公开(公告)号：US09052332B2

公开(公告)日：2015-06-09

申请号：US13484681

申请日：2012-05-31

申请人： Chih-Wei Huang ,  Chieh-Pin Chang ,  Ja-Hao Chen ,  Chuan-Jane Chao ,  Ying-Zong Juang ,  Shyh-Chyi Wong ,  Yeong-Her Wang

发明人： Chih-Wei Huang ,  Chieh-Pin Chang ,  Ja-Hao Chen ,  Chuan-Jane Chao ,  Ying-Zong Juang ,  Shyh-Chyi Wong ,  Yeong-Her Wang

IPC分类号： G01P15/09 ,  G01P15/08 ,  G01P15/12

CPC分类号： G01P15/0802 ,  G01P15/123 ,  G01P2015/0837

摘要： A pizeoresistive type Z-axis accelerometer is provided, including a substrate; a plurality of anchors formed over the substrate; a plurality of cantilever beams, wherein the cantilever beams include a piezoresistive material; and a proof mass, wherein the proof mass is suspended over the substrate by respectively connecting the proof mass with the anchors, and the accelerometer senses a movement of the proof mass by the piezoresistive material.

摘要翻译： 提供了一种包括基板的等离子体型Z轴加速度计， 形成在所述基板上的多个锚固件; 多个悬臂梁，其中所述悬臂梁包括压阻材料; 以及证明物质，其中通过分别将证明物质与锚固件连接，将证明物料悬浮在基材上，并且加速度计通过压阻材料感测证明物质的移动。

公开(公告)号：US08946742B2

公开(公告)日：2015-02-03

申请号：US12897124

申请日：2010-10-04

申请人： Chen-Hua Yu ,  Hung-Pin Chang ,  Yung-Chi Lin ,  Chia-Lin Yu ,  Jui-Pin Hung ,  Chien Ling Hwang

发明人： Chen-Hua Yu ,  Hung-Pin Chang ,  Yung-Chi Lin ,  Chia-Lin Yu ,  Jui-Pin Hung ,  Chien Ling Hwang

IPC分类号： H01L33/00 ,  H01L21/768 ,  H01L21/683 ,  H01L23/48 ,  H01L33/48 ,  H01L33/64 ,  H01L21/48 ,  H01L23/14 ,  H01L23/498 ,  H01L23/00 ,  H01L33/62

CPC分类号： H01L21/76898 ,  H01L21/3065 ,  H01L21/486 ,  H01L21/6835 ,  H01L21/76843 ,  H01L21/76876 ,  H01L21/76877 ,  H01L21/76879 ,  H01L23/147 ,  H01L23/481 ,  H01L23/49827 ,  H01L24/29 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L33/005 ,  H01L33/0054 ,  H01L33/486 ,  H01L33/62 ,  H01L33/641 ,  H01L33/644 ,  H01L33/647 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/32506 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48233 ,  H01L2224/49113 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/04941 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2933/0066 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The substrate with through silicon plugs (or vias) described above removes the need for conductive bumps. The process flow is very simple and cost efficient. The structures described combines the separate TSV, redistribution layer, and conductive bump structures into a single structure. By combining the separate structures, a low resistance electrical connection with high heat dissipation capability is created. In addition, the substrate with through silicon plugs (or vias, or trenches) also allows multiple chips to be packaged together. A through silicon trench can surround the one or more chips to provide protection against copper diffusing to neighboring devices during manufacturing. In addition, multiple chips with similar or different functions can be integrated on the TSV substrate. Through silicon plugs with different patterns can be used under a semiconductor chip(s) to improve heat dissipation and to resolve manufacturing concerns.

摘要翻译： 具有上述通孔硅衬底（或通孔）的基板消除了对导电凸块的需要。 流程非常简单，成本效益高。 所描述的结构将单独的TSV，再分配层和导电凸块结构组合成单个结构。 通过组合单独的结构，产生具有高散热能力的低电阻电连接。 此外，具有通过硅插头（或通孔或沟槽）的基板还允许将多个芯片封装在一起。 通过硅沟槽可围绕一个或多个芯片，以在制造期间提供防止铜扩散到相邻器件的保护。 此外，具有相似或不同功能的多个芯片可以集成在TSV基板上。 通过具有不同图案的硅插头可以在半导体芯片下使用以改善散热并解决制造问题。

公开(公告)号：US08904868B2

公开(公告)日：2014-12-09

申请号：US13458359

申请日：2012-04-27

申请人： Chih-Wei Huang ,  Chieh-Pin Chang ,  Ja-Hao Chen ,  Chuan-Jane Chao ,  Ying-Zong Juang ,  Shyh-Chyi Wong ,  Yeong-Her Wang

