公开(公告)号：US6069540A

公开(公告)日：2000-05-30

申请号：US418341

申请日：1999-10-14

Applicant: John J. Berenz ,  George W. McIver ,  Alfred E. Lee

Inventor： John J. Berenz ,  George W. McIver ,  Alfred E. Lee

IPC: H01H59/00 ,  H01P1/12 ,  H01P1/10 ,  H01H57/00

CPC classification number: H01H59/0009 ,  H01P1/127 ,  H01H2059/0027 ,  H01H2059/0054

Abstract: An RF switch formed as a micro electro-mechanical switch (MEMS) which can be configured in an array forming a micro electro-mechanical switch array (MEMSA). The MEMS is formed on a substrate. A pin, pivotally carried by the substrate defines a pivot point. A rigid beam or transmission line is generally centrally disposed on the pin forming a teeter-totter configuration. The use of a rigid beam and the configuration eliminates the torsional and bending forces of the beam which can reduce reliability. The switch is adapted to be monolithically integrated with other monolithic microwave integrated circuits (MMIC) for example from HBTs and HEMTs, by separating such MMICs from the switch by way of a suitable polymer layer, such as polyimide, enabling the switch to be monolithically integrated with other circuitry. In order to reduce insertion losses, the beam is formed from all metal, which improves the sensitivity of the switch and also allows the switch to be used in RF switching applications. By forming the beam from all metal, the switch will have lower insertion loss than other switches which use SiO2 or mix metal contacts.

Abstract translation: RF开关形成为可以形成微机电开关阵列（MEMSA）的阵列中的微机电开关（MEMS）。 在基板上形成MEMS。 由基板枢转地承载的销定义枢轴点。 刚性梁或传输线通常居中设置在销上，形成跷跷板构型。 使用刚性梁和该构造消除了可以降低可靠性的梁的扭转和弯曲力。 该开关适于与例如HBT和HEMT的其它单片微波集成电路（MMIC）单片集成，通过诸如聚酰亚胺之类的合适的聚合物层将这种MMIC与开关分离，使得开关能够被单片集成 与其他电路。 为了减少插入损耗，光束由所有金属形成，这提高了开关的灵敏度，并且还允许开关用于RF开关应用中。 通过从所有金属形成光束，开关将具有比使用SiO 2或混合金属触点的其它开关更低的插入损耗。

公开(公告)号：US6097265A

公开(公告)日：2000-08-01

申请号：US198778

申请日：1998-11-24

Applicant: Steven S. Chan ,  Roger A. Davidheiser ,  Alfred E. Lee ,  D. Ian Stones

Inventor： Steven S. Chan ,  Roger A. Davidheiser ,  Alfred E. Lee ,  D. Ian Stones

IPC: H01P5/08 ,  H01P3/12 ,  H01P5/02 ,  H01P5/103

CPC classification number: H01P5/103

Abstract: A waveguide structure (10) that provides a transition from a polymeric waveguide (26) to a coaxial connection (48). The coaxial connection (48) includes an outer conductor (50) electrically connected to a top ground plate (36) of the waveguide (26) and an inner conductor (52) that extends into the polymeric material within the waveguide (26). The inner conductor (52) is electrically connected to a capacitive plate (56), and the capacitive plate (56) is electrically connected to an elongated conductive probe (58). The conductive probe (58) is electrically connected to a conductive post (60), which is electrically connected to a bottom ground plate (38) opposite to the top ground plate (36). The conductive probe (58) extends in a direction transverse to the propagation direction of electromagnetic waves, and acts to pick up the energy in the electromagnetic radiation. The capacitive plate (56) provides a shunt capacitance that resonates out the inductance caused by the conductive probe (58) and the inner conductor (52). The conductive probe (58) is positioned relative to a backshort surface (44) of the waveguide (26) a distance that is less than a quarter wavelength of the electromagnetic radiation of interest.

