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1.发明授权Epoxy resin composition for packaging a semiconductor device, method of making the same, and semiconductor device using the same 有权用于封装半导体器件的环氧树脂组合物及其制造方法以及使用其的半导体器件公开(公告)号：US07825528B2
公开(公告)日：2010-11-02
申请号：US11496449
申请日：2006-08-01
申请人： Jo Gyun Kim , Kun Bae Noh , Yoon Kok Park
发明人： Jo Gyun Kim , Kun Bae Noh , Yoon Kok Park
CPC分类号： C08G59/621 , C08K3/013 , C08L63/00 , Y10T428/31511
摘要： An epoxy resin composition, and a method of making the same, includes an epoxy resin and a curing agent, the epoxy resin composition also includes inorganic fillers, curing accelerators, and modified silicone oils. The epoxy resin is a modified epoxy resin prepared by glycidyl etherification of a mixture of a novolac type phenolic compound having a biphenyl derivative in the molecule and a 4,4′-dihydroxy biphenyl compound, and the curing agent is a mixture of a polyaromatic curing agent and a polyfunctional curing agent.
摘要翻译： 环氧树脂组合物及其制备方法包括环氧树脂和固化剂，环氧树脂组合物还包括无机填料，固化促进剂和改性硅油。 环氧树脂是通过在分子中具有联苯衍生物的酚醛清漆型酚类化合物和4,4'-二羟基联苯化合物的混合物的缩水甘油醚化制备的改性环氧树脂，并且固化剂是多芳族固化剂 试剂和多官能固化剂。
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2.发明授权Epoxy resin composition for encapsulating semiconductor device and semiconductor device using the same 有权用于封装半导体器件的环氧树脂组合物和使用其的半导体器件公开(公告)号：US09212253B2
公开(公告)日：2015-12-15
申请号：US12801851
申请日：2010-06-29
申请人： Young Kyun Lee , Eun Jung Lee , Yoon Kok Park
发明人： Young Kyun Lee , Eun Jung Lee , Yoon Kok Park
CPC分类号： C08G59/38 , C08G59/621 , C08K3/36 , C08K2201/014 , C08L63/00 , H01L2924/0002 , C08L2666/14 , H01L2924/00
摘要： An epoxy resin composition for encapsulating a semiconductor device, the epoxy resin composition including an epoxy resin, a curing agent, and one or more inorganic fillers, the one or more inorganic fillers including prismatic cristobalite, the prismatic cristobalite being present in the epoxy resin composition in an amount of about 1 to about 50% by weight, based on the total weight of the epoxy resin composition.
摘要翻译： 一种用于封装半导体器件的环氧树脂组合物，所述环氧树脂组合物包含环氧树脂，固化剂和一种或多种无机填料，所述一种或多种无机填料包括棱柱方英石，所述方形方石英存在于所述环氧树脂组合物中 的量为约1至约50重量％，基于环氧树脂组合物的总重量。
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3.发明申请Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same 有权用于半导体封装的环氧树脂组合物和使用其的半导体器件公开(公告)号：US20070213476A1
公开(公告)日：2007-09-13
申请号：US11647384
申请日：2006-12-29
申请人： Eun Jung Lee , Yoon Kok Park , Young Kyun Lee , Whan Gun Kim , Suk Ku Chang
发明人： Eun Jung Lee , Yoon Kok Park , Young Kyun Lee , Whan Gun Kim , Suk Ku Chang
IPC分类号： C08L63/00
CPC分类号： C08G59/68 , C08G59/245 , C08G59/621 , H01L23/293 , H01L2924/0002 , Y10T428/31511 , H01L2924/00
摘要： An epoxy resin composition for semiconductor encapsulation includes at least one epoxy resin, at least one curing agent, at least one filler, and at least one first curing accelerator, the first curing accelerator having a tetracyanoethylene, a 7,7,8,8-tetracyanoquinodimethane, a compound having the chemical structure of Formula 1, or a mixture thereof, wherein each of R1 through R7, independently, represents a hydrogen atom or a C1-C12 hydrocarbon group, provided that when R1 through R7 are C1-C12 hydrocarbon groups, R1 and R2, R2 and R3, R3 and R4, R4 and R5, R5 and R6, and R6 and R7 can be joined to each other to form a cyclic structure.
