公开(公告)号：US09671123B2

公开(公告)日：2017-06-06

申请号：US13598073

申请日：2012-08-29

申请人： Dong Gyu Lee ,  Ho Yoon ,  Jae Hun Choi ,  Tae Ha Jun

发明人： Dong Gyu Lee ,  Ho Yoon ,  Jae Hun Choi ,  Tae Ha Jun

IPC分类号： B23K9/10 ,  A61L9/22 ,  F24F11/00

CPC分类号： F24F11/006 ,  F24F11/30 ,  F24F11/46 ,  F24F11/49 ,  F24F11/61 ,  F24F11/62 ,  F24F11/63 ,  F24F11/66 ,  F24F11/88

摘要： An air conditioner having an indoor unit and an outdoor unit, at least one of which includes a communication unit, a switching unit turned on when communication lines are connected to the communication unit, turned off in a standby mode, and turned on when the standby mode is released, a voltage distribution unit distributing voltage applied to the communication unit when the switching unit is turned off, a voltage adjustment unit adjusting the voltage applied to the communication unit and transmitting the adjusted voltage to the communication unit, and a control unit turning the switching unit on when driving voltage is input to the control unit, turning the switching unit off when the at least one of the indoor unit and the outdoor unit enters the standby mode, and turning the switching unit on based on the voltage distributed by the voltage distribution unit in the standby mode.

公开(公告)号：US09287304B2

公开(公告)日：2016-03-15

申请号：US13098030

申请日：2011-04-29

申请人： Seong Hyung Park ,  Woon Il Choi ,  Seung Hoon Sa ,  Cheong Yong Park ,  Dong Gyu Lee ,  Hyun Jong Ji

发明人： Seong Hyung Park ,  Woon Il Choi ,  Seung Hoon Sa ,  Cheong Yong Park ,  Dong Gyu Lee ,  Hyun Jong Ji

IPC分类号： H01J40/14 ,  H01L27/00 ,  H01L27/146 ,  H04N5/355

CPC分类号： H01L27/14609 ,  H01L27/14641 ,  H04N5/3559

摘要： Provided are a pixel, a pixel array, and an image sensor including the pixel array. The pixel includes a photoelectric converter, a capacitor, a variable capacitor, and a switching element. The capacitor accumulates electric charges converted by the photoelectric converter. The variable capacitor is connected to the capacitor, and has capacitance varied according to a potential of the capacitor. The switching element outputs the potential of the capacitor.

摘要翻译： 提供了像素，像素阵列和包括像素阵列的图像传感器。 像素包括光电转换器，电容器，可变电容器和开关元件。 电容器累积由光电转换器转换的电荷。 可变电容器连接到电容器，并且具有根据电容器的电位而变化的电容。 开关元件输出电容器的电位。

公开(公告)号：US20130129805A1

公开(公告)日：2013-05-23

申请号：US13299697

申请日：2011-11-18

申请人： Il Hoon CHO ,  Dong Gyu LEE ,  Young Yeol YANG

发明人： Il Hoon CHO ,  Dong Gyu LEE ,  Young Yeol YANG

IPC分类号： A01N25/08 ,  A01P1/00 ,  A01N59/16 ,  A01N25/00 ,  B82Y99/00

CPC分类号： A01N59/16 ,  B82Y30/00 ,  A01N25/04 ,  A01N25/08 ,  A01N25/34

摘要： Disclosed herein are an anti-bacterial, anti-fungal and anti-viral composition with excellent sterilizing power, deodorization and adhesion activity, an application thereof, and a method for preparing the same. The composition with sterilizing activity against bacteria, fungus and virus comprises colloidal silver particles in an amount of from 11 wt % to 15 wt %, titanium dioxide nanoparticles in an amount of from 18 wt % to 25 wt %, a dispersion stabilizer in an amount of from 0.01 wt % to 10 wt %, a binder in an amount of from 0.1 wt % to 4 wt %, and a balance of water in an amount required to form 100 wt %.