Abstract translation: 提供从聚合物波导（26）到同轴连接（48）的转变的波导结构（10）。 同轴连接（48）包括电连接到波导（26）的顶部接地板（36）的外部导体（50）和延伸到波导管（26）内的聚合材料内部的内部导体（52）。 内导体（52）电连接到电容板（56），并且电容板（56）电连接到细长的导电探针（58）。 导电探针（58）电连接到导电柱（60），导电柱（60）电连接到与顶部接地板（36）相对的底部接地板（38）。 导电探针（58）在横向于电磁波的传播方向的方向上延伸，并且用于拾取电磁辐射中的能量。 电容板（56）提供谐振电容，其使由导电探针（58）和内导体（52）引起的电感谐振。 导电探针（58）相对于波导（26）的反向旋转表面（44）定位的距离小于感兴趣的电磁辐射的四分之一波长。

公开(公告)号：US5554585A

公开(公告)日：1996-09-10

申请号：US334774

申请日：1994-11-04

Applicant: Randy W. Simon ,  Christine E. Platt ,  Alfred E. Lee ,  Gregory S. Lee

Inventor： Randy W. Simon ,  Christine E. Platt ,  Alfred E. Lee ,  Gregory S. Lee

IPC: H01L39/22 ,  C01G1/00 ,  C04B35/00 ,  C04B35/44 ,  C04B35/45 ,  H01B12/06 ,  H01L39/24 ,  H01P3/00 ,  H01P3/08 ,  H01P11/00

CPC classification number: H01L39/225 ,  H01L39/2458 ,  H01P11/003 ,  H01P3/003 ,  H01P3/08 ,  H01P3/081 ,  Y10S428/93 ,  Y10S505/701 ,  Y10S505/702 ,  Y10S505/703 ,  Y10S505/704 ,  Y10S505/856 ,  Y10S505/866 ,  Y10T428/24926

Abstract: A lanthanum aluminate (LaAlO.sub.3) substrate on which thin films of layered perovskite copper oxide superconductors are formed. Lanthanum aluminate, with a pseudo-cubic perovskite crystal structure, has a crystal structure and lattice constant that closely match the crystal structures and lattice constants of the layered perovskite superconductors. Therefore, it promotes epitaxial film growth of the superconductors, with the crystals being oriented in the proper direction for good superconductive electrical properties, such as a high critical current density. In addition, LaAlO.sub.3 has good high frequency properties, such as a low loss tangent and low dielectric constant at superconductive temperatures. Finally, lanthanum aluminate does not significantly interact with the superconductors. Lanthanum aluminate can also be used to form thin insulating films between the superconductor layers, which allows for the fabrication of a wide variety of superconductor circuit elements.

Abstract translation: 在其上形成层状钙钛矿氧化铜超导体的薄膜的铝酸镧铝（LaAlO 3）基板。 具有假立方钙钛矿晶体结构的铝酸镧具有与层状钙钛矿超导体的晶体结构和晶格常数密切匹配的晶体结构和晶格常数。 因此，它促进超导体的外延膜生长，其中晶体被定向在正确的方向上以获得良好的超导电性能，例如高临界电流密度。 此外，LaAlO3具有良好的高频特性，例如在超导温度下的低损耗正切和低介电常数。 最后，铝酸镧与超导体没有显着的相互作用。 铝酸镧还可用于在超导体层之间形成薄的绝缘膜，这允许制造各种各样的超导体电路元件。

公开(公告)号：US5523282A

公开(公告)日：1996-06-04

申请号：US233637

申请日：1988-08-18

Applicant: Randy W. Simon ,  Christine E. Platt ,  Alfred E. Lee ,  Gregory S. Lee

Inventor： Randy W. Simon ,  Christine E. Platt ,  Alfred E. Lee ,  Gregory S. Lee

IPC: H01L39/22 ,  C01G1/00 ,  C04B35/00 ,  C04B35/44 ,  C04B35/45 ,  H01B12/06 ,  H01L39/24 ,  H01P3/00 ,  H01P3/08 ,  H01P11/00 ,  B32B9/00

CPC classification number: H01L39/225 ,  H01L39/2458 ,  H01P11/003 ,  H01P3/003 ,  H01P3/08 ,  H01P3/081 ,  Y10S428/93 ,  Y10S505/701 ,  Y10S505/702 ,  Y10S505/703 ,  Y10S505/704 ,  Y10S505/856 ,  Y10S505/866 ,  Y10T428/24926

Abstract: A lanthanum aluminate (LaAlO.sub.3) substrate on which thin films of layered perovskite copper oxide superconductors are formed. Lanthanum aluminate, with a pseudo-cubic perovskite crystal structure, has a crystal structure and lattice constant that closely match the crystal structures and lattice constants of the layered perovskite superconductors. Therefore, it promotes epitaxial film growth of the superconductors, with the crystals being oriented in the proper direction for good superconductive electrical properties, such as a high critical current density. In addition, LaAlO.sub.3 has good high frequency properties, such as a low loss tangent and low dielectric constant at superconductive temperatures. Finally, lanthanum aluminate does not significantly interact with the superconductors. Lanthanum aluminate can also used to form thin insulating films between the superconductor layers, which allows for the fabrication of a wide variety of superconductor circuit elements.

