-
公开(公告)号：US6143820A
公开(公告)日：2000-11-07
申请号：US216209
申请日：1998-12-18
申请人： John Klier , Thomas H. Kalantar , Christopher J. Tucker , Erin D. O'Driscoll , Andrew T. Graham
发明人： John Klier , Thomas H. Kalantar , Christopher J. Tucker , Erin D. O'Driscoll , Andrew T. Graham
CPC分类号： C08F8/50 , C08F2810/10
摘要： A water-soluble polymer having a low polydispersity index and controlled molecular weight can be prepared by oxidative degradation and shearing of a water-swellable crosslinked polymer or by hydrolysis of the crosslinked polymer to a high molecular weight soluble polymer, followed by oxidative degradation of the high molecular weight polymer.
摘要翻译： 具有低多分散性指数和受控分子量的水溶性聚合物可以通过氧化降解和剪切水溶胀性交联聚合物或通过将交联聚合物水解成高分子量可溶性聚合物，然后氧化降解 高分子量聚合物。
-
2.发明授权公开(公告)号：US06759550B1
公开(公告)日：2004-07-06
申请号：US10149554
申请日：2002-11-13
申请人： John Klier , Christopher J. Tucker , Thomas H. Kalantar , Kenneth A. Burdett , Daniel Patrick Green , Luciano Piras , Sergio Schena , Guo-shuh John Lee
发明人： John Klier , Christopher J. Tucker , Thomas H. Kalantar , Kenneth A. Burdett , Daniel Patrick Green , Luciano Piras , Sergio Schena , Guo-shuh John Lee
IPC分类号： C07C5116
摘要： The present invention pertains to an improved method of oxidizing substituted aromatic compounds (such as p xylene) to their corresponding aromatic acids (such as terephthalic acid). The improvement involves carrying out the oxidation reaction in an aqueous medium, wherein the aqueous medium contains at least 30 percent water, preferably up to 30 percent surfactant and preferably a low molecular weight material containing a hydrophilic end group as a co-surfactant. The reaction is carried out at a pH of less than 3.0.
摘要翻译： 本发明涉及将取代的芳族化合物（例如对二甲苯）氧化成其相应的芳族酸（例如对苯二甲酸）的改进方法。 改进包括在水性介质中进行氧化反应，其中水性介质含有至少30％的水，优选至多30％的表面活性剂，优选含有亲水端基作为辅助表面活性剂的低分子量材料。 该反应在小于3.0的pH下进行。
-
公开(公告)号：US20140127309A1
公开(公告)日：2014-05-08
申请号：US14122437
申请日：2012-05-31
CPC分类号： C12N11/04 , A01N25/28 , A61K8/11 , A61K9/5031 , A61K2800/10 , A61Q19/00 , B01J13/06 , B01J13/16 , B01J13/18 , B01J13/185
摘要： The present invention meets one or more of the above needs and is a composition comprising plurality of capsules wherein the capsules comprise: a core of one or more highly polar liquids; one or more polar active materials dissolved in or dispersed in one or more highly polar liquids; a mixture of one or more polymers and one of more highly polar liquids; or a mixture of one or more polymers, one or more highly polar liquids and one or more polar active materials, and a shell comprising, particles in a polymer matrix or particles; wherein the thickness of the shell is sufficient to prevent passage of the highly polar liquid or the active material through the shell or to control the rate passage of the highly polar liquid or the active material through the shell with the proviso that the one or more polymers may be located in the core, in the polymer matrix of the shell or both.
