Apparatus for controlled ablation by laser radiation
    2.
    发明授权
    Apparatus for controlled ablation by laser radiation 失效
    用于通过激光辐射控制消除的装置

    公开(公告)号:US5107516A

    公开(公告)日:1992-04-21

    申请号:US658951

    申请日:1991-02-12

    摘要: Apparatus for controlled ablation of material from a predetermined working point, comprising a first laser, in particular excimer laser, for generating laser radiation pulses having a wavelength in a wavelength range suitable for the ablation, in particular in the ultraviolet spectral range, further comprising a radiation analyzer such as a spectrometer for analysis of material-specific radiation from the ablation plume forming at the working point, and a second laser, in particular a tunable dye laser, for generating a further laser radiation in a wavelength range which is different from said first wavelength range and which is better suited for the resonant stimulation of the radiation serving for the analysis than the ablation radiation wavelength range.

    摘要翻译: 用于从预定工作点受控烧蚀材料的装置,包括第一激光器,特别是准分子激光器,用于产生具有适于消融的波长范围内的波长的激光辐射脉冲,特别是在紫外光谱范围内,还包括 辐射分析仪,例如用于分析在工作点处形成的消融羽流的材料特定辐射的光谱仪;以及第二激光器,特别是可调染料激光器,用于产生与所述激光束不同的波长范围内的另外的激光辐射 第一波长范围,并且其比消融辐射波长范围更适合于用于分析的辐射的共振刺激。