摘要翻译： 用于半导体封装的环氧树脂组合物包括至少一种环氧树脂，至少一种固化剂，至少一种填料和至少一种第一固化促进剂，所述第一固化促进剂具有四氰基乙烯，7,7,8,8- 四氰基醌二甲烷，具有式1的化学结构的化合物或其混合物，其中R 1至R 7中的每一个独立地表示氢原子或C < 当R 1至R 7为C 1 -C 12烷基时， R 1，R 2和R 2，R 2和R 3， R 3，R 3和R 4，R 4和R 5，R 5 R 6和R 6，R 6和R 7可以彼此连接形成环状结构。
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4.发明授权Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same 有权用于半导体封装的环氧树脂组合物和使用其的半导体器件公开(公告)号：US07667339B2
公开(公告)日：2010-02-23
申请号：US11647384
申请日：2006-12-29
申请人： Eun Jung Lee , Yoon Kok Park , Young Kyun Lee , Whan Gun Kim , Suk Ku Chang
发明人： Eun Jung Lee , Yoon Kok Park , Young Kyun Lee , Whan Gun Kim , Suk Ku Chang
CPC分类号： C08G59/68 , C08G59/245 , C08G59/621 , H01L23/293 , H01L2924/0002 , Y10T428/31511 , H01L2924/00
摘要： An epoxy resin composition for semiconductor encapsulation includes at least one epoxy resin, at least one curing agent, at least one filler, and at least one first curing accelerator, the first curing accelerator having a tetracyanoethylene, a 7,7,8,8-tetracyanoquinodimethane, a compound having the chemical structure of Formula 1, or a mixture thereof, wherein each of R1 through R7, independently, represents a hydrogen atom or a C1-C12 hydrocarbon group, provided that when R1 through R7 are C1-C12 hydrocarbon groups, R1 and R2, R2 and R3, R3 and R4, R4 and R5, R5 and R6, and R6 and R7 can be joined to each other to form a cyclic structure.
摘要翻译： 用于半导体封装的环氧树脂组合物包括至少一种环氧树脂，至少一种固化剂，至少一种填料和至少一种第一固化促进剂，所述第一固化促进剂具有四氰基乙烯，7,7,8,8- 四氰基醌二甲烷，具有式1化学结构的化合物或其混合物，其中R 1至R 7各自独立地表示氢原子或C 1 -C 12烃基，条件是当R 1至R 7为C 1 -C 12烃基时 ，R 1和R 2，R 2和R 3，R 3和R 4，R 4和R 5，R 5和R 6以及R 6和R 7可以相互结合形成环状结构。
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5.发明申请Epoxy resin composition for encapsulating semiconductor device and semiconductor device using the same 有权用于封装半导体器件的环氧树脂组合物和使用其的半导体器件公开(公告)号：US20100270664A1
公开(公告)日：2010-10-28
申请号：US12801851
申请日：2010-06-29
申请人： Young Kyun Lee , Eun Jung Lee , Yoon Kok Park
发明人： Young Kyun Lee , Eun Jung Lee , Yoon Kok Park
IPC分类号： H01L23/28 , C08L63/02 , C08L63/00 , H01L23/495 , H01L23/498 , H01L21/56
CPC分类号： C08G59/38 , C08G59/621 , C08K3/36 , C08K2201/014 , C08L63/00 , H01L2924/0002 , C08L2666/14 , H01L2924/00
摘要： An epoxy resin composition for encapsulating a semiconductor device, the epoxy resin composition including an epoxy resin, a curing agent, and one or more inorganic fillers, the one or more inorganic fillers including prismatic cristobalite, the prismatic cristobalite being present in the epoxy resin composition in an amount of about 1 to about 50% by weight, based on the total weight of the epoxy resin composition.
摘要翻译： 一种用于封装半导体器件的环氧树脂组合物，所述环氧树脂组合物包含环氧树脂，固化剂和一种或多种无机填料，所述一种或多种无机填料包括棱柱方英石，所述方形方石英存在于所述环氧树脂组合物中 的量为约1至约50重量％，基于环氧树脂组合物的总重量。
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6.发明申请公开(公告)号：US20080131702A1
公开(公告)日：2008-06-05
申请号：US11984933
申请日：2007-11-26
申请人： Kyoung Chul Bae , Jin A. Kim , Yoon Kok Park
发明人： Kyoung Chul Bae , Jin A. Kim , Yoon Kok Park
CPC分类号： C08G59/245 , C08G59/621 , H01L23/296 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48471 , H01L2224/48479 , H01L2224/73265 , H01L2924/00014 , H01L2924/1461 , H01L2924/15311 , Y10T428/31529 , H01L2924/00 , H01L2224/4554
摘要： An epoxy resin composition includes an epoxy resin, a curing agent, a coupling agent, and an inorganic filler. The coupling agent may include a hydrocarbon-substituted siloxane resin having at least one terminal hydroxy group.
摘要翻译： 环氧树脂组合物包括环氧树脂，固化剂，偶联剂和无机填料。 偶联剂可以包括具有至少一个末端羟基的烃取代的硅氧烷树脂。
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