摘要翻译： 本发明满足上述一个或多个需求，并且是包含多个胶囊的组合物，其中胶囊包含：一种或多种高极性液体的芯; 一种或多种溶于或分散在一种或多种高极性液体中的极性活性物质; 一种或多种聚合物和更高极性液体之一的混合物; 或一种或多种聚合物，一种或多种高极性液体和一种或多种极性活性物质的混合物，以及包含聚合物基质或颗粒中的颗粒的壳; 其中壳体的厚度足以防止高极性液体或活性物质通过壳体，或者控制高极性液体或活性材料通过壳体的速率通过，条件是一种或多种聚合物 可以位于核心中，在壳的聚合物基质中或两者中。
-
4.发明授权Stable, concentratable, water soluble cellulose free chemical mechanical polishing composition 有权稳定，浓缩，水溶性纤维素自由化学机械抛光组合物公开(公告)号：US08440097B2
公开(公告)日：2013-05-14
申请号：US13039705
申请日：2011-03-03
申请人： Hamed Lakrout , Jinjie Shi , Joseph Letizia , Xu Li , Thomas H. Kalantar , Francis Kelley , J. Keith Harris , Christopher J. Tucker
发明人： Hamed Lakrout , Jinjie Shi , Joseph Letizia , Xu Li , Thomas H. Kalantar , Francis Kelley , J. Keith Harris , Christopher J. Tucker
IPC分类号： C09K13/00
CPC分类号： H01L21/3212 , C09G1/16
摘要： A chemical mechanical polishing composition useful for chemical mechanical polishing a semiconductor wafer containing an interconnect metal is provided, comprising, as initial components: water; an azole inhibitor; an alkali metal organic surfactant; a hydrotrope; a phosphorus containing agent; optionally, a non-saccharide water soluble polymer; optionally, a water soluble acid compound of formula I, wherein R is selected from a hydrogen and a C1-5 alkyl group, and wherein x is 1 or 2; optionally, a complexing agent; optionally, an oxidizer; optionally, an organic solvent; and, optionally, an abrasive. Also, provided is a method for making a chemical mechanical polishing composition of the present invention and a method for chemical mechanical polishing of a substrate, comprising: providing a substrate, wherein the substrate is a semiconductor wafer having copper interconnects; providing a chemical mechanical polishing composition of the present invention; providing a chemical mechanical polishing pad; creating dynamic contact at an interface between the chemical mechanical polishing pad and the substrate with a down force of 0.69 to 34.5 kPa; and, dispensing the chemical mechanical polishing composition onto the chemical mechanical polishing pad at or near the interface between the chemical mechanical polishing pad and the substrate; wherein the chemical mechanical polishing composition exhibits a pH adjusted to a pH of 2 to 6 through the addition of at least one of phosphoric acid, magnesium hydroxide and lithium hydroxide.
摘要翻译： 提供了用于化学机械抛光含有互连金属的半导体晶片的化学机械抛光组合物，包括作为初始组分的水; 唑类抑制剂; 碱金属有机表面活性剂; 水溶助长剂 含磷剂; 任选地，非糖水溶性聚合物; 任选地，式I的水溶性酸化合物，其中R选自氢和C 1-5烷基，并且其中x是1或2; 任选地，络合剂; 任选的氧化剂; 任选的有机溶剂; 和任选的研磨剂。 此外，提供了制造本发明的化学机械抛光组合物的方法和基板的化学机械抛光方法，包括：提供基板，其中所述基板是具有铜互连的半导体晶片; 提供本发明的化学机械抛光组合物; 提供化学机械抛光垫; 在化学机械抛光垫和基板之间的界面处以0.69至34.5kPa的向下力产生动态接触; 并且将化学机械抛光组合物分配到化学机械抛光垫或化学机械抛光垫与基底之间界面附近的化学机械抛光垫上; 其中所述化学机械抛光组合物通过加入磷酸，氢氧化镁和氢氧化锂中的至少一种而显示pH调节至2至6的pH。
-
5.发明申请Stable, concentratable, water soluble cellulose free chemical mechanical polishing composition 有权稳定，浓缩，水溶性纤维素自由化学机械抛光组合物公开(公告)号：US20120225556A1
公开(公告)日：2012-09-06
申请号：US13039705
申请日：2011-03-03
申请人： Hamed Lakrout , Jinjie Shi , Joseph Letizia , Xu Li , Thomas H. Kalantar , Francis Kelley , J. Keith Harris , Christopher J. Tucker
发明人： Hamed Lakrout , Jinjie Shi , Joseph Letizia , Xu Li , Thomas H. Kalantar , Francis Kelley , J. Keith Harris , Christopher J. Tucker
IPC分类号： H01L21/306 , C09K3/14 , C09K13/00
CPC分类号： H01L21/3212 , C09G1/16
摘要： A chemical mechanical polishing composition useful for chemical mechanical polishing a semiconductor wafer containing an interconnect metal is provided, comprising, as initial components: water; an azole inhibitor; an alkali metal organic surfactant; a hydrotrope; a phosphorus containing agent; optionally, a non-saccharide water soluble polymer; optionally, a water soluble acid compound of formula I, wherein R is selected from a hydrogen and a C1-5 alkyl group, and wherein x is 1 or 2; optionally, a complexing agent; optionally, an oxidizer; optionally, an organic solvent; and, optionally, an abrasive. Also, provided is a method for making a chemical mechanical polishing composition of the present invention and a method for chemical mechanical polishing of a substrate, comprising: providing a substrate, wherein the substrate is a semiconductor wafer having copper interconnects; providing a chemical mechanical polishing composition of the present invention; providing a chemical mechanical polishing pad; creating dynamic contact at an interface between the chemical mechanical polishing pad and the substrate with a down force of 0.69 to 34.5 kPa; and, dispensing the chemical mechanical polishing composition onto the chemical mechanical polishing pad at or near the interface between the chemical mechanical polishing pad and the substrate; wherein the chemical mechanical polishing composition exhibits a pH adjusted to a pH of 2 to 6 through the addition of at least one of phosphoric acid, magnesium hydroxide and lithium hydroxide.
