公开(公告)号：US20100299638A1

公开(公告)日：2010-11-25

申请号：US12557322

申请日：2009-09-10

申请人： Jin-Won CHOI

发明人： Jin-Won CHOI

IPC分类号： G06F3/033 ,  G06F3/048

CPC分类号： G06F3/04886 ,  G06F3/0488 ,  G06F3/04883

摘要： A function execution method and apparatus thereof for displaying one or more sub-functions included in a function selected by a first touch on a trace according to a second touch input based upon the first and the second touches inputted with a timing difference, and executing the relevant sub-function selected among the displayed one or more sub-functions. For this purpose, a function execution method according to the present invention is performed by comprising: detecting a first touch input touched on a display unit; detecting a drag created by a second touch inputted while maintaining the first touch; and displaying one or more sub-functions included in a function selected by the first touch along a trace of the detected drag on the display unit.

摘要翻译： 一种功能执行方法及其装置，用于根据基于以定时差输入的第一触摸和第二触摸，根据第二触摸输入，在轨迹上由第一次触摸选择的功能中包含的一个或多个子功能，以及执行 在显示的一个或多个子功能中选择相关子功能。 为此，根据本发明的功能执行方法包括：检测在显示单元上触摸的第一触摸输入; 检测在保持第一次触摸的同时输入的第二触摸产生的拖动; 以及在所述显示单元上沿着所述检测到的拖动的迹线，显示包括在由所述第一触摸选择的功能中的一个或多个子功能。

公开(公告)号：US20100270067A1

公开(公告)日：2010-10-28

申请号：US12611558

申请日：2009-11-03

申请人： Jin-Won CHOI ,  Tae-Joon Chung ,  Dong-Gyu Lee ,  Seok-Hwan Ahn ,  Seung-Wan Kim

发明人： Jin-Won CHOI ,  Tae-Joon Chung ,  Dong-Gyu Lee ,  Seok-Hwan Ahn ,  Seung-Wan Kim

IPC分类号： H05K1/11 ,  H05K3/10

CPC分类号： H05K3/243 ,  H01L2224/0401 ,  H01L2224/05572 ,  H01L2224/13022 ,  H01L2924/0002 ,  H05K3/0035 ,  H05K3/245 ,  H05K3/3473 ,  H05K3/3484 ,  H05K2201/0367 ,  H05K2203/043 ,  H05K2203/054 ,  Y10T29/49155 ,  H01L2224/05552

摘要： A printed circuit board and a method of manufacturing the printed circuit board are disclosed. In accordance with an embodiment of the present invention, the method includes providing a substrate having a pad formed thereon, forming a resist on the substrate, in which the resist has an opening formed therein such that the pad is exposed, forming a metal post inside the opening such that the metal post is electrically connected to the pad, forming a through-hole in the resist by removing a portion of the resist such that the through-hole surrounds the metal post, and forming a solder layer inside the through-hole and on an upper surface of the metal post so as to cover an exposed surface of the metal post.

摘要翻译： 公开了印刷电路板和印刷电路板的制造方法。 根据本发明的一个实施方案，该方法包括提供一种其上形成有垫的衬底，在衬底上形成抗蚀剂，其中抗蚀剂具有形成在其中的开口，使得衬垫暴露，在其内形成金属柱 所述开口使得所述金属柱电连接到所述焊盘，通过去除所述抗蚀剂的一部分使得所述通孔围绕所述金属柱而在所述抗蚀剂中形成通孔，并且在所述通孔内部形成焊料层 并且在金属柱的上表面上，以覆盖金属柱的暴露表面。