公开(公告)号：US20090189175A1

公开(公告)日：2009-07-30

申请号：US12078117

申请日：2008-03-27

申请人： Ik-Seong Park ,  Sun-Hong Kim ,  Jin-Won Lee ,  Kyoung-Il Park

发明人： Ik-Seong Park ,  Sun-Hong Kim ,  Jin-Won Lee ,  Kyoung-Il Park

IPC分类号： H01L33/00

CPC分类号： H01L33/486 ,  H01L33/60 ,  H01L2924/0002 ,  H01L2924/00

摘要： Disclosed is a side view light emitting diode (LED) package whose light emitting surface has been relatively expanded. The LED package includes a housing and a lead frame extended externally through the housing and bent in a direction of the recessed space. The housing includes a reflecting housing having a cavity and a supporting housing.

摘要翻译： 公开了一种其发光表面相对膨胀的侧视发光二极管（LED）封装。 LED封装包括壳体和引线框架，引线框架从外部延伸穿过壳体并在凹陷空间的方向上弯曲。 壳体包括具有空腔和支撑壳体的反射壳体。

公开(公告)号：USD596147S1

公开(公告)日：2009-07-14

申请号：US29309451

申请日：2008-08-19

申请人： Ik-Seong Park ,  Sun-Hong Kim ,  Jin-Won Lee ,  Kyoung-il Park

设计人： Ik-Seong Park ,  Sun-Hong Kim ,  Jin-Won Lee ,  Kyoung-il Park

公开(公告)号：USD601518S1

公开(公告)日：2009-10-06

申请号：US29323341

申请日：2008-08-22

申请人： Jin-Won Lee ,  Kyoung-Il Park ,  Sun-Hong Kim

设计人： Jin-Won Lee ,  Kyoung-Il Park ,  Sun-Hong Kim

公开(公告)号：US07598101B2

公开(公告)日：2009-10-06

申请号：US11906869

申请日：2007-10-04

申请人： Ik-Seong Park ,  Jin-Won Lee ,  Chi-Ok In ,  Sun-Hong Kim

发明人： Ik-Seong Park ,  Jin-Won Lee ,  Chi-Ok In ,  Sun-Hong Kim

IPC分类号： H01L21/00

CPC分类号： H01L33/60 ,  G02B6/0031 ,  G02B6/0065 ,  G02B6/0068 ,  G02B6/0073 ,  G02B6/0083 ,  G02B6/0091 ,  H01L24/45 ,  H01L24/73 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/20752 ,  H01L2924/00

摘要： A side view type light emitting diode and a method of manufacturing the same are disclosed. The method may include (a) providing lead frames which include a cathode terminal and an anode terminal, (b) forming a reflector which surrounds the lead frames, such that portions of the cathode terminal and anode terminal protrude from both sides, and which includes a groove open in the upward direction and a wall surrounding the groove, (c) die-attaching an LED chip onto the lead frames inside the groove, (d) bonding the LED chip to the cathode terminal or to the anode terminal with a conductive wire, (e) dispensing a liquid curable resin into the groove to form a lens part and (f) sawing the walls facing each other using a sawing machine such that the thicknesses at the upper surfaces are about 0.04 mm to about 0.05 mm.

摘要翻译： 公开了侧视型发光二极管及其制造方法。 该方法可以包括（a）提供包括阴极端子和阳极端子的引线框架，（b）形成围绕引线框架的反射器，使得阴极端子和阳极端子的部分从两侧突出，并且其包括 一个沿向上方向开放的凹槽和一个围绕凹槽的壁，（c）将一个LED芯片嵌入到凹槽内的引线框架上;（d）将LED芯片连接到阴极端子或阳极端子上，导电 电线，（e）将液体可固化树脂分配到凹槽中以形成透镜部分，以及（f）使用锯切机锯切彼此的壁，使得上表面的厚度为约0.04mm至约0.05mm。

公开(公告)号：US20100019267A1

公开(公告)日：2010-01-28

申请号：US12572974

申请日：2009-10-02

申请人： Ik-Seong PARK ,  Jin-Won Lee ,  Chi-Ok In ,  Sun-Hong Kim

发明人： Ik-Seong PARK ,  Jin-Won Lee ,  Chi-Ok In ,  Sun-Hong Kim

IPC分类号： H01L33/00

CPC分类号： H01L33/60 ,  G02B6/0031 ,  G02B6/0065 ,  G02B6/0068 ,  G02B6/0073 ,  G02B6/0083 ,  G02B6/0091 ,  H01L24/45 ,  H01L24/73 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/20752 ,  H01L2924/00

摘要： A side view type light emitting diode (LED) and a method of manufacturing the same are disclosed. In one embodiment, the LED includes i) a pair of lead frames, ii) a reflector surrounding the lead frames, wherein a groove is defined in the reflector, wherein the reflector comprises a plurality of walls surrounding the groove, and wherein at least two walls of the groove face each other, iii) an LED chip mounted in the groove and electrically connected to the lead frames and iv) a lens array contained in the groove.