Abstract translation: 在其上形成层状钙钛矿氧化铜超导体的薄膜的铝酸镧铝（LaAlO 3）基板。 具有假立方钙钛矿晶体结构的铝酸镧具有与层状钙钛矿超导体的晶体结构和晶格常数密切匹配的晶体结构和晶格常数。 因此，它促进超导体的外延膜生长，其中晶体被定向在正确的方向上以获得良好的超导电性能，例如高临界电流密度。 此外，LaAlO3具有良好的高频特性，例如在超导温度下的低损耗正切和低介电常数。 最后，铝酸镧与超导体没有显着的相互作用。 铝酸镧还可用于在超导体层之间形成薄的绝缘膜，这允许制造各种超导体电路元件。

公开(公告)号：US5987732A

公开(公告)日：1999-11-23

申请号：US137288

申请日：1998-08-20

Applicant: Alfred E. Lee ,  Roger A. Davidheiser ,  James C. Lau

Inventor： Alfred E. Lee ,  Roger A. Davidheiser ,  James C. Lau

IPC: H05K3/46 ,  H01L21/50 ,  H01L23/552 ,  H01L23/66 ,  H01L25/00 ,  H01L25/04 ,  H01L25/18 ,  H01P11/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/00

CPC classification number: H01L23/552 ,  H01L21/50 ,  H01L23/66 ,  H05K1/0219 ,  H01L2924/0002 ,  H05K1/185 ,  H05K2201/09681 ,  H05K3/0023 ,  H05K3/4644 ,  Y10T29/49016 ,  Y10T29/49126 ,  Y10T29/49165

Abstract: The invention relates to a method for producing low cost integrated microwave assemblies, where a photoresist layer is deposited onto a substrate, a portion of the photoresist is selectively removed, a first conductive layer is applied, and, a second portion of the photoresist is removed leaving isolation walls and cavities. Electrical components are placed in the cavities and a first dielectric layer fills the cavities. Vias are created in the first dielectric material exposing the electrical contacts, a second conductive layer is applied into the vias and over the first dielectric material. The second conductive layer is patterned by removing a portion of the second conductive layer creating a signal line pattern in the second conductive layer.

Abstract translation: 本发明涉及一种生产低成本集成微波组件的方法，其中将光致抗蚀剂层沉积在衬底上，选择性地去除一部分光致抗蚀剂，施加第一导电层，并且去除光致抗蚀剂的第二部分 留下隔离墙和空腔。 电气部件被放置在空腔中，并且第一介电层填充空腔。 在暴露电触点的第一电介质材料中产生通孔，第二导电层被施加到通孔中并在第一介电材料上方。 通过去除第二导电层的一部分在第二导电层中产生信号线图案来对第二导电层进行图案化。

公开(公告)号：US5523283A

公开(公告)日：1996-06-04

申请号：US255201

申请日：1994-06-23

Applicant: Randy W. Simon ,  Christine E. Platt ,  Alfred E. Lee ,  Gregory S. Lee

Inventor： Randy W. Simon ,  Christine E. Platt ,  Alfred E. Lee ,  Gregory S. Lee

IPC: H01L39/22 ,  C01G1/00 ,  C04B35/00 ,  C04B35/44 ,  C04B35/45 ,  H01B12/06 ,  H01L39/24 ,  H01P3/00 ,  H01P3/08 ,  H01P11/00 ,  B32B9/00

CPC classification number: H01L39/225 ,  H01L39/2458 ,  H01P11/003 ,  H01P3/003 ,  H01P3/08 ,  H01P3/081 ,  Y10S428/93 ,  Y10S505/701 ,  Y10S505/702 ,  Y10S505/703 ,  Y10S505/704 ,  Y10S505/856 ,  Y10S505/866 ,  Y10T428/24926