摘要翻译： 提供了用于化学机械抛光含有互连金属的半导体晶片的化学机械抛光组合物，包括作为初始组分的水; 唑类抑制剂; 碱金属有机表面活性剂; 水溶助长剂 含磷剂; 任选地，非糖水溶性聚合物; 任选地，式I的水溶性酸化合物，其中R选自氢和C 1-5烷基，并且其中x是1或2; 任选地，络合剂; 任选地，氧化剂; 任选的有机溶剂; 和任选的研磨剂。 此外，提供了制造本发明的化学机械抛光组合物的方法和基板的化学机械抛光方法，包括：提供基板，其中所述基板是具有铜互连的半导体晶片; 提供本发明的化学机械抛光组合物; 提供化学机械抛光垫; 在化学机械抛光垫和基板之间的界面处以0.69至34.5kPa的向下力产生动态接触; 并且将化学机械抛光组合物分配到化学机械抛光垫或化学机械抛光垫与基底之间界面附近的化学机械抛光垫上; 其中所述化学机械抛光组合物通过加入磷酸，氢氧化镁和氢氧化锂中的至少一种而显示pH调节至2至6的pH。
-
6.发明申请Stable, concentratable chemical mechanical polishing composition and methods relating thereto 有权稳定，可浓缩的化学机械抛光组合物及其相关方法公开(公告)号：US20120225555A1
公开(公告)日：2012-09-06
申请号：US13039723
申请日：2011-03-03
申请人： Hamed Lakrout , Jinjie Shi , Joseph Letizia , Xu Li , Thomas H. Kalantar , Francis Kelley , J. Keith Harris , Christopher J. Tucker
发明人： Hamed Lakrout , Jinjie Shi , Joseph Letizia , Xu Li , Thomas H. Kalantar , Francis Kelley , J. Keith Harris , Christopher J. Tucker
IPC分类号： H01L21/306 , C09K13/00
CPC分类号： H01L21/3212 , C09G1/16
摘要： A chemical mechanical polishing composition useful for chemical mechanical polishing a semiconductor wafer containing an interconnect metal is provided, comprising, as initial components: water; an azole inhibitor; an alkali metal organic surfactant; a hydrotrope; a phosphorus containing agent; a water soluble cellulose; optionally, a non-saccharide water soluble polymer; optionally, a water soluble acid compound of formula I, wherein R is selected from a hydrogen and a C1-5 alkyl group, and wherein x is 1 or 2; optionally, a complexing agent; optionally, an oxidizer; optionally, an organic solvent; and, optionally, an abrasive. Also, provided is a method of preparing a chemical mechanical polishing composition of the present invention and a method for chemical mechanical polishing of a substrate, comprising: providing a substrate, wherein the substrate is a semiconductor wafer having copper interconnects; providing a chemical mechanical polishing composition of the present invention; providing a chemical mechanical polishing pad; creating dynamic contact at an interface between the chemical mechanical polishing pad and the substrate with a down force of 0.69 to 34.5 kPa; and, dispensing the chemical mechanical polishing composition onto the chemical mechanical polishing pad at or near the interface between the chemical mechanical polishing pad and the substrate; wherein the chemical mechanical polishing composition exhibits a pH adjusted to a pH of 2 to 6 through the addition of at least one of phosphoric acid, magnesium hydroxide and lithium hydroxide.
