of bonding pads are disposed on a side of the semiconductor chip which is toward the second surface of the substrate, wherein at least one of the bonding pads are electrically connected to one of the plurality of conductive lines. A first heat dissipation layer is disposed in the first hole, and extends into the chamber. A method for fabricating the integrated circuit package is also provided.

摘要翻译： 本发明公开了一种集成电路封装。 集成电路封装包括具有第一表面和与其相对的第二表面的基板以及从第一表面到第二表面穿过基板的第一孔。 多个导电线设置在基板的第二表面的一部分上。 半导体芯片设置在衬底的第二表面上方，其中在半导体芯片和衬底之间形成腔室。 多个接合焊盘设置在半导体芯片的朝向衬底的第二表面的一侧上，其中至少一个接合焊盘电连接到多条导线之一。 第一散热层设置在第一孔中并延伸到腔室中。 还提供了一种用于制造集成电路封装的方法。

公开(公告)号：US20080068597A1

公开(公告)日：2008-03-20

申请号：US11775236

申请日：2007-07-10

申请人： Ming-Dah Liu ,  Yu-Chuan Wen ,  Chia-Hung Hsu

发明人： Ming-Dah Liu ,  Yu-Chuan Wen ,  Chia-Hung Hsu

IPC分类号： G01J1/10

CPC分类号： G01J1/4228 ,  G01J1/0488 ,  G01J1/18 ,  G01J1/32 ,  G01J3/51 ,  G01J3/513 ,  G01J2001/4252

摘要： To control chroma and brightness in a backlight module, a plurality of reference values of a plurality of monochromatic light beams are provided, and a brightness reference value is provided for the light formed of the monochromatic light beams. Then, a plurality of first light signals of the monochromatic light beams, and a second light signal of the light formed of the monochromatic light beams are sensed and compared with the reference values and the brightness reference value, respectively. Finally, the monochromatic light beams outputted by the plurality of LEDs is calibrated according to a comparison result of the plurality of first light signals with the plurality of reference values and a comparison result of the second light signal with the brightness reference value.

摘要翻译： 为了控制背光模块中的色度和亮度，提供多个单色光束的多个参考值，并且为由单色光束形成的光提供亮度基准值。 然后，分别检测单色光束的多个第一光信号和由单色光束形成的光的第二光信号，并将其与基准值和亮度基准值进行比较。 最后，根据具有多个参考值的多个第一光信号的比较结果和第二光信号与亮度参考值的比较结果，校准由多个LED输出的单色光束。

公开(公告)号：US07829388B2

公开(公告)日：2010-11-09

申请号：US12694239

申请日：2010-01-26

申请人： Chin-Yung Chen ,  Chia-Hung Hsu ,  William Wang ,  Chung-Cheng Chou

发明人： Chin-Yung Chen ,  Chia-Hung Hsu ,  William Wang ,  Chung-Cheng Chou

IPC分类号： H01L21/00

CPC分类号： H01L23/3735 ,  H01L23/3677 ,  H01L24/48 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The invention discloses an integrated circuit package. The integrated circuit package comprises a substrate having a first surface and a second surface opposite thereto and a first hole passing through the substrate from the first surface to the second surface. A plurality of conductive lines is disposed on a portion of the second surface of the substrate. A semiconductor chip is disposed above the second surface of the substrate, wherein a chamber is formed between the semiconductor chip and the substrate. A plurality of bonding pads are disposed on a side of the semiconductor chip which is toward the second surface of the substrate, wherein at least one of the bonding pads are electrically connected to one of the plurality of conductive lines. A first heat dissipation layer is disposed in the first hole, and extends into the chamber. A method for fabricating the integrated circuit package is also provided.

摘要翻译： 本发明公开了一种集成电路封装。 集成电路封装包括具有第一表面和与其相对的第二表面的基板以及从第一表面到第二表面穿过基板的第一孔。 多个导电线设置在基板的第二表面的一部分上。 半导体芯片设置在衬底的第二表面上方，其中在半导体芯片和衬底之间形成腔室。 多个接合焊盘设置在半导体芯片的朝向衬底的第二表面的一侧上，其中至少一个接合焊盘电连接到多条导线之一。 第一散热层设置在第一孔中并延伸到腔室中。 还提供了一种用于制造集成电路封装的方法。