摘要翻译： 公开了一种侧视型发光二极管（LED）及其制造方法。 在一个实施例中，LED包括i）一对引线框架，ii）围绕引线框架的反射器，其中在反射器中限定凹槽，其中反射器包括围绕凹槽的多个壁，并且其中至少两个 沟槽的壁面彼此面对，iii）安装在凹槽中并电连接到引线框架的LED芯片，以及iv）容纳在凹槽中的透镜阵列。

公开(公告)号：US20080038853A1

公开(公告)日：2008-02-14

申请号：US11906869

申请日：2007-10-04

申请人： Ik-Seong Park ,  Jin-Won Lee ,  Chi-Ok In ,  Sun-Hong Kim

发明人： Ik-Seong Park ,  Jin-Won Lee ,  Chi-Ok In ,  Sun-Hong Kim

IPC分类号： H01L21/00

CPC分类号： H01L33/60 ,  G02B6/0031 ,  G02B6/0065 ,  G02B6/0068 ,  G02B6/0073 ,  G02B6/0083 ,  G02B6/0091 ,  H01L24/45 ,  H01L24/73 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/20752 ,  H01L2924/00

摘要： A side view type light emitting diode and a method of manufacturing the same are disclosed. The method may include (a) providing lead frames which include a cathode terminal and an anode terminal, (b) forming a reflector which surrounds the lead frames, such that portions of the cathode terminal and anode terminal protrude from both sides, and which includes a groove open in the upward direction and a wall surrounding the groove, (c) die-attaching an LED chip onto the lead frames inside the groove, (d) bonding the LED chip to the cathode terminal or to the anode terminal with a conductive wire, (e) dispensing a liquid curable resin into the groove to form a lens part and (D sawing the walls facing each other using a sawing machine such that the thicknesses at the upper surfaces are about 0.04 mm to about 0.05 mm.

摘要翻译： 公开了侧视型发光二极管及其制造方法。 该方法可以包括（a）提供包括阴极端子和阳极端子的引线框架，（b）形成围绕引线框架的反射器，使得阴极端子和阳极端子的部分从两侧突出，并且其包括 一个沿向上方向开放的凹槽和一个围绕凹槽的壁，（c）将一个LED芯片嵌入到凹槽内的引线框架上;（d）将LED芯片连接到阴极端子或阳极端子上，导电 （e）将液体可固化树脂分配到凹槽中以形成透镜部分;（D使用锯切机锯切彼此的壁，使得上表面的厚度为约0.04mm至约0.05mm。

公开(公告)号：USD549187S1

公开(公告)日：2007-08-21

申请号：US29262322

申请日：2006-06-28

申请人： Ik-Seong Park ,  Jin-Won Lee ,  Chi-Ok In ,  Sun-Hong Kim ,  Hwa-Kyung Choi

设计人： Ik-Seong Park ,  Jin-Won Lee ,  Chi-Ok In ,  Sun-Hong Kim ,  Hwa-Kyung Choi

公开(公告)号：US07910948B2

公开(公告)日：2011-03-22

申请号：US12483560

申请日：2009-06-12

申请人： Sun-Hong Kim ,  Jin-Won Lee ,  Kyoung-Il Park

发明人： Sun-Hong Kim ,  Jin-Won Lee ,  Kyoung-Il Park

IPC分类号： H01L23/495

CPC分类号： H01L33/62 ,  H01L23/49537 ,  H01L33/486 ,  H01L2924/0002 ,  H01L2924/00

摘要： A light emitting diode package is provided including: a lead frame that includes an electrode pad and an electrode lead that are integrally formed to each other; and a housing, wherein the electrode pad is exposed in a first direction through a window formed by inner walls of the housing, and the electrode lead is exposed in a second direction through a through-hole, wherein the housing includes a step jaw prepared by sinking the housing inner walls.

摘要翻译： 提供了一种发光二极管封装，包括：引线框架，其包括彼此一体形成的电极焊盘和电极引线; 以及壳体，其中所述电极焊盘通过由所述壳体的内壁形成的窗口沿第一方向暴露，并且所述电极引线通过通孔在第二方向上暴露，其中所述壳体包括由 沉没房屋内墙。

公开(公告)号：USD599305S1

公开(公告)日：2009-09-01

申请号：US29324178

申请日：2008-09-08

申请人： Sun-Hong Kim ,  Jin-Won Lee ,  Kyoung-Il Park

设计人： Sun-Hong Kim ,  Jin-Won Lee ,  Kyoung-Il Park

公开(公告)号：US20090309122A1

公开(公告)日：2009-12-17

申请号：US12483560

申请日：2009-06-12

申请人： Sun-Hong Kim ,  Jin-Won Lee ,  Kyoung-Il Park

发明人： Sun-Hong Kim ,  Jin-Won Lee ,  Kyoung-Il Park

IPC分类号： H01L23/495

CPC分类号： H01L33/62 ,  H01L23/49537 ,  H01L33/486 ,  H01L2924/0002 ,  H01L2924/00

摘要： A light emitting diode package is provided including: a lead frame that includes an electrode pad and an electrode lead that are integrally formed to each other; and a housing, wherein the electrode pad is exposed in a first direction through a window formed by inner walls of the housing, and the electrode lead is exposed in a second direction through a through-hole, wherein the housing includes a step jaw prepared by sinking the housing inner walls.

摘要翻译： 提供了一种发光二极管封装，包括：引线框架，其包括彼此一体形成的电极焊盘和电极引线; 以及壳体，其中所述电极焊盘通过由所述壳体的内壁形成的窗口沿第一方向暴露，并且所述电极引线通过通孔在第二方向上暴露，其中所述壳体包括由 沉没房屋内墙。