摘要翻译： 提供了用于化学机械抛光含有互连金属的半导体晶片的化学机械抛光组合物，包括作为初始组分的水; 唑类抑制剂; 碱金属有机表面活性剂; 水溶助长剂 含磷剂; 水溶性纤维素; 任选地，非糖水溶性聚合物; 任选地，式I的水溶性酸化合物，其中R选自氢和C 1-5烷基，并且其中x是1或2; 任选地，络合剂; 任选地，氧化剂; 任选的有机溶剂; 和任选的研磨剂。 此外，提供了制备本发明的化学机械抛光组合物的方法和基材的化学机械抛光方法，包括：提供基材，其中所述基材是具有铜互连的半导体晶片; 提供本发明的化学机械抛光组合物; 提供化学机械抛光垫; 在化学机械抛光垫和基板之间的界面处以0.69至34.5kPa的向下力产生动态接触; 并且将化学机械抛光组合物分配到化学机械抛光垫或化学机械抛光垫与基底之间界面附近的化学机械抛光垫上; 其中所述化学机械抛光组合物通过加入磷酸，氢氧化镁和氢氧化锂中的至少一种而显示pH调节至2至6的pH。
-
7.发明授权Stable, concentratable chemical mechanical polishing composition and methods relating thereto 有权稳定，可浓缩的化学机械抛光组合物及其相关方法公开(公告)号：US08435896B2
公开(公告)日：2013-05-07
申请号：US13039723
申请日：2011-03-03
申请人： Hamed Lakrout , Jinjie Shi , Joseph Letizia , Xu Li , Thomas H. Kalantar , Francis Kelley , J. Keith Harris , Christopher J. Tucker
发明人： Hamed Lakrout , Jinjie Shi , Joseph Letizia , Xu Li , Thomas H. Kalantar , Francis Kelley , J. Keith Harris , Christopher J. Tucker
IPC分类号： H01L21/302 , H01L21/461
CPC分类号： H01L21/3212 , C09G1/16
摘要： A chemical mechanical polishing composition useful for chemical mechanical polishing a semiconductor wafer containing an interconnect metal is provided, comprising, as initial components: water; an azole inhibitor; an alkali metal organic surfactant; a hydrotrope; a phosphorus containing agent; a water soluble cellulose; optionally, a non-saccharide water soluble polymer; optionally, a water soluble acid compound of formula I, wherein R is selected from a hydrogen and a C1-5 alkyl group, and wherein x is 1 or 2; optionally, a complexing agent; optionally, an oxidizer; optionally, an organic solvent; and, optionally, an abrasive. Also, provided is a method of preparing a chemical mechanical polishing composition of the present invention and a method for chemical mechanical polishing of a substrate, comprising: providing a substrate, wherein the substrate is a semiconductor wafer having copper interconnects; providing a chemical mechanical polishing composition of the present invention; providing a chemical mechanical polishing pad; creating dynamic contact at an interface between the chemical mechanical polishing pad and the substrate with a down force of 0.69 to 34.5 kPa; and, dispensing the chemical mechanical polishing composition onto the chemical mechanical polishing pad at or near the interface between the chemical mechanical polishing pad and the substrate; wherein the chemical mechanical polishing composition exhibits a pH adjusted to a pH of 2 to 6 through the addition of at least one of phosphoric acid, magnesium hydroxide and lithium hydroxide.