摘要翻译： 本文公开了具有优异的杀菌力，除臭和粘附活性的抗细菌，抗真菌和抗病毒组合物，其应用及其制备方法。 具有针对细菌，真菌和病毒的杀菌活性的组合物包含量为11重量％至15重量％的胶体银颗粒，量为18重量％至25重量％的二氧化钛纳米颗粒，量为分散稳定剂 为0.01重量％〜10重量％的粘合剂，0.1重量％〜4重量％的粘合剂，余量为形成100重量％所需量的水。

公开(公告)号：US20120267285A1

公开(公告)日：2012-10-25

申请号：US13411168

申请日：2012-03-02

申请人： Dong Gyu LEE ,  Jin Won Choi ,  Sung Won Jeong ,  Dae Young Lee ,  Gi Sub Lee ,  Jin Ho Kim

发明人： Dong Gyu LEE ,  Jin Won Choi ,  Sung Won Jeong ,  Dae Young Lee ,  Gi Sub Lee ,  Jin Ho Kim

IPC分类号： B65D85/00 ,  B65B1/04

CPC分类号： H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0346 ,  H01L2224/0347 ,  H01L2224/0401 ,  H01L2224/05572 ,  H01L2224/05647 ,  H01L2224/10145 ,  H01L2224/1146 ,  H01L2224/11849 ,  H01L2224/13022 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/014 ,  Y10T29/49165 ,  H01L2924/00012 ,  H01L2924/01028 ,  H01L2924/01046 ,  H01L2924/01083 ,  H01L2224/05552

摘要： Disclosed herein are a package substrate and a fabricating method thereof. The package substrate includes a substrate including at least one conductive pad, an insulation layer formed on the substrate and including an opening through which the conductive pad is exposed, a blister prevention layer formed along a top surface of the conductive pad exposed through the opening and a sidewall of the insulation layer, a metal post made of at least one alloy material and formed on the blister prevention layer, and a heat-diffusion prevention film formed on the metal post.

摘要翻译： 这里公开了一种封装基板及其制造方法。 封装衬底包括：衬底，其包括至少一个导电焊盘，形成在衬底上的绝缘层，并且包括导电焊盘暴露的开口，沿着通过开口暴露的导电焊盘的顶表面形成的防泡层， 绝缘层的侧壁，由至少一种合金材料制成并形成在防泡层上的金属柱以及形成在金属柱上的热扩散防止膜。

公开(公告)号：US20120261549A1

公开(公告)日：2012-10-18

申请号：US13098030

申请日：2011-04-29

申请人： SEONG HYUNG PARK ,  Woon II Choi ,  Seung Hoon Sa ,  Cheong Yong Park ,  Dong Gyu Lee ,  Hyun Jong Ji

发明人： SEONG HYUNG PARK ,  Woon II Choi ,  Seung Hoon Sa ,  Cheong Yong Park ,  Dong Gyu Lee ,  Hyun Jong Ji

IPC分类号： H01L27/146 ,  H01L31/02

CPC分类号： H01L27/14609 ,  H01L27/14641 ,  H04N5/3559

摘要： Provided are a pixel, a pixel array, and an image sensor including the pixel array. The pixel includes a photoelectric converter, a capacitor, a variable capacitor, and a switching element. The capacitor accumulates electric charges converted by the photoelectric converter. The variable capacitor is connected to the capacitor, and has capacitance varied according to a potential of the capacitor. The switching element outputs the potential of the capacitor.

摘要翻译： 提供了像素，像素阵列和包括像素阵列的图像传感器。 像素包括光电转换器，电容器，可变电容器和开关元件。 电容器累积由光电转换器转换的电荷。 可变电容器连接到电容器，并且具有根据电容器的电位而变化的电容。 开关元件输出电容器的电位。

公开(公告)号：US20120257093A1

公开(公告)日：2012-10-11

申请号：US13097704

申请日：2011-04-29

申请人： Seung Hoon Sa ,  Woon Il Choi ,  Seong Hyung Park ,  Chun Hee Jeong ,  Dong Hyuk Park ,  Cheong Yong Park ,  Jung Chan Kyoung ,  Jung Wan Jeong ,  Dong Gyu Lee ,  Jong Min You ,  Hyun Jong Ji