发明人： Chih-Wei Huang ,  Chieh-Pin Chang ,  Ja-Hao Chen ,  Chuan-Jane Chao ,  Ying-Zong Juang ,  Shyh-Chyi Wong ,  Yeong-Her Wang

IPC分类号： G01P15/125 ,  G01P15/08

CPC分类号： G01P15/125 ,  G01P2015/0814

摘要： A sensing apparatus includes an acceleration sensing unit, for measuring an acceleration applied to a proof mass, further including: a proof mass; a carrier signal source, for providing a carrier signal; a capacitive half-bridge, including a first and a second capacitor, wherein each capacitor is coupled to the proof mass and the carrier signal source, one with a positive electrode and the other one with a negative electrode, and the acceleration applied to the proof mass makes the carrier signal flow through the first and the second capacitor so that the first capacitor and the second capacitor respectively generates a first voltage and a second voltage variation which have opposite phases with each other; and an instrumentation amplifier, for receiving and amplifying the first voltage and the second voltage variation, whereby the magnitude and the direction of the acceleration applied to the proof mass is determined.

摘要翻译： 感测装置包括加速度检测单元，用于测量施加到检验质量块的加速度，还包括：检验质量块; 载波信号源，用于提供载波信号; 包括第一和第二电容器的电容半桥，其中每个电容器耦合到检测质量块和载波信号源，一个具有正电极，另一个与负电极耦合，并且加速度应用于证明 质量使载体信号流过第一和第二电容器，使得第一电容器和第二电容器分别产生彼此具有相反相位的第一电压和第二电压变化; 以及用于接收和放大第一电压和第二电压变化的仪表放大器，由此确定施加到检验质量块的加速度的大小和方向。

公开(公告)号：US08841773B2

公开(公告)日：2014-09-23

申请号：US13608456

申请日：2012-09-10

申请人： Hung-Pin Chang ,  Chien-Ming Chiu ,  Tsang-Jiuh Wu ,  Shau-Lin Shue ,  Chen-Hua Yu

发明人： Hung-Pin Chang ,  Chien-Ming Chiu ,  Tsang-Jiuh Wu ,  Shau-Lin Shue ,  Chen-Hua Yu

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L21/768 ,  H01L21/683 ,  H01L23/00 ,  H01L23/525

CPC分类号： H01L21/76898 ,  H01L21/6835 ,  H01L23/525 ,  H01L24/13 ,  H01L24/14 ,  H01L2221/68359 ,  H01L2224/13022 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13184 ,  H01L2224/14181 ,  H01L2924/01019 ,  H01L2924/01327 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/00

摘要： A multi-layer interconnect structure for stacked die configurations is provided. Through-substrate vias are formed in a semiconductor substrate. A backside of the semiconductor substrate is thinned to expose the through-substrate vias. An isolation film is formed over the backside of the semiconductor substrate and the exposed portion of the through-substrate vias. A first conductive element is formed electrically coupled to respective ones of the through-substrate vias and extending over the isolation film. One or more additional layers of isolation films and conductive elements may be formed, with connection elements such as solder balls being electrically coupled to the uppermost conductive elements.

摘要翻译： 提供了用于堆叠管芯配置的多层互连结构。 在半导体衬底中形成贯通衬底通孔。 将半导体衬底的背面变薄以暴露通过衬底的通孔。 在半导体衬底的背面和贯通衬底通孔的暴露部分之后形成隔离膜。 第一导电元件被形成为电耦合到贯穿衬底通孔中的相应通孔并且在隔离膜上延伸。 可以形成一个或多个附加层的隔离膜和导电元件，其中诸如焊球的连接元件电耦合到最上面的导电元件。

公开(公告)号：US08840288B2

公开(公告)日：2014-09-23

申请号：US12938139

申请日：2010-11-02

申请人： Richard Plavetich ,  Ching Pin Chang

发明人： Richard Plavetich ,  Ching Pin Chang

IPC分类号： B60J7/043 ,  B60Q1/26 ,  B60Q3/02 ,  B60K37/06

CPC分类号： B60Q1/268 ,  B60Q3/208 ,  B60Q3/82

摘要： A vehicle window assembly includes a vehicle structure, a window panel and a light source. The vehicle structure defines a viewing aperture. The window panel is mounted to the vehicle structure and covers the viewing aperture. The window panel has a peripheral edge surrounding a first window surface and a second window surface opposite the first window surface. The first window surface includes an etched section. The light source is mounted to the vehicle structure adjacent to a portion of the peripheral edge of the window panel such that light from the light source is directed to the portion of the peripheral edge of the window panel. The light travels in a lateral direction through the window panel selectively illuminating the etched section.

