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17 条记录 (耗时 0.024 秒)

    Structure for measuring the etching speed
    1.
    发明授权
    Structure for measuring the etching speed 有权
    用于测量蚀刻速度的结构

    公开(公告)号：US07208065B2

    公开(公告)日：2007-04-24

    申请号：US10875306

    申请日：2004-06-25

    申请人： Jing-Hung Chiou ,  Kai-Hsiang Yen ,  Chin-Horng Wang ,  Chao-Chiun Liang ,  Stella Y. H. Chen

    发明人： Jing-Hung Chiou ,  Kai-Hsiang Yen ,  Chin-Horng Wang ,  Chao-Chiun Liang ,  Stella Y. H. Chen

    IPC分类号： H01L21/306

    CPC分类号： B81C99/004 ,  H01L22/34

    摘要： The specification discloses a structure and method for measuring the etching speed. A test layer is connected with several resistors. Etching the metal layer disconnects in order the resistors from the circuit. The equivalent resistance of the sensing resistor system is measured to obtain the etching speed. In consideration of the errors of the resistors, the invention also provides a structure that utilizes an IC layout technique to put an interdigitized dummy resistor beside the sensing resistors. By taking the ratio of the equivalent resistance of the sensing resistors and the dummy resistor, the invention can compute to obtain the etching speed.

    摘要翻译： 该说明书公开了一种用于测量蚀刻速度的结构和方法。 测试层与几个电阻相连。 金属层的蚀刻使电阻与电路顺序断开。 测量感测电阻器系统的等效电阻以获得蚀刻速度。 考虑到电阻器的误差，本发明还提供一种利用IC布局技术将交错式虚拟电阻器放置在感测电阻器旁边的结构。 通过获取感测电阻器和虚拟电阻器的等效电阻的比率，本发明可以计算以获得蚀刻速度。

    Method for measuring the etching speed
    2.
    发明授权
    Method for measuring the etching speed 失效
    测量蚀刻速度的方法

    公开(公告)号：US06828164B2

    公开(公告)日：2004-12-07

    申请号：US10402995

    申请日：2003-04-01

    申请人： Jing-Hung Chiou ,  Kai-Hsiang Yen ,  Chin-Horng Wang ,  Chao-Chiun Liang ,  Stella Y. H. Chen

    发明人： Jing-Hung Chiou ,  Kai-Hsiang Yen ,  Chin-Horng Wang ,  Chao-Chiun Liang ,  Stella Y. H. Chen

    IPC分类号： H01L2166

    CPC分类号： B81C99/004 ,  H01L22/34

    摘要： The specification discloses a structure and method for measuring the etching speed. A test layer is connected with several resistors. Etching the metal layer disconnects in order the resistors from the circuit. The equivalent resistance of the sensing resistor system is measured to obtain the etching speed. In consideration of the errors of the resistors, the invention also provides a structure that utilizes an IC layout technique to put an interdigitized dummy resistor beside the sensing resistors. By taking the ratio of the equivalent resistance of the sensing resistors and the dummy resistor, the invention can compute to obtain the etching speed.

    摘要翻译： 该说明书公开了一种用于测量蚀刻速度的结构和方法。 测试层与几个电阻相连。 金属层的蚀刻使电阻与电路顺序断开。 测量感测电阻器系统的等效电阻以获得蚀刻速度。 考虑到电阻器的误差，本发明还提供一种利用IC布局技术将交错式虚拟电阻器放置在感测电阻器旁边的结构。 通过获取感测电阻器和虚拟电阻器的等效电阻的比率，本发明可以计算以获得蚀刻速度。

    Ultra thin package for electric acoustic sensor chip of micro electro mechanical system
    3.
    发明授权
    Ultra thin package for electric acoustic sensor chip of micro electro mechanical system 有权
    微电子机械系统电声传感器芯片超薄封装

    公开(公告)号：US08508022B2

    公开(公告)日：2013-08-13

    申请号：US12172900

    申请日：2008-07-14

    申请人： Tzong-Che Ho ,  Jason Pan ,  Pin Chang ,  Chin-Horng Wang ,  Jung-Tai Chen ,  Hsin-Li Lee ,  Kai-Hsiang Yen

    发明人： Tzong-Che Ho ,  Jason Pan ,  Pin Chang ,  Chin-Horng Wang ,  Jung-Tai Chen ,  Hsin-Li Lee ,  Kai-Hsiang Yen

    IPC分类号： H01L23/552 ,  H01L21/00 ,  H05K7/00

    CPC分类号： H04R19/005 ,  B81B7/0058 ,  B81B2201/0257 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An ultra thin package for an electric acoustic sensor chip of a micro electro mechanical system is provided. A substrate has a first substrate surface and a second substrate surface opposite to the first substrate surface. At least one conductor bump is formed on the second substrate surface. An electric acoustic sensor chip having a first chip surface and a second chip surface opposite to the first chip surface is provided. The first chip surface is electrically connected to the conductor bump. The conductor bump is positioned between the second substrate surface and the first chip surface to create a space. The conductor bump is used for transferring a signal from the sensor chip to the substrate. An acoustic opening passing through the substrate is formed.