Abstract: A lanthanum aluminate ( LaAlO.sub.3) substrate on which thin films of layered perovskite copper oxide superconductors are formed. Lanthanum aluminate, with a pseudo-cubic perovskite crystal structure, has a crystal structure and lattice constant that closely match the crystal structures and lattice constants of the layered perovskite superconductors. Therefore, it promotes epitaxial film growth of the superconductors, with the crystals being oriented in the proper direction for good superconductive electrical properties, such as a high critical current density. In addition, LaAlO.sub.3 has good high frequency properties, such as a low loss tangent and low dielectric constant at superconductive temperatures. Finally, lanthanum aluminate does not significantly interact with the superconductors. Lanthanum aluminate can also used to form thin insulating films between the superconductor layers, which allows for the fabrication of a wide variety of superconductor circuit elements.

Abstract translation: 在其上形成层状钙钛矿氧化铜超导体的薄膜的铝酸镧铝（LaAlO 3）基板。 具有假立方钙钛矿晶体结构的铝酸镧具有与层状钙钛矿超导体的晶体结构和晶格常数密切匹配的晶体结构和晶格常数。 因此，它促进超导体的外延膜生长，其中晶体被定向在正确的方向上以获得良好的超导电性能，例如高临界电流密度。 此外，LaAlO3具有良好的高频特性，例如在超导温度下的低损耗正切和低介电常数。 最后，铝酸镧与超导体没有显着的相互作用。 铝酸镧还可用于在超导体层之间形成薄的绝缘膜，这允许制造各种超导体电路元件。

公开(公告)号：US20090179791A1

公开(公告)日：2009-07-16

申请号：US11491685

申请日：2006-07-24

Applicant: David Kalian ,  Thomas F. Klein, III ,  Paul J. Tatomir ,  Alfred E. Lee

Inventor： David Kalian ,  Thomas F. Klein, III ,  Paul J. Tatomir ,  Alfred E. Lee

IPC: H01Q3/00

CPC classification number: H01Q3/26 ,  H01Q21/0006 ,  H01Q21/064

Abstract: Systems and methods are disclosed herein to provide improved phased array antenna system. For example, in accordance with an embodiment of the present invention, a phased array antenna system includes a plurality of horn/filter assemblies. A plurality of modules are adapted to provide RF signals to the horn/filter assemblies. Each of the horn/filter assemblies is mounted on a top surface of a corresponding one of the modules. A thermal system is adapted to cool the modules. The modules are mounted on a first surface of the thermal system. A plurality of distribution boards associated with the modules are mounted on a second surface of the thermal system. A plurality of interconnects associated with the modules are adapted to connect the modules with the distribution boards through the thermal system.

Abstract translation: 本文公开了系统和方法以提供改进的相控阵天线系统。 例如，根据本发明的实施例，相控阵天线系统包括多个喇叭/滤波器组件。 多个模块适于向喇叭/滤波器组件提供RF信号。 每个喇叭/滤波器组件安装在相应的一个模块的顶表面上。 热系统适用于冷却模块。 模块安装在热系统的第一表面上。 与模块相关联的多个分配板安装在热系统的第二表面上。 与模块相关联的多个互连适于通过热系统将模块与配电板连接。

公开(公告)号：US07551136B1

公开(公告)日：2009-06-23

申请号：US11491685

申请日：2006-07-24

Applicant: David Kalian ,  Thomas F. Klein, III ,  Paul J. Tatomir ,  Alfred E. Lee

Inventor： David Kalian ,  Thomas F. Klein, III ,  Paul J. Tatomir ,  Alfred E. Lee

IPC: H01Q3/00

CPC classification number: H01Q3/26 ,  H01Q21/0006 ,  H01Q21/064

Abstract: Systems and methods are disclosed herein to provide improved phased array antenna system. For example, in accordance with an embodiment of the present invention, a phased array antenna system includes a plurality of horn/filter assemblies. A plurality of modules are adapted to provide RF signals to the horn/filter assemblies. Each of the horn/filter assemblies is mounted on a top surface of a corresponding one of the modules. A thermal system is adapted to cool the modules. The modules are mounted on a first surface of the thermal system. A plurality of distribution boards associated with the modules are mounted on a second surface of the thermal system. A plurality of interconnects associated with the modules are adapted to connect the modules with the distribution boards through the thermal system.

