SPIKE ANNEAL RESIDENCE TIME REDUCTION IN RAPID THERMAL PROCESSING CHAMBERS
    1.
    发明申请
    SPIKE ANNEAL RESIDENCE TIME REDUCTION IN RAPID THERMAL PROCESSING CHAMBERS 有权
    快速热处理炉中SPIKE ANNEAL RESIDENCE TIME减少

    公开(公告)号:US20130206362A1

    公开(公告)日:2013-08-15

    申请号:US13370164

    申请日:2012-02-09

    摘要: The present invention generally relates to methods of cooling a substrate during rapid thermal processing. The methods generally include positioning a substrate in a chamber and applying heat to the substrate. After the temperature of the substrate is increased to a desired temperature, the substrate is rapidly cooled. Rapid cooling of the substrate is facilitated by increasing a flow rate of a gas through the chamber. Rapid cooling of the substrate is further facilitated by positioning the substrate in close proximity to a cooling plate. The cooling plate removes heat from substrate via conduction facilitated by gas located therebetween. The distance between the cooling plate and the substrate can be adjusted to create a turbulent gas flow therebetween, which further facilitates removal of heat from the substrate. After the substrate is sufficiently cooled, the substrate is removed from the chamber.

    摘要翻译: 本发明一般涉及在快速热处理期间冷却衬底的方法。 所述方法通常包括将基底定位在腔室中并向基底施加热量。 在将衬底的温度升高到所需温度之后,快速冷却衬底。 通过增加通过室的气体的流速来促进衬底的快速冷却。 通过将衬底定位在靠近冷却板的方式进一步促进衬底的快速冷却。 冷却板通过由位于其间的气体促进的传导从衬底去除热量。 可以调节冷却板和基板之间的距离以在它们之间产生湍流气流,这进一步有助于从基板去除热量。 在衬底充分冷却之后,将衬底从腔室中取出。

    Spike anneal residence time reduction in rapid thermal processing chambers
    2.
    发明授权
    Spike anneal residence time reduction in rapid thermal processing chambers 有权
    快速热处理室中尖峰退火停留时间的减少

    公开(公告)号:US08939760B2

    公开(公告)日:2015-01-27

    申请号:US13370164

    申请日:2012-02-09

    IPC分类号: F27D15/02

    摘要: The present invention generally relates to methods of cooling a substrate during rapid thermal processing. The methods generally include positioning a substrate in a chamber and applying heat to the substrate. After the temperature of the substrate is increased to a desired temperature, the substrate is rapidly cooled. Rapid cooling of the substrate is facilitated by increasing a flow rate of a gas through the chamber. Rapid cooling of the substrate is further facilitated by positioning the substrate in close proximity to a cooling plate. The cooling plate removes heat from substrate via conduction facilitated by gas located therebetween. The distance between the cooling plate and the substrate can be adjusted to create a turbulent gas flow therebetween, which further facilitates removal of heat from the substrate. After the substrate is sufficiently cooled, the substrate is removed from the chamber.

    摘要翻译: 本发明一般涉及在快速热处理期间冷却衬底的方法。 所述方法通常包括将基底定位在腔室中并向基底施加热量。 在将衬底的温度升高到所需温度之后,快速冷却衬底。 通过增加通过室的气体的流速来促进衬底的快速冷却。 通过将衬底定位在靠近冷却板的方式进一步促进衬底的快速冷却。 冷却板通过由位于其间的气体促进的传导从衬底去除热量。 可以调节冷却板和基板之间的距离以在它们之间产生湍流气流,这进一步有助于从基板去除热量。 在衬底充分冷却之后,将衬底从腔室中取出。

    Laser noise elimination in transmission thermometry

    公开(公告)号:US10421151B2

    公开(公告)日:2019-09-24

    申请号:US13789982

    申请日:2013-03-08

    摘要: Apparatus and methods for measuring the temperature of a substrate are disclosed. The apparatus includes a source of temperature-indicating radiation, a detector for the temperature-indicating radiation, and a decorrelator disposed in an optical path between the source of temperature-indicating radiation and the detector for the temperature-indicating radiation. The decorrelator may be a broadband amplifier and/or a mode scrambler. A broadband amplifier may be a broadband laser, Bragg grating, a fiber Bragg grating, a Raman amplifier, a Brillouin amplifier, or combinations thereof. The decorrelator is selected to emit radiation that is transmitted, at least in part, by the substrate being monitored. The source is matched to the decorrelator such that the emission spectrum of the source is within the gain bandwidth of the decorrelator, if the decorrelator is a gain-driven device.