摘要翻译： 提供了用于化学机械抛光含有互连金属的半导体晶片的化学机械抛光组合物，包括作为初始组分的水; 唑类抑制剂; 碱金属有机表面活性剂; 水溶助长剂 含磷剂; 水溶性纤维素; 任选地，非糖水溶性聚合物; 任选地，式I的水溶性酸化合物，其中R选自氢和C 1-5烷基，并且其中x是1或2; 任选地，络合剂; 任选地，氧化剂; 任选的有机溶剂; 和任选的研磨剂。 此外，提供了制备本发明的化学机械抛光组合物的方法和基材的化学机械抛光方法，包括：提供基材，其中所述基材是具有铜互连的半导体晶片; 提供本发明的化学机械抛光组合物; 提供化学机械抛光垫; 在化学机械抛光垫和基板之间的界面处以0.69至34.5kPa的向下力产生动态接触; 并且将化学机械抛光组合物分配到化学机械抛光垫或化学机械抛光垫与基底之间界面附近的化学机械抛光垫上; 其中所述化学机械抛光组合物通过加入磷酸，氢氧化镁和氢氧化锂中的至少一种而显示pH调节至2至6的pH。
-
公开(公告)号：US06835783B1
公开(公告)日：2004-12-28
申请号：US09913621
申请日：2001-08-15
申请人： Herbert A. Gartner , Steven W. Mork , Heike Herr , Reed A. Shick , John Klier , Christopher J. Tucker
发明人： Herbert A. Gartner , Steven W. Mork , Heike Herr , Reed A. Shick , John Klier , Christopher J. Tucker
IPC分类号： A61L1524
摘要： The present invention refers to a high internal phase polyclectrolyte emulsions which are useful for the manufacture of superabsorbent polymers having two phases: i) a continuous oil phase and the ii) a dispersed aqueous phase containing the aqueous monomer solution prior to polymerization and the polyelectrolyte in water-soluble, or water-swellable or very slightly crosslinked form after polymerization, wherein the polymerization occurs in the dispersed aqueous phase and wherein the dispersed aqueous phase contains a high concentration of polyclectrolyte. The present invention also refers to a process for preparing such emulsions and for inverting these emulsions so as to form films or other patterns of the superabsorbent polymer. Absorbent structures containing SAP films or other patterns prepared by the present invention are also contemplated.
摘要翻译： 本发明涉及一种高内相聚电解质乳液，其可用于制造具有两相的超吸收聚合物：i）连续油相和ii）在聚合之前含有单体水溶液的分散水相和聚合电解质 水溶性或水溶胀性或非常轻微交联的形式，其中聚合发生在分散的水相中，并且其中分散的水相含有高浓度的聚电解质。 本发明还涉及一种制备这种乳液并反转这些乳液以形成超吸收性聚合物的膜或其它图案的方法。 也考虑了含有SAP薄膜或本发明制备的其它图案的吸收结构。
-
公开(公告)号：US6051742A
公开(公告)日：2000-04-18
申请号：US211284
申请日：1998-12-14
IPC分类号： C07D301/24 , C07C29/66 , C07C31/36 , C07D303/04
CPC分类号： C07C29/66
摘要： A process for hypochlorinating unsaturated alpha-olefins to produce chlorohydrins which comprises forming a microemulsion of water and an unsaturated alpha-olefin and then adding an oxidant to the microemulsion under conditions sufficient to form the chlorohydrins. The microemulsion is formed by adding a non-nucleophilic surfactant and, optionally, a co-surfactant, to the mixture of water and unsaturated alpha-olefin.
摘要翻译： 一种用于低级不饱和α-烯烃以生产氯代醇的方法，其包括形成水和不饱和α-烯烃的微乳液，然后在足以形成氯代醇的条件下向微乳液中加入氧化剂。 通过向水和不饱和α-烯烃的混合物中加入非亲核表面活性剂和任选的助表面活性剂形成微乳液。
-
10.发明授权High water content, low viscosity, oil continuous microemulsions and emulsions, and their use in cleaning applications 失效高含水量，低粘度，油连续微乳液和乳液，以及它们在清洁应用中的应用
公开(公告)号：US5811383A
公开(公告)日：1998-09-22
申请号：US790254
申请日：1997-01-27
CPC分类号： C11D3/43 , C11D11/0029 , C11D17/0021 , C23G5/06 , H05K3/26
摘要： Superior high water containing oil continuous microemulsions and emulsions for cleaning contain defined amounts of water, one or more ionic surfactants, and one or more organic solvents so that the compositions have a low conductivity and low viscosity.
摘要翻译： 含有油的高级含水连续微乳液和用于清洁的乳液含有限定量的水，一种或多种离子表面活性剂和一种或多种有机溶剂，使得组合物具有低导电性和低粘度。
-
-
-
-
-
-
-
-
-
搜索结果
36 条记录 (耗时 0.033 秒)