Abstract translation: 本文公开了系统和方法以提供改进的相控阵天线系统。 例如，根据本发明的实施例，相控阵天线系统包括多个喇叭/滤波器组件。 多个模块适于向喇叭/滤波器组件提供RF信号。 每个喇叭/滤波器组件安装在相应的一个模块的顶表面上。 热系统适用于冷却模块。 模块安装在热系统的第一表面上。 与模块相关联的多个分配板安装在热系统的第二表面上。 与模块相关联的多个互连适于通过热系统将模块与配电板连接。

公开(公告)号：US06242984B1

公开(公告)日：2001-06-05

申请号：US09080422

申请日：1998-05-18

Applicant: David I. Stones ,  Alfred E. Lee

Inventor： David I. Stones ,  Alfred E. Lee

IPC: H03F368

CPC classification number: H01P5/107 ,  H01P5/12

Abstract: An SSPA module in accordance with the present invention comprises a signal input (102), and a radial splitter (100) connected to the signal input (102) comprising a plurality of radially extending splitter waveguides 104, 106, 108, 110, 112, 114, 116, 118, 120, 122, 124, 126. The SSPA module also includes a signal output (202), and a radial combiner (200) connected to the signal output (202) comprising a plurality of radially extending combiner waveguides 204, 206, 208, 210, 212, 214, 216, 218, 220, 222, 224, 226. Connections between the splitter (100) and combiner (200) are provided by a plurality of vertically extending waveguides 404, 406, 408, 410, 412, 414, 416, 418, 420, 422, 424, 426. The SSPA module also includes a plurality of processing circuits 304, 308, 308, 310, 312, 314, 316, 318, 320, 322, 324, 326, for example MMIC amplifiers, connected to the combiner waveguides 204, 206, 208, 210, 212, 214, 216, 218, 220, 222, 224, 226. A waveguide to microstrip transition (510) may also be used to connect signals propagating in the waveguides to and from microstrip lines connected to the processing circuitry (304-326). Generally, the transition (510) includes a waveguide section (512) with a top conducting layer (516) that defines a first slit (526) and a second slit (528) bounding a transition area (530) abutting a microstrip section (514) to form a waveguide to microstrip transition.

Abstract translation: 根据本发明的SSPA模块包括信号输入端（102）和连接到信号输入端（102）的径向分路器（100），包括多个径向延伸的分路波导104,106,108,110,112， SSPA模块还包括信号输出（202）和连接到信号输出（202）的径向组合器（200），包括多个径向延伸的组合器波导204 ，分配器（100）和组合器（200）之间的连接由多个垂直延伸的波导404,406,408,260,226,216,218,220,222， 所述SSPA模块还包括多个处理电路304,308,308,310,312,314,316,318,320,322,324,412,412,414,416,418,420,422,424,426。 326，例如连接到组合器波导204,206,208,210,212,214,216,218,220,222,224,226的MMIC放大器。波导到微带过渡（510）可以是 还用于将波导中传播的信号连接到连接到处理电路的微带线路（304-326）。 通常，过渡（510）包括波导部分（512），其具有限定第一狭缝（526）的顶部导电层（516）和限定邻近微带部分（514）的过渡区域（530）的第二狭缝（528） ）以形成波导到微带过渡。

公开(公告)号：US08463324B1

公开(公告)日：2013-06-11

申请号：US12641764

申请日：2009-12-18

Applicant: Brian K. Kormanyos ,  Jeremy Popp ,  Timothy T. Lee ,  Alfred E. Lee ,  Gregory A. Kromholtz

Inventor： Brian K. Kormanyos ,  Jeremy Popp ,  Timothy T. Lee ,  Alfred E. Lee ,  Gregory A. Kromholtz

IPC: H04B1/38

CPC classification number: H01Q1/523 ,  H01Q5/42 ,  H01Q21/062 ,  H01Q21/24 ,  H01Q23/00

Abstract: An antenna and power amplifier element assembly may include an antenna assembly and a quasi-optic power amplifier. The quasi-optic power amplifier may include an output transistor coupled to the antenna assembly. A harmonic trap may be coupled to the quasi-optic power amplifier.

Abstract translation: 天线和功率放大器元件组件可以包括天线组件和准光功率放大器。 准光功率放大器可以包括耦合到天线组件的输出晶体管。 谐波陷波器可以耦合到准光功率放大器。