摘要翻译： 车窗组件包括车辆结构，窗面板和光源。 车辆结构限定了观察孔。 窗面板安装到车辆结构并覆盖观察孔。 窗口面板具有围绕第一窗表面的周边边缘和与第一窗口表面相对的第二窗口表面。 第一窗表面包括蚀刻部分。 光源被安装到车辆结构附近，与窗口板的周缘的一部分相邻，使得来自光源的光指向窗板周边的部分。 光沿横向移动通过窗口板选择性地照射蚀刻部分。

公开(公告)号：US08740018B2

公开(公告)日：2014-06-03

申请号：US12964456

申请日：2010-12-09

申请人： Hui-Pin Chang

发明人： Hui-Pin Chang

IPC分类号： G01F11/20

CPC分类号： B65D88/64

摘要： A feeder with variable rhomboidal walls includes a base housing, a soft hopper, a plurality of extrusion mechanisms, a pusher screw pole, a motor, and a decelerator. The extrusion mechanisms are respectively provided at four appropriate positions of the soft hopper, and are activated by protruding wheels with the aid of the motor in conjunction with the decelerator, so that the four extrusion mechanisms operate in pairs to squeeze the soft hopper while rendering a rhomboidal space change. Accordingly, a bridge effect associated with the prior art is eliminated to allow a raw material to fall and then to be dispensed by the pusher screw rod for further processing.

摘要翻译： 具有可变菱形壁的进料器包括基座，软料斗，多个挤压机构，推杆螺杆，马达和减速器。 挤压机构分别设置在软料斗的四个适当的位置处，并借助于电动机与减速器一起由凸轮致动，使得四个挤压机构成对地操作以挤压软料斗，同时呈现 菱形空间变化。 因此，消除了与现有技术相关联的桥梁效应，以允许原材料下落，然后由推杆螺杆分配以用于进一步处理。

公开(公告)号：US08538079B2

公开(公告)日：2013-09-17

申请号：US13227119

申请日：2011-09-07

申请人： Yin-Pin Chang ,  Wen-Yan Chang ,  Hong-Long Chou

发明人： Yin-Pin Chang ,  Wen-Yan Chang ,  Hong-Long Chou

IPC分类号： G06K9/00 ,  G06K9/62 ,  G06K9/36

CPC分类号： G06T7/77 ,  G06T2207/10024

摘要： An apparatus capable of detecting location of object contained in image data and its detecting method are disclosed. The apparatus comprises an image capturing module, a weight assignment module, and a processing module. The image capturing module is for capturing an image. The weight assignment module performs the pixel weight/probability assignment according to the priori information and the image, and figures out the initial gravity center of the object according to the object location initialization. The processing module performs the statistical analysis according to the result of the pixel weight/probability assignment and the initial gravity center of the object so as to obtain the analysis result and update the object location. The processing module determines whether or not the analysis result meets the preset value, if it does, the processing module outputs an estimated result; if it doesn't, the processing module repeats the foregoing processes.

摘要翻译： 公开了能够检测图像数据中包含的对象的位置的装置及其检测方法。 该装置包括图像捕获模块，重量分配模块和处理模块。 图像捕获模块用于捕获图像。 权重分配模块根据先验信息和图像执行像素权重/概率分配，并根据对象位置初始化来计算对象的初始重心。 处理模块根据像素权重/概率分配的结果和对象的初始重心进行统计分析，以获得分析结果并更新对象位置。 处理模块确定分析结果是否满足预设值，如果是，则处理模块输出估计结果; 如果没有，则处理模块重复上述处理。

公开(公告)号：US08508022B2

公开(公告)日：2013-08-13

申请号：US12172900

申请日：2008-07-14

申请人： Tzong-Che Ho ,  Jason Pan ,  Pin Chang ,  Chin-Horng Wang ,  Jung-Tai Chen ,  Hsin-Li Lee ,  Kai-Hsiang Yen

发明人： Tzong-Che Ho ,  Jason Pan ,  Pin Chang ,  Chin-Horng Wang ,  Jung-Tai Chen ,  Hsin-Li Lee ,  Kai-Hsiang Yen

IPC分类号： H01L23/552 ,  H01L21/00 ,  H05K7/00

CPC分类号： H04R19/005 ,  B81B7/0058 ,  B81B2201/0257 ,  H01L2924/0002 ,  H01L2924/00

摘要： An ultra thin package for an electric acoustic sensor chip of a micro electro mechanical system is provided. A substrate has a first substrate surface and a second substrate surface opposite to the first substrate surface. At least one conductor bump is formed on the second substrate surface. An electric acoustic sensor chip having a first chip surface and a second chip surface opposite to the first chip surface is provided. The first chip surface is electrically connected to the conductor bump. The conductor bump is positioned between the second substrate surface and the first chip surface to create a space. The conductor bump is used for transferring a signal from the sensor chip to the substrate. An acoustic opening passing through the substrate is formed.

