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1.发明授权Control of overpolishing of multiple substrates on the same platen in chemical mechanical polishing 失效在化学机械抛光中控制同一台板上多个基板的抛光公开(公告)号：US08616935B2
公开(公告)日：2013-12-31
申请号：US12792651
申请日：2010-06-02
申请人： Jimin Zhang , Ingemar Carlsson , Stephen Jew , Boguslaw A Swedek
发明人： Jimin Zhang , Ingemar Carlsson , Stephen Jew , Boguslaw A Swedek
CPC分类号： B24B37/013 , B24B49/12
摘要： A polishing method includes simultaneously polishing two substrates, a first substrate and a second substrate, on the same polishing pad. A default overpolishing time is stored and an in-situ monitoring system monitors the two substrates. The in-situ monitoring system further determines a first polishing endpoint time and a second polishing endpoint time of the first and second substrates, respectively. The polishing method further includes calculating an overpolishing stop time where the overpolishing stop time is between the first polishing endpoint time plus the default overpolishing time and the second polishing endpoint time plus the default overpolishing time. Polishing of the first substrate is continued past the first polishing endpoint time and polishing of the second substrate is continued past the second polishing endpoint time. Polishing of both the first substrate and the second substrate is halted simultaneously at the overpolishing stop time.
摘要翻译： 抛光方法包括在同一抛光垫上同时抛光两个基板，第一基板和第二基板。 存储默认的过度抛光时间，并且现场监控系统监控两个基板。 原位监测系统还分别确定第一和第二基底的第一抛光终点时间和第二抛光终点时间。 抛光方法还包括计算过度抛光停止时间，其中抛光停止时间在第一抛光终点时间加上默认过度抛光时间与第二抛光终点时间加上默认过度抛光时间之间。 第一衬底的抛光继续经过第一抛光终点时间，并且第二衬底的抛光继续经过第二抛光终点时间。 在抛光停止时间同时停止第一基板和第二基板的抛光。
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公开(公告)号：US07074109B1
公开(公告)日：2006-07-11
申请号：US10920701
申请日：2004-08-17
IPC分类号： B24B49/00
CPC分类号： H01L21/3212 , B24B37/013 , B24B49/00 , H01L22/26
摘要： A system, method, and computer program product for chemical mechanical polishing a substrate in which initially a plurality of predetermined pressures are applied to a plurality of regions of the substrate. A plurality of portions of the substrate are monitored during polishing with an in-situ monitoring system. If the difference in thickness between two portions of the substrate exceeds a predetermined threshold, a plurality of adjusted pressures are calculated in a closed-loop control system, and the plurality of adjusted pressures are applied to the plurality of regions of the substrate. The predetermined threshold includes an initial threshold for the start of the polishing process and a second threshold for a period of polishing after the start of the polishing process.
摘要翻译： 一种用于化学机械抛光衬底的系统，方法和计算机程序产品，其中最初将多个预定压力施加到衬底的多个区域。 在用原位监测系统进行抛光时监测基板的多个部分。 如果基板的两个部分之间的厚度差超过预定阈值，则在闭环控制系统中计算多个调节压力，并且将多个调节压力施加到基板的多个区域。 预定阈值包括用于开始抛光处理的初始阈值和在抛光过程开始之后的抛光周期的第二阈值。
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公开(公告)号：US08393940B2
公开(公告)日：2013-03-12
申请号：US12762175
申请日：2010-04-16
IPC分类号： B24D11/00
CPC分类号： B24B37/205
摘要： A polishing pad includes a polishing layer having a polishing surface, an adhesive layer on a side of the polishing layer opposite the polishing layer, and a solid light-transmitting window extending through and molded to the polishing layer. The solid light-transmitting window has an upper portion with a first lateral dimension and a lower portion with a second lateral dimension that is smaller than the first lateral dimension. A top surface of the solid light-transmitting window coplanar with the polishing surface and a bottom surface of the solid light-transmitting window coplanar with a lower surface of the adhesive layer.
摘要翻译： 抛光垫包括具有抛光表面的抛光层，与抛光层相对的抛光层一侧的粘合剂层，以及延伸穿过模制到抛光层的固体透光窗。 固体透光窗具有具有第一横向尺寸的上部和具有小于第一横向尺寸的第二横向尺寸的下部。 固体透光窗的顶表面与抛光表面共面并且固体透光窗的底表面与粘合剂层的下表面共面。
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公开(公告)号：US08585790B2
公开(公告)日：2013-11-19
申请号：US12761334
申请日：2010-04-15
CPC分类号： B24B37/205 , B24D18/0009
摘要： A window of solid light-transmissive polymer is formed in a polishing pad, and at least one surface of the window is treated to increase the smoothness of the at least one surface. Treating the surface of the window can include heating the at least one surface and pressing with a solid rigid part.