发明人： Seung Hoon Sa ,  Woon Il Choi ,  Seong Hyung Park ,  Chun Hee Jeong ,  Dong Hyuk Park ,  Cheong Yong Park ,  Jung Chan Kyoung ,  Jung Wan Jeong ,  Dong Gyu Lee ,  Jong Min You ,  Hyun Jong Ji

IPC分类号： H04N5/335

CPC分类号： H01L27/14609 ,  H01L27/14641 ,  H04N5/3559 ,  H04N5/37452

摘要： Disclosed are a pixel, a pixel array, an image sensor including the pixel array and a method for operating the image sensor. The pixel includes a photo-electro conversion unit; a first capacitor for storing a first quantity of charges of the photo-electro conversion unit; a second capacitor for storing a second quantity of charges of the photo-electro conversion unit; and an output unit to output the first and second quantities of the charges.

摘要翻译： 公开了像素，像素阵列，包括像素阵列的图像传感器和用于操作图像传感器的方法。 像素包括光电转换单元; 用于存储光电转换单元的第一电荷量的第一电容器; 用于存储光电转换单元的第二数量的电荷的第二电容器; 以及输出单元，用于输出第一和第二数量的电荷。

公开(公告)号：US08142240B2

公开(公告)日：2012-03-27

申请号：US12805214

申请日：2010-07-19

申请人： Heung Jae Oh ,  Ki Taek Lee ,  Dong Gyu Lee ,  Sung Won Jeong ,  Jin Won Choi

发明人： Heung Jae Oh ,  Ki Taek Lee ,  Dong Gyu Lee ,  Sung Won Jeong ,  Jin Won Choi

IPC分类号： H01R4/02

CPC分类号： H05K3/3426 ,  H01L2924/15312 ,  H05K2201/10318 ,  H05K2201/10772 ,  Y02P70/613

摘要： Disclosed herein is a lead pin for a package substrate.The lead pin for the package substrate includes a cylindrical connection pin; and a head part that is formed on one end of the connection pin and has a convex round part formed on the lower end of the head part, having a step part. When the lead pin for the package substrate is mounted on the package substrate, the bulge phenomenon of a solder paste that surrounds the head part and is melted is prevented by a flange part, thereby making it possible to prevent the connection pin from being polluted and to improve a contact defect such as a short defect or the like when coupling a socket.

摘要翻译： 这里公开了一种用于封装衬底的引脚。 用于封装衬底的引脚包括圆柱形连接销; 以及头部，其形成在所述连接销的一端上，并且具有形成在所述头部的下端上的凸形圆形部分，具有台阶部分。 当封装基板的引脚安装在封装基板上时，通过凸缘部防止围绕头部并熔化的焊膏的凸起现象，从而可以防止连接引脚受到污染， 以在连接插座时改善诸如短缺陷等的接触缺陷。

公开(公告)号：US20110014827A1

公开(公告)日：2011-01-20

申请号：US12805214

申请日：2010-07-19

申请人： Heung Jae Oh ,  Ki Taek Lee ,  Dong Gyu Lee ,  Sung Won Jeong ,  Jin Won Choi

发明人： Heung Jae Oh ,  Ki Taek Lee ,  Dong Gyu Lee ,  Sung Won Jeong ,  Jin Won Choi

IPC分类号： H01R13/04

CPC分类号： H05K3/3426 ,  H01L2924/15312 ,  H05K2201/10318 ,  H05K2201/10772 ,  Y02P70/613

摘要： Disclosed herein is a lead pin for a package substrate.The lead pin for the package substrate includes a cylindrical connection pin; and a head part that is formed on one end of the connection pin and has a convex round part formed on the lower end of the head part, having a step part. When the lead pin for the package substrate is mounted on the package substrate, the bulge phenomenon of a solder paste that surrounds the head part and is melted is prevented by a flange part, thereby making it possible to prevent the connection pin from being polluted and to improve a contact defect such as a short defect or the like when coupling a socket.