    摘要翻译： 提供了一种用于微机电系统的电声传感器芯片的超薄封装。 衬底具有与第一衬底表面相对的第一衬底表面和第二衬底表面。 在第二基板表面上形成至少一个导体凸块。 提供具有与第一芯片表面相对的第一芯片表面和第二芯片表面的电声传感器芯片。 第一芯片表面电连接到导体凸块。 导体凸块位于第二基板表面和第一芯片表面之间以产生空间。 导体凸块用于将信号从传感器芯片传送到基板。 形成通过基板的声学开口。

    ULTRA THIN PACKAGE FOR ELECTRIC ACOUSTIC SENSOR CHIP OF MICRO ELECTRO MECHANICAL SYSTEM
    4.
    发明申请
    ULTRA THIN PACKAGE FOR ELECTRIC ACOUSTIC SENSOR CHIP OF MICRO ELECTRO MECHANICAL SYSTEM 有权
    微电子机械系统电声传感器芯片超薄包

    公开(公告)号：US20090161901A1

    公开(公告)日：2009-06-25

    申请号：US12172900

    申请日：2008-07-14

    申请人： Tzong-Che Ho ,  Jason Pan ,  Pin Chang ,  Chin-Horng Wang ,  Jung-Tai Chen ,  Hsin-Li Lee ,  Kai-Hsiang Yen

    发明人： Tzong-Che Ho ,  Jason Pan ,  Pin Chang ,  Chin-Horng Wang ,  Jung-Tai Chen ,  Hsin-Li Lee ,  Kai-Hsiang Yen

    IPC分类号： H04R1/00

    CPC分类号： H04R19/005 ,  B81B7/0058 ,  B81B2201/0257 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An ultra thin package for an electric acoustic sensor chip of a micro electro mechanical system is provided. A substrate has a first substrate surface and a second substrate surface opposite to the first substrate surface. At least one conductor bump is formed on the second substrate surface. An electric acoustic sensor chip having a first chip surface and a second chip surface opposite to the first chip surface is provided. The first chip surface is electrically connected to the conductor bump. The conductor bump is positioned between the second substrate surface and the first chip surface to create a space. The conductor bump is used for transferring a signal from the sensor chip to the substrate. An acoustic opening passing through the substrate is formed.

    摘要翻译： 提供了一种用于微机电系统的电声传感器芯片的超薄封装。 衬底具有与第一衬底表面相对的第一衬底表面和第二衬底表面。 在第二基板表面上形成至少一个导体凸块。 提供具有与第一芯片表面相对的第一芯片表面和第二芯片表面的电声传感器芯片。 第一芯片表面电连接到导体凸块。 导体凸块位于第二基板表面和第一芯片表面之间以产生空间。 导体凸块用于将信号从传感器芯片传送到基板。 形成通过基板的声学开口。

    Inkjet printhead
    7.
    发明申请
    Inkjet printhead 审中-公开
    喷墨打印头

    公开(公告)号：US20080062224A1

    公开(公告)日：2008-03-13

    申请号：US11892588

    申请日：2007-08-24

    申请人： Yu-Jen Fang ,  Chin-Horng Wang

    发明人： Yu-Jen Fang ,  Chin-Horng Wang

    IPC分类号： B41J2/14

    CPC分类号： B41J2/14314 ,  B41J2002/14411

    摘要： An inkjet printhead having at least an auxiliary actuator being added in the inkjet printhead structure, is able to increase the frequency response thereof and to increase the positioning precision and structure rigidity of the inkjet printhead by using a single wafer bonding step in the process of producing the same.

    摘要翻译： 具有至少一个辅助致动器的喷墨打印头在喷墨打印头结构中被添加，能够通过在生产过程中使用单个晶片结合步骤来增加其频率响应并增加喷墨打印头的定位精度和结构刚性 一样。

    MICRO-SPEAKER AND MANUFACTURING METHOD THEREOF
    8.
    发明申请
    MICRO-SPEAKER AND MANUFACTURING METHOD THEREOF 有权
    微型扬声器及其制造方法

    公开(公告)号：US20100150381A1

    公开(公告)日：2010-06-17

    申请号：US12431736

    申请日：2009-04-28

    申请人： Hsin-Li Lee ,  Chin-Horng Wang ,  Cheng-Hsin Chuang ,  Jin-Yao Lai

    发明人： Hsin-Li Lee ,  Chin-Horng Wang ,  Cheng-Hsin Chuang ,  Jin-Yao Lai

    IPC分类号： H04R17/00

    CPC分类号： H04R17/00 ,  H04R31/006 ,  Y10T29/42

    摘要： A micro-speaker and a manufacturing method thereof are provided. The micro-speaker has a sandwich structure. The micro-speaker includes two piezoelectric material layers and a diaphragm disposed between the two piezoelectric material layers, where the piezoelectric material layers have a ring-shaped structure. The problem of insufficient sound pressure at low frequency is resolved, and the flexibility of the micro-speaker is improved.

    摘要翻译： 提供微型扬声器及其制造方法。 微型扬声器具有夹层结构。 微型扬声器包括两个压电材料层和设置在两个压电材料层之间的隔膜，其中压电材料层具有环形结构。 解决了低频声压不足的问题，提高了微型扬声器的灵活性。