摘要翻译： 提供了一种用于微机电系统的电声传感器芯片的超薄封装。 衬底具有与第一衬底表面相对的第一衬底表面和第二衬底表面。 在第二基板表面上形成至少一个导体凸块。 提供具有与第一芯片表面相对的第一芯片表面和第二芯片表面的电声传感器芯片。 第一芯片表面电连接到导体凸块。 导体凸块位于第二基板表面和第一芯片表面之间以产生空间。 导体凸块用于将信号从传感器芯片传送到基板。 形成通过基板的声学开口。

公开(公告)号：US08507940B2

公开(公告)日：2013-08-13

申请号：US12879584

申请日：2010-09-10

申请人： Chen-Hua Yu ,  Hung-Pin Chang ,  Yung-Chi Lin ,  Chia-Lin Yu ,  Jui-Pin Hung ,  Chien Ling Hwang

发明人： Chen-Hua Yu ,  Hung-Pin Chang ,  Yung-Chi Lin ,  Chia-Lin Yu ,  Jui-Pin Hung ,  Chien Ling Hwang

IPC分类号： H01L33/00

CPC分类号： H01L21/76898 ,  H01L21/3065 ,  H01L21/486 ,  H01L21/6835 ,  H01L21/76843 ,  H01L21/76876 ,  H01L21/76877 ,  H01L21/76879 ,  H01L23/147 ,  H01L23/481 ,  H01L23/49827 ,  H01L24/29 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L33/005 ,  H01L33/0054 ,  H01L33/486 ,  H01L33/62 ,  H01L33/641 ,  H01L33/644 ,  H01L33/647 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/32506 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48233 ,  H01L2224/49113 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/04941 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2933/0066 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The package substrates with through silicon plugs (or vias) described above provide lateral and vertical heat dissipation pathways for semiconductor chips that require thermal management. Designs of through silicon plugs (TSPs) with high duty ratios can most effectively provide heat dissipation. TSP designs with patterns of double-sided combs can provide high duty ratios, such as equal to or greater than 50%. Package substrates with high duty ratios are useful for semiconductor chips that generate large amount of heat. An example of such semiconductor chip is a light-emitting diode (LED) chip.

摘要翻译： 具有上述通孔硅封装（或通孔）的封装衬底为需要热管理的半导体芯片提供侧向和垂直散热​​路径。 具有高占空比的通过硅插头（TSP）的设计可以最有效地提供散热。 具有双面梳状图案的TSP设计可以提供等于或大于50％的高占空比。 具有高占空比的封装衬底对于产生大量热量的半导体芯片是有用的。 这种半导体芯片的例子是发光二极管（LED）芯片。

公开(公告)号：US08483453B2

公开(公告)日：2013-07-09

申请号：US13074557

申请日：2011-03-29

申请人： Tai-Chang Yang ,  Yin-Pin Chang ,  Wen-Yan Chang ,  Hong-Long Chou

发明人： Tai-Chang Yang ,  Yin-Pin Chang ,  Wen-Yan Chang ,  Hong-Long Chou

IPC分类号： G06K9/00

CPC分类号： G06K9/00832 ,  B60H2001/00992 ,  G06K9/00288

摘要： A vehicle apparatus control system and method thereof are disclosed. The vehicle apparatus control system comprises a data storage module, an image capturing module, a face recognition module and a control module. The data storage module stores multiple registered users' facial feature parameters and vehicle apparatus setting parameters, and integration setting data. The face recognition module detects several facial images contained in the captured image and recognizes the users corresponding to the face images according to the facial feature parameters stored in data storage module. The control module set a vehicle apparatus according to the integration setting data, and the corresponding users' vehicle apparatus setting parameters.

摘要翻译： 公开了一种车辆装置控制系统及其方法。 车辆装置控制系统包括数据存储模块，图像捕获模块，人脸识别模块和控制模块。 数据存储模块存储多个注册用户的面部特征参数和车辆设备设置参数，以及积分设置数据。 面部识别模块根据存储在数据存储模块中的面部特征参数，检测拍摄图像中包含的几张面部图像，并识别对应于面部图像的用户。 控制模块根据积分设定数据和对应的用户的车辆装置设定参数设定车辆装置。