摘要翻译： 这里公开了一种用于封装衬底的引脚。 用于封装衬底的引脚包括圆柱形连接销; 以及头部，其形成在所述连接销的一端上，并且具有形成在所述头部的下端上的凸形圆形部分，具有台阶部分。 当封装基板的引脚安装在封装基板上时，通过凸缘部防止围绕头部并熔化的焊膏的凸起现象，从而可以防止连接引脚受到污染， 以在连接插座时改善诸如短缺陷等的接触缺陷。

公开(公告)号：US20100270067A1

公开(公告)日：2010-10-28

申请号：US12611558

申请日：2009-11-03

申请人： Jin-Won CHOI ,  Tae-Joon Chung ,  Dong-Gyu Lee ,  Seok-Hwan Ahn ,  Seung-Wan Kim

发明人： Jin-Won CHOI ,  Tae-Joon Chung ,  Dong-Gyu Lee ,  Seok-Hwan Ahn ,  Seung-Wan Kim

IPC分类号： H05K1/11 ,  H05K3/10

CPC分类号： H05K3/243 ,  H01L2224/0401 ,  H01L2224/05572 ,  H01L2224/13022 ,  H01L2924/0002 ,  H05K3/0035 ,  H05K3/245 ,  H05K3/3473 ,  H05K3/3484 ,  H05K2201/0367 ,  H05K2203/043 ,  H05K2203/054 ,  Y10T29/49155 ,  H01L2224/05552

摘要： A printed circuit board and a method of manufacturing the printed circuit board are disclosed. In accordance with an embodiment of the present invention, the method includes providing a substrate having a pad formed thereon, forming a resist on the substrate, in which the resist has an opening formed therein such that the pad is exposed, forming a metal post inside the opening such that the metal post is electrically connected to the pad, forming a through-hole in the resist by removing a portion of the resist such that the through-hole surrounds the metal post, and forming a solder layer inside the through-hole and on an upper surface of the metal post so as to cover an exposed surface of the metal post.

摘要翻译： 公开了印刷电路板和印刷电路板的制造方法。 根据本发明的一个实施方案，该方法包括提供一种其上形成有垫的衬底，在衬底上形成抗蚀剂，其中抗蚀剂具有形成在其中的开口，使得衬垫暴露，在其内形成金属柱 所述开口使得所述金属柱电连接到所述焊盘，通过去除所述抗蚀剂的一部分使得所述通孔围绕所述金属柱而在所述抗蚀剂中形成通孔，并且在所述通孔内部形成焊料层 并且在金属柱的上表面上，以覆盖金属柱的暴露表面。

公开(公告)号：US07736952B2

公开(公告)日：2010-06-15

申请号：US12010544

申请日：2008-01-25

申请人： Soon-Jin Cho ,  Jin-Won Choi ,  Seung-Hyun Cho ,  Chung-Woo Cho ,  Dong-Gyu Lee ,  Seok-Hwan Ahn

发明人： Soon-Jin Cho ,  Jin-Won Choi ,  Seung-Hyun Cho ,  Chung-Woo Cho ,  Dong-Gyu Lee ,  Seok-Hwan Ahn

IPC分类号： H01L21/00 ,  H01L21/58

CPC分类号： H01L24/11 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05024 ,  H01L2224/05147 ,  H01L2224/05571 ,  H01L2224/05572 ,  H01L2224/056 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/00014

摘要： A wafer packaging method is disclosed.An aspect of the invention is to provide a wafer packaging method comprising; attaching tape onto one side of a carrier, the carrier having a through-hole formed therein; attaching a wafer onto the tape exposed inside the through-hole such that at least one electrode of the wafer is exposed; and performing a packaging process on the carrier such that the wafer is packaged.

摘要翻译： 公开了一种晶片封装方法。 本发明的一个方面是提供一种晶片封装方法，包括： 将带附着到载体的一侧上，所述载体具有形成在其中的通孔; 将晶片附接到暴露在通孔内的带上，使得晶片的至少一个电极露出; 以及在所述载体上执行封装处理以使所述晶片被封装。