摘要翻译： 在抛光垫中形成固体透光聚合物的窗口，并且处理窗口的至少一个表面以增加至少一个表面的平滑度。 处理窗口的表面可以包括加热至少一个表面并用固体刚性部分进行加压。
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公开(公告)号：US06966816B2
公开(公告)日：2005-11-22
申请号：US09847867
申请日：2001-05-02
IPC分类号： B24B37/005 , B24B37/04 , B24B49/02 , B24B49/10 , B24B49/12 , G01B11/06 , H01L21/304 , B24B49/00
CPC分类号： B24B37/013 , B24B49/02 , B24B49/10 , B24B49/12 , G01B7/105 , G01B11/0683
摘要： A chemical mechanical polishing apparatus and method can use an eddy current monitoring system and an optical monitoring system. Signals from the monitoring systems can be combined on an output line and extracted by a computer. A thickness of a polishing pad can be calculated. The eddy current monitoring system and optical monitoring system can measure substantially the same location on the substrate.
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公开(公告)号：US06945845B2
公开(公告)日：2005-09-20
申请号：US10643773
申请日：2003-08-18
CPC分类号： B24B37/013 , B24B37/04 , B24B49/105
摘要： Conductive elements of a chemical mechanical polishing system may generate undesired eddy currents under the influence of a time-dependent magnetic field used in an eddy current monitoring system. To improve the accuracy of an eddy current monitoring system, elements that may contribute an undesired signal to the sensed eddy current signal may be fabricated from a non-conductive material such as plastic or ceramic. In some implementations, elements may be fabricated from non-magnetic materials.
摘要翻译： 化学机械抛光系统的导电元件可能在涡流监测系统中使用的时间依赖磁场的影响下产生不期望的涡流。 为了提高涡流监测系统的精度，可能会对非传导性材料（如塑料或陶瓷）制造可能对感测到的涡流信号造成不必要信号的元件。 在一些实施方案中，元件可以由非磁性材料制成。
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公开(公告)号：US07101254B2
公开(公告)日：2006-09-05
申请号：US10966948
申请日：2004-10-15
CPC分类号： B24B37/345 , B24B37/005 , B24B49/105 , G01B7/105 , H01L21/67219 , H01L22/12
摘要： A system includes a measuring station for positioning an eddy current probe proximate to a substrate in a substrate holder. The probe can produce a time-varying magnetic field, in order to induce eddy currents in one or more conductive regions of a substrate either prior to or subsequent to polishing. The eddy current signals are detected, and may be used to update one or more polishing parameters for a chemical mechanical polishing system. The substrate holder may be located in a number places; for example, in a substrate transfer system, a factory interface module, a cleaner, or in a portion of the chemical mechanical polishing system away from the polishing stations. Additional probes may be used.
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公开(公告)号：US06811466B1
公开(公告)日：2004-11-02
申请号：US10330685
申请日：2002-12-27
IPC分类号： B24B4900
CPC分类号： B24B37/345 , B24B37/005 , B24B49/105 , G01B7/105 , H01L21/67219 , H01L22/12
摘要： A system includes a measuring station for positioning an eddy current probe proximate to a substrate in a substrate holder. The probe can produce a time-varying magnetic field, in order to induce eddy currents in one or more conductive regions of a substrate either prior to or subsequent to polishing. The eddy current signals are detected, and may be used to update one or more polishing parameters for a chemical mechanical polishing system. The substrate holder may be located in a number places; for example, in a substrate transfer system, a factory interface module, a cleaner, or in a portion of the chemical mechanical polishing system away from the polishing stations. Additional probes may be used.
摘要翻译： 一种系统包括用于将涡流探针靠近衬底保持器中的衬底定位的测量站。 探针可以产生时变磁场，以便在抛光之前或之后在衬底的一个或多个导电区域中引起涡流。 检测涡流信号，并可用于更新化学机械抛光系统的一个或多个抛光参数。 衬底保持器可以位于多个位置; 例如，在基板传送系统，工厂接口模块，清洁器或化学机械抛光系统的远离抛光站的一部分中。 可以使